Atmel 42192 Wireless ZigBit ATZB RF 233 1 C Datasheet

ZIGBIT 2.4GHZ WIRELESS MODULES
ATZB-RF-233-1-C
DATASHEET
Features
•
•
•
•
•
•
•
Ultra Compact size (25.0 x 20.0mm)
Built In Front End Module to boost Output power upto +20dBm with Integrated
LNA for increased Sensitivity
MCU less Tranceiver module with SPI interface
High RX sensitivity (-104dBm)
Outperforming link budget (up to +124dB)
Up to +20.5dBm output power
Very low power consumption:
• 7.5mA in RX mode (1)
• 157mA in TX mode (1)
• 0.7µA in sleep mode(2)
•
•
•
•
•
•
•
•
•
•
•
•
Internal Clock Output
Preassigned Atmel® MAC address that can be used on end product
Capability to use MAC address into the onboard EEPROM
IEEE® 802.15.4 compliant Transceiver
2.4GHz ISM band
Rapid design-in with built-in Chip Antenna
RF Test point using MS-147 RF connector
Small physical footprint and low profile for optimum fit in very small application
boards
Mesh networking capability
Easy-to-use low cost development kit
Single source of support for HW and SW
Worldwide license-free operation
Note:
1. MCU is in active state with 3V Supply, CPU clock @ 16MHz, RX RPC enabled (for RX current),
PHY_TX_PWR=0x0 (for TX current), All digital outputs pulled high.
Note:
2. Controller Sleep Mode – SLEEP_MODE_PWR_DOWN
42192A−WIRELESS−11/2013
Table of Contents
1. Introduction ........................................................................................ 3
1.1
1.2
1.3
1.4
Summary ........................................................................................................... 3
Applications ....................................................................................................... 3
Abbreviations and Acronyms ............................................................................ 3
Related Documents........................................................................................... 5
2. ZigBit Module Overview ..................................................................... 6
2.1
Overview ........................................................................................................... 6
3. Specification....................................................................................... 8
3.1
3.2
3.3
3.4
3.5
3.6
3.7
Electrical Characteristics ................................................................................... 8
3.1.1
Absolute Maximum Ratings ................................................................ 8
3.1.2
Power Supply...................................................................................... 8
3.1.3
RF Characteristics .............................................................................. 9
Physical/Environmental Characteristics and Outline ....................................... 10
Pin Configuration............................................................................................. 10
Antenna Orientation Recommendation ........................................................... 11
Mounting Information ...................................................................................... 11
Soldering Profile .............................................................................................. 14
Antenna Reference Designs ........................................................................... 14
4. Schematics ...................................................................................... 14
4.1
4.2
Handling Instructions....................................................................................... 15
General Recommendations ............................................................................ 15
5. Ordering Information ........................................................................ 15
6. Agency Certifications ....................................................................... 16
6.1
6.2
6.3
United States (FCC) ........................................................................................ 16
European Union (ETSI) ................................................................................... 16
Canada (IC) .................................................................................................... 17
7. Revision History ............................................................................... 18
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
2
1.
Introduction
1.1
Summary
ATZB-RF-233-1-C ZigBit® is an ultra-compact and low-power 2.4GHz IEEE 802.15.4/ZigBee® OEM module from Atmel
with a Built in RF Front End Module (FEM) that has an integrated Power amplifier and Low noise amplifier. This helps
the ZigBit reach a very high Link budget of upto +124dB. Based on the innovative mixed-signal hardware platform from
Atmel, this module uses the AT86RF233 [4] /2.4GHz ISM band Transceiver with the FEM on a very compact Module
design that provides the customer to integrate the module to any of the recommended Atmel’s Microcontrollers that the
application fits. The radio transceiver provides high data rates from 250kb/s up to 2Mb/s, frame handling, outstanding
receiver sensitivity and high transmit output power enabling a very robust wireless communication. The module is
designed for wireless sensing, monitoring, control, data acquisition applications, to name a few. This ZigBit module
eliminates the need for costly and time-consuming RF development, and shortens time-to-market for wireless
applications.
The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed
and tuned for the ZigBit design to enable quick integration of the ZigBit into any application.
1.2
Applications
The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing
mesh network, while optimizing network traffic and minimizing power consumption.
