产品规格书 SPECIFICATION

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDF408AT SMD-3
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2008-8-14
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子股份有限公司
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 1 of 8
SAW FILTER
HDF408AT
SMD-3
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Page 2 of 8
SAW FILTER
HDF408AT
SMD-3
1. SCOPE
This specification shall cover the characteristics of SAW filter With F408AT used for the page
system.
2. ELECTRICAL SPECIFICATION
AC Voltage Vpp
Operation temperature
Storage temperature
RF Power Dissipation
10V50Hz/60Hz
-20℃ to +60℃
-45℃ to +85℃
27dBm
Electronic Characteristics
2-1.Typical frequency response
2-2.Electrical characteristics
Part number
Nominal center frequency (Fo)
Insertion Loss(406.0~410.0MHz)
0~390MHz
440MHz~1700MHz
1700MHz~2500MHz
413MHz
416.0MHz ~420.0MHz
Ripple (in passband)
VSWR
Input/Output Impedance(Nominal)
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F408AT
408
3.5max
20min
20min
18min
12min
35min
1.0max
2.0max
50//0
E-mail:[email protected]
Unit
MHz
dB
dB
dB
dB
dB
dB
dB
Ω/pF
Page 3 of 8
SAW FILTER
HDF408AT
SMD-3
3. TEST CIRCUIT
4. DIMENSION
1.Ground
2.Input/output
3.Ground
4.Ground
5.Ground
6.Input/output
7.Ground
8.Ground
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.
5-2 Low temperature exposure
Subject the device to -20℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +80℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in table 1.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
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Page 4 of 8
SAW FILTER
HDF408AT
SMD-3
meet the specifications in table 1.
5-5 Solderability
Subject the device terminals into the solder bath at 245℃±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
table 1.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in table 1.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in table 1.
5-8 Lead fatigue
5-8-1 Pulling test
Weight along with the direction of lead without an shock 1kg. The device shall satisfy all the
initial Characteristics.
5-8-2 Bending test
Lead shall be subject to withstand against 90℃ bending with 450g weight in the direction
of thickness. This operation shall be done toward both direction. The device shall show no
evidence of damage and shall satisfy all the initial electrical characteristics.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and storage.
7.2 Reeling Quantity
1000 pcs/reel 7’’
3000 pcs/reel 13’’
7.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below.
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Page 5 of 8
SAW FILTER
HDF408AT
SMD-3
(2) Label
Device Name
User Product Name
Quantity
Lot No.
(3) Leader part and vacant position specifications.
8. TAPE SPECIFICATIONS
8.1 Tensile Strength of Carrier Tape: 4.4N/mm width
8.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15º
(2) speed: 300mm/min.
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Page 6 of 8
SAW FILTER
HDF408AT
SMD-3
(3) force: 20~70g
[Figure 1] Carrier Tape Dimensions
[Unit:mm]
W
F
E
P0
P1
P2
D0
D1
t1
t2
A
B
12.0
±0.3
5.5
±0.05
1.75
±0.1
4.0
±0.1
8.0
±0.1
2.0
±0.05
Ø1.5
±0.1
Ø1.0
±0.25
0.3
±0.05
2.10
±0.1
6.40
±0.1
5.20
±0.1
[Figure 2]
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Page 7 of 8
SAW FILTER
HDF408AT
SMD-3
[Unit:mm]
A
B
C
D
E
W
t
r
Ø330
±1.0
Ø100
±0.5
Ø13
±0.5
Ø21
±0.8
2
±0.5
13
±0.3
3
max.
1.0
max.
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Page 8 of 8