For detailed Software support information, please visit www.atmel.com/wireless
The applications include, but are not limited to:
•
•
•
•
•
•
•
•
1.3
Building automation & monitoring
o Lighting controls
o Wireless smoke- and CO-detectors
o Structural integrity monitoring
HVAC monitoring & control
Inventory management
Environmental monitoring
Security
Water metering
Industrial monitoring
o Machinery condition and performance monitoring
o Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc.
Automated meter reading (AMR)
Abbreviations and Acronyms
ADC
Analog-to-Digital Converter
API
Application Programming Interface
DC
Direct Current
DTR
Data Terminal Ready
EEPROM
Electrically Erasable Programmable Read-Only Memory
ESD
Electrostatic Discharge
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
3
ETSI
European Telecommunications Standards Institute
FCC
Federal Communications Commission
FEM
Front End Module
GPIO
General Purpose Input/Output
HAF
High Frequency
HVAC
Heating, Ventilating, and Air Conditioning
HW
Hardware
IC
Industry Canada
2
IC
Inter-Integrated Circuit
IEEE
Institute of Electrical and Electronics Engineers
IRQ
Interrupt Request
ISM
Industrial, Scientific and Medical radio band
JTAG
Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
LNA
Low Noise Amplifier
MAC
Medium Access Control layer
MCU
Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit
module
NRE
Network layer
OEM
Original Equipment Manufacturer
OTA
Over-The-Air upgrade
PA
Power Amplifier
PCB
Printed Circuit Board
PER
Package Error Ratio
RAM
Random Access Memory
RF
Radio Frequency
RPC
Reduced Power Consumption
RTS/CTS
Request to Send/ Clear to Send
RX
Receiver
SMA
Surface Mount Assembly
SoC
System on Chip
SPI
Serial Peripheral Interface
SW
Software
TTM
Time-To-Market
TX
Transmitter
UART
Universal Asynchronous Receiver/Transmitter
USART
Universal Synchronous/Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
4
1.4
ZigBee, ZigBee PRO
Wireless networking standards targeted at low-power applications
802.15.4
The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network
Related Documents
[1] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to 6GHz
http://www.hirose.co.jp/cataloge_hp/e35801505.pdf
[2] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[3] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
[4] AT86RF233 Datasheet in http://www.atmel.com/devices/AT86RF233.aspx?tab=documents
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
5
2.
ZigBit Module Overview
2.1
Overview
The ATZB-RF-233-1-C ZigBit is a compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module with an
integrated FEM built-in. Based on a solid combination of the latest Atmel MCU Wireless hardware platform, 2.4GHz ISM
band transceiver and Atmel Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio
performance, ultra-low power consumption and exceptional ease of integration.
Figure 2-1. ATZB-RF-233-1-C Block diagram
.
This ZigBit module contains Atmel’s AT86RF233 2.4GHz ISM band Transceiver for ZigBee and IEEE 802.15.4 [1].
The compact board design of the Radio Transceiver with very minimal components on the RF path to Antenna
dramatically improves the ZigBit’s compact size, range performance on signal transmission and increases its sensitivity.
This ensures stable connectivity within a larger coverage area, and helps develop applications on smaller footprint. The
MS-147 connector [1] can be used as an RF Test port.
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
6
ZigBit Module contains a complete RF design with all the necessary passive components included. The module can be
easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module Evaluation
kit containing the ZigBit Extension board for the Atmel Xplained PRO HW Evaluation platform can be used to develop
FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU solution, a
module-based solution offers considerable savings in development time and NRE cost per unit during the HW/FW
design, prototyping, and mass production phases of product development.
Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would be
paired with a host processor driving the module over a serial interface.
The MAC stack running on the host processor can then control data transmission and manages module peripherals.
Thus very minimal firmware customization is required for successful module design-in. Third-party sensors can then be
connected directly to the module, thus expanding the existing set of peripheral interfaces.
Every ZigBit Module come pre loaded with Atmel assigned 64-bit MAC address stored in the signature bytes of the
device. This unique IEEE MAC address can be used as the MAC address of the end product, so there is no need to buy
a MAC address separately for the product using the ZigBit.
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
7
3.
Specification
3.1
Electrical Characteristics
3.1.1
Absolute Maximum Ratings
Table 3-1.
Notes:
3.1.2
Absolute Maximum Ratings
(1)(2)
Parameter
Minimum
Maximum
Voltage on any pin, except RESET with respect to ground
-0.3V
3.6V (VDD max)
Input RF level
+10dBm
Current into Vcc pins
200mA
1.
Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no
circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond those listed
under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated
in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2.
Attention! ZigBit is an ESD-sensitive device. Precaution should be taken when handling the device in order to
prevent permanent damage.
Power Supply
Table 3-2.
°
Test Conditions (unless otherwise stated), Vcc = 3V, Tamb = 25 C.
Parameter
Range
Unit
2.0 to 3.6
V
Current consumption: TX ON, FEM ON
157
mA
Current consumption: RX ON, RPC, LNA Bypass
7.5
mA
Current consumption: RX ON, RPC, LNA ON
12.5
mA
Current consumption: RX ON, LNA ON
17
mA
Current consumption: TRX_OFF, FEM Sleep
337
µA
Sleep Current consumption: TRX Sleep, FEM Sleep
0.7
µA
Supply voltage, VDD
(1)
Note 1: Output TX power (when measuring consumption in TX mode) is +19.4dBm.
Current consumption depends on multiple factors, including but not limited to, the board design and materials. When this module
is assembled on a base board, the MCU current also should be considered in estimating Active and Sleep currents of the
product
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
8
3.1.3
RF Characteristics
Table 3-3.
RF Characteristics
(1)
.
Parameter
Condition
Range
Unit
Frequency band
2.4000 to 2.4835
GHz
Numbers of channels (North American)
16
Channel spacing
5
MHz
Transmitter output power
Adjusted in 7 steps
+2.6 to + 19.9
dBm
Receiver sensitivity
PER = 1%
-105
dBm
250, upto 2000
Kbps
50
Ω
On-air data rate
TX output/ RX input nominal impedance
Range
For balanced
Open field, LoS, Elevated
1.96
#
km
#
Note : Range measured is Line of Sight at 10ft elevation from Ground at different combinations of orientation of
transmitter and receiver, with special conditions were there is minimal or no RF interference from other sources. For best
case orientation of the ZigBits to achieve maximum range, refer to section 3.4.
Table 3-4.
Region specific TX power settings to ensure Compliance
PHY_TX_PWR 3:0 Register value
Power register setting
[dBm]
Output power [dBm] (typical values at RF
connector)
0x0E
-12
+10.8
0x0F
-17
+4.1
Note:
1. For detailed characteristics, please refer [4]
2. To ensure compliance, the following regional specific settings are to be ensured:
FCC and IC compliance:
Operating the ZigBit from Channels 12 to 24 has no restrictions on Set power level.
Operating the ZigBit at Channel 11 requires limitation of TX output power to maximum +16dBm, the
power setting register value should be 0x0D or less
Operating the ZigBit at Channel 25 requires limitation of TX output power to maximum +13dBm, the
power setting register value should be 0x0E or less
ETSI Compliance: Operating the ZigBit in Europe requires setting TX Power to 0x0F for Channels 11 and 26.
All other channels can use a power setting of either 0x0E or 0x0F. This setting ensures compliance with ETSI
EN 300 228 clause 4.3.2.2 Maximum Power Spectral Density
Table 3-5.
TX power across channels
Channel
PHY_TX_PWR 3:0
Register value
Typical Output power [dBm] (at RF connector)
11
0xD or less
+16.0
12
0x0
+21.4
13
0x0
+21.4
14
0x0
+21.4
15
0x0
+21.3
16
0x0
+21.3
17
0x0
+21.3
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
9
3.2
18
0x0
+21.3
19
0x0
+21.3
20
0x0
+21.3
21
0x0
+21.3
22
0x0
+21.3
23
0x0
+21.2
24
0x0
+21.1
25
0xE
+13.0
26
0xE or less
Restricted - Do not use in North America and
Canada
Restricted – Refer Note 2 for Europe
Physical/Environmental Characteristics and Outline
Table 3-6.
Physical characteristics.
Parameters
Value
Size
25.0 x 20.0mm
Operating temperature range
-40°C to +85°C
3.3
Comments
-40°C to +85°C operational
Pin Configuration
Table 3-7.
ATZB-RF-233-1-C Pinout description
Pin Out
Pin
descriptions
Function
1
AVSS
Analog Ground
2
AVSS
Analog Ground
3
DEVDD
Digital Power input pin
4
DEVDD
Digital Power input pin
5
/RST
REST active low
6
/SEL
SPI select, active low
7
MOSI
SPI data input
8
MISO
SPI data output
9
SCLK
SPI clock
10
DIG1
Reserved
11
FEM_CSD
Reserved
32
DIG3
33
DIG4
RX TX Indication (Inverted)
34
DIG2
Tx- Rx time-stamp
35
SLP_TR
RX TX Indication
Controls sleep, deep sleep, transmit start, receive states; active high
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
10
3.4
Pin Out
Pin
descriptions
Function
36
SCL
TWI- EEPROM
37
SDA
TWI- EEPROM
38
FEM_CPS
39
CLKM
40
IRQ
41
DVSS
Digital Ground
42
DVSS
Digital Ground
Front end module select for RF_TX_RX
Master Clock out put
Interrupt request signal output
Antenna Orientation Recommendation
The Antenna in this module is designed to provide the best possible LoS range in the direction indicated in this
illustration.
3.5
Mounting Information
The Figure below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on
the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded
via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and
losses.
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
11
Figure 3-1. ATZB-RF-233-1-C Dimensions
Figure 3-2. ATZB-RF-233-1-C Pinout
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
12
Figure 3-3. ATZB-RF-233-1-C Foot Pring Dimensions
Figure 3-4. ATZB-RF-233-1-C Mounting Information
The ZigBit’s location and orientation on the carrier board is illustrated in the above PCB Land pattern and Mounting
information drawing. The Recommended placement of ZigBit on Carrier Board needs to be accurately followed to
ensure performance on the end application
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
13
3.6
Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-7.
Table 3-8.
(1)
Profile feature
Green package
Average ramp-up rate (217°C to peak)
3°C/s max
Preheat temperature 175°C ±25°C
180s max
Temperature maintained above 217°C
60s to 150s
Time within 5°C of actual peak temperature
20s to 40s
Peak temperature range
260°C
Ramp-down rate
6°C/s max
Time within 25°C to peak temperature
8 minutes
Note:
3.7
Soldering profile
1.
The package is backward compatible with PB/Sn soldering profile.
Antenna Reference Designs
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board
material and thickness, shields, the material used for enclosure, the board neighborhood, and other components
adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.
General Recommendations:
•
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
•
Placing high profile components next to antenna should be avoided.
•
Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern.
•
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band
frequency.
The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of
high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna
pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.
4.
Schematics
The following schematic drawings for the ATZB-RF-233-1-C are in the following order:
•
Top level schematics
•
AT86RF233 schematics
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
14
1
2
3
4
5
6
7
8
A
A
RF233 Amp module
RFonly_233.SchDoc
B
B
TRX INTERFACE
FEM CPS
CLKM
POWER
C
C
D
ATMEL India
OJS
Chennai
MSK
Tamil Nadu
*
D
India
Date:
5/27/2013
Document number: A08-1566
6:50:24 PM
PAGE:
1
of
Revision: 2
TITLE: RF233 Amp ZigBit
RFonly233_Toplevel.SchDoc
1
2
3
4
5
6
7
8
1
1
2
3
4
5
6
7
8
VCC_3V3
C1
PICCOC1
101
PIC102
SLP_TR
DIG2
DIG1
1uF
100n
C2
PICCOC2
201
PIC202
Place de-coupling closer
to TRX
A
A
PIU1022
nSEL
PIU1023
COR4
R4
PIR401
9
DIG1
RFN
SEL
COC5
C5
PIC501
RFP
4
PIU104
AVSS
PIU103
DIG4
PIU102
2
DIG4
DIG3
1
PIU101
DIG3
COR2PIR202
3
1
16.0MHz
GND
32
31
30
COC9
C9
16
PIU2016
100K
CSD
PIR301
COR5
R5
PIR501
100K
CPS
PIR502
20
PIU2020
21
PIU2021
2
PIJ102
24
PIU2024
100K
CPS
CTX
DIG3
PIR602
BOUT
GND
COR7
R7 1.2K
COC10
C10
1uF GND
PIC1001 PIC1002
PIR701
PIR801
COC11
C11
10 pF
PIC1101 PIC1102
PIR702
PIR802
COR8
R8 2.2K BOUT
GND
2
PIU202
1
PIU201
23
PIU2023
1
PIC402
3 pF
PIL201
PIJ104
PIR1101
PIC401
PIA101
PIA103
FEED POINT
PIA104
PIL101
NC
2
PIA102
2450AT42B100
COL1
L1
COL2
L2
MS147
3
3
COR11
R11
PIR1102
3.3nH
3.3nH
PIL202
PIL102
GND
GND
GND
GND
CSD
100n
VCC_3V3
13
PIU2013
COA1
A1
COC4
C4
RF_IN RF_OUT
ANT_SEL
COC13PIC1301 PIC1302
C13
100nF
PIC901 PIC902
GND
1
PIJ101
49.9R
COC15PIC1501 PIC1502
C15
100nF
COR6
R6
PIR601
PIQ104
15
PIU2015
VCC_3V3
COR3
R3
PIR302
GND
4
PIQ103
ANT2
GND
GND
COQ1
Q1
3
Place xtal circuit closer
to TRX . Isolate from
digital signals.
Place
termination R2
closer to TRX
COC14PIC1401 PIC1402
C14
100nF
2
PIQ102
ANT1
tune the values for
Antenna matching
GND
PIR201
GND
PIQ101
T/R
22 pF
PIC502
AVSS
AVSS
AVSS
AVDD
AVSS
EVDD
29
33
6
PIU206
GND
COC8
C8
10 pF
PIC801 PIC802
PIJ103
COU2
U2
5
PIU105
PIU1025 PIU1026 PIU1027 PIU1028 PIU1029 PIU103 PIU1031 PIU1032
28
PIU103
B
XTAL1
22R 24
PIR402 PIU1024 IRQ
COJ1
J1
GND
GND
10
DIG2
11
12
DVSS
13
DVDD
14
MOSI
27
IRQ
23
DVSS
DIE
GND
22
MOSI
AVSS
6
PIU106
4
21
PIU1021
SCLK
MISO
RESET_N
GND
20
DVSS
7
PIU107
4
PIU1020
DVSS
8
PIU108
B1
B2
BOUT
SE2431L-R
Paddle (GND)
MISO
RSTN
22
VCC1
VCC2
PIU2022
19
PIU2019
GND
GND
GND
GND
GND
GND
NC
NC
NC
NC
NC
NC
PIU209
10
PIU2010
11
PIU2011
12
PIU2012
14
PIU2014
18
PIU2018
3
PIU203
4
PIU204
5
PIU205
7
PIU207
8
PIU208
17
PIU2017
PIC601
PIC602
COC6
C6
100n
9
PIC701
PIC702
B
COC7
C7
100n
GND
GND
PIU205
25
19
PIU1019
AT86RF233-ZU
R2
SCLK
26
GND
CLKM
AT86RF233
18
PIU1018
SLP_TR
17
PIU1017
MLF32
PIR102
DVDD
680R
PIR101
15
DVSS
COR1
R1
2.2 pF
PIC302
XTAL2
PIC301
25
COC3
C3
GND
DEVDD
16
PIU10 6 PIU10 5 PIU10 4 PIU10 3 PIU10 2 PIU10 1 PIU10 PIU109
COU1
U1
CLKM
GND
49.9R
GND
GND
VCC_3V3
COZ1
Z1
PIZ102
3
VCC_3V3_EXT
PIZ103
VCC_3V3_EXT
PIZ104
4
RESET_N
PIZ105
6
nSEL
GND
5
PIZ106
7
MOSI
PIZ107
MISO
PIZ108
SCLK
PIZ109
8
9
10
DIG1
PIZ1010
11
PIZ1011
GND
PIZ1042
GND
GND
PIZ1041
VDD
IRQ
PIZ1040
VDD
CLKM
PIZ1039
nRST
FEM_SEL
nSEL
SDA
VCC_3V3_EXT
COL3PIL301
L3
PIL302
BLM15PD800SN1
40
IRQ
39
CLKM
38
PIZ1038
CPS
PIC1201
PIZ1037
37
MAC_SDA
36
MAC_SCL
35
SLP_TR
SCL
PIZ1036
SLP_TR
PIZ1035
SCLK
DIG2
PIZ1034
34
DIG2
33
PIZ1033
DIG4
32
DIG3
FEM_CSD
DIG3
PIZ1032
PIC1202
2
GND
COR9
U3
COU3
4
PIU304
PIU302
VCC
SCL
SDA
WP
GND
PIR902 PIR10 2
PIR901 PIR10 1
C
COR10
1
MAC_SCL
MAC_SDA
PIU301
3
PIU303
5
PIU305
GND
MISO
DIG4
VCC_3V3
COC12 100n
C12
MOSI
DIG1
VCC_3V3
41
R10 10 k
2
C
42
GND
R9 10 k
1
PIZ101
AT24MAC602-STUM-T
GND
GND
ATZB-RF-233-1-C
COPCB1
PCB1
COLABEL1
LABEL1
COZ2
Z2
Product number/revision
Serial number
Label ZigBit Shield
EMI Shield
PIZ201 PIZ202 PIZ203 PIZ204
1
2
3
4
D
B
a
ATMEL India
OJS
RMZ Millenia
MSK
MGR Road
MSK
D
Chennai
ZigBit 2.4GHz RF-only board PCB
Date:
5/27/2013
Document number: *
6:50:23 PM
PAGE:
1
of
Revision: 2.0
TITLE: RFonly RF233 Amp Zigbit
RFonly_233.SchDoc
1
2
3
4
5
6
7
8
1
4.1
Handling Instructions
The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is
galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection
coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this
should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying
the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housing of the product should ensure
suitable Ingress Protection standards are complied with.
The MS-147 connector should never be exposed to Varnish / similar conformal coating material which will affect
electrical connection on the surfaces of connector.
The in-built chip antenna has been tuned for the particular design
4.2
General Recommendations
• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning
• Placing high profile components next to antenna should be avoided
• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges
also distorting antenna pattern
•
5.
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit's RF frequency
band
Ordering Information
Part number
Description
ATZB-RF-233-1-C
2.4GHz IEEE802.15.4/ZigBee OEM module based on AT86RF233 Transceiver with MS-147 test
connector and chip antenna, Single unit
ATZB-RF-233-1-CR
2.4GHz IEEE802.15.4/ZigBee OEM module based on AT86RF233 Transceiver with MS-147 test
connector and chip antenna, Tape & Reel
Note:
Tape and reel quantity: 200.
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
15
6.
Agency Certifications
6.1
United States (FCC)
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an
OEM manufacturer must comply with the following regulations:
The ATZB-RF-233-1-C modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is
not visible when the module is installed inside another device, then the outside of the device into which the
module is installed must also display a label referring to the enclosed module. This exterior label can use
wording such as the following:
IMPORTANT: Contains FCC ID: VW4A091729. This equipment complies with Part 15 of the FCC Rules. Operation
is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired operation (FCC 15.19).
The internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all
persons and must not be colocated or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF
exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may
only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment
authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this
equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and
can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense
(FCC section 15.105).
6.2
European Union (ETSI)
The ATZB-RF-233-1-C Module has been certified for use in European Union countries. If these modules are
incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized
EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and
kept on file as described in Annex II of the R&TTE Directive.
Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does
not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user
manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body
for compliance testing to all required standards.
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
16
IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall
consist of the initials "CE" taking the following form:
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the
apparatus.
The CE marking must be affixed visibly, legibly, and indelibly.
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE
EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.
6.3
Canada (IC)
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two
conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20 cm between the device and
the user or bystanders.
Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre le
dispositif et l'utilisateur ou des tiers
CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
This Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another
device, then the device should display the label on it referring the enclosed module. In that case, the final end product
must be labelled in a visible area with the following:
“Contains Transmitter Module IC:11019A-091729”
OR
“Contains IC: 11019A-091729”
Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à
l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le
produit final doit être étiqueté dans un endroit visible par le texte suivant:
“Contains Transmitter Module IC: 11019A-091729”
OR
“Contains IC: 11019A-091729”
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
17
7.
Revision History
Doc. Rev.
Date
Comments
42192A
11/2013
Initial revision.
ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42192A−WIRELESS−11/2013
18
Atmel Corporation
Atmel Asia Limited
Atmel Munich GmbH
Atmel Japan G.K.
1600 Technology Drive
Unit 01-5 & 16, 19F
Business Campus
16F Shin-Osaki Kangyo Building
San Jose, CA 95110
BEA Tower, Millennium City 5
Parkring 4
1-6-4 Osaki, Shinagawa-ku
USA
418 Kwun Tong Road
D-85748 Garching b. Munich
Tokyo 141-0032
Tel: (+1)(408) 441-0311
Kwun Tong, Kowloon
GERMANY
JAPAN
Fax: (+1)(408) 487-2600
HONG KONG
Tel: (+49) 89-31970-0
Tel: (+81)(3) 6417-0300
www.atmel.com
Tel: (+852) 2245-6100
Fax: (+49) 89-3194621
Fax: (+81)(3) 6417-0370
Fax: (+852) 2722-1369
© 2013 Atmel Corporation. All rights reserved. / Rev.: 42192A−WIRELESS−11/2013
Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, AVR®, ZigBit®, and others are registered trademarks or trademarks of Atmel
Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this
document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES
NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED
WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT,
CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF
INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time
without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in,
automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.