ESD Sensitivity Testing of Mini-Circuits ERA-4XSM

ESD Sensitivity Testing of Mini-Circuits ERA-4XSM
(AN-60-028)
1.0
Purpose: To determine the Electrostatic Discharge Sensitivity of Mini-Circuits Amplifier ERA4XSM in accordance with Human Body Model (HBM) and Machine Model (MM) ESD
sensitivity standards. The failure criterion is: 1dB change in gain and/or 10% change in device
voltage.
2.0
Ref.: ESD STM5.1-1993 (for HBM) and ESD STM5.2-1999 (for MM).
3.0
Human Body Model
Three (3) separate samples were used for each of the different values of ESD voltage: 150V,
200V, 240V, 499V, and 999V. Each sample was subjected to 3 ESD pulses of each polarity at
each of 3 pairs of pins: input – output, input – ground, and output – ground, a total of 18 pulses.
Electrical performance testing was done for gain and DC device voltage at 65mA bias current,
before and after the ESD pulses. Data are presented in Table 1. Using the failure criteria stated in
1.0, all devices passed at 499V; at 999V, 2 failed and 1 passed marginally.
4.0
Machine Model
4.1
Testing per ESD STM5.2-1999
Three (3) separate samples were used for each of the different values of ESD voltage:
50V, 100V, and 150V. Each sample was subjected to 3 ESD pulses of each polarity at
each of 3 pairs of pins: input – output, input – ground, and output – ground, a total of 18
pulses.
Electrical performance testing was done for gain and DC device voltage at 65mA bias
current, before and after the ESD pulses. Data are presented in Table 2. Using the failure
criteria stated in 1.0, the devices passed at 50V and failed at 100V.
AN-60-028 Rev.: A M150261 (04/14/15) File: AN60028.doc
This document and its contents are the property of Mini-Circuits.
Page 1 of 8
Table 1 – Human Body Model
ERA -4XSM
[150 v Human Body Model]
Units
1
Gain (dB) Frequency PRE-Test POST-Test
100
14.55
14.55
2000
13.44
13.64
Vdd(v)
Idd=65mA
4.5
4.45
2
DIF % change PRE-Test POST-Test
0
14.56
14.5
0.2
13.44
13.5
-0.05
-1.11%
4.5
4.45
[200 v HBM]
Units
4
Gain (dB) Frequency PRE-Test POST-Test
100
14.55
14.5
2000
13.44
13.6
5
DIF % change PRE-Test POST-Test
-0.05
14.56
14.51
0.16
13.47
13.61
Vdd(v)
-0.05
Idd=65mA
4.5
4.45
-1.11%
4.5
4.44
[240 v HBM]
Units
7
Gain (dB) Frequency PRE-Test POST-Test
100
14.55
14.51
2000
13.45
13.52
8
DIF % change PRE-Test POST-Test
-0.04
14.56
14.52
0.07
13.43
13.74
Vdd(v)
-0.06
Idd=65mA
4.5
4.44
-1.33%
4.5
4.44
[ 499 v HBM]
Units
10
Gain (dB) Frequency PRE-Test POST-Test
100
14.56
14.5
2000
13.4
13.49
11
DIF % change PRE-Test POST-Test
-0.06
14.56
14.5
0.09
13.45
13.48
Vdd(v)
-0.03
Idd=65mA
4.5
4.47
[999 v HBM]
Units
25
Gain (dB) Frequency PRE-Test POST-Test
100
14.56
-36.21
2000
13.44
-9.8
Vdd(v)
Idd=65mA
4.5
3.33
-0.67%
4.5
4.47
26
DIF % change PRE-Test POST-Test
-50.77
14.55
0.96
-23.24
13.43
1.53
-1.17
AN-60-028 Rev.: A M150261 (04/14/15) File: AN60028.doc
This document and its contents are the property of Mini-Circuits.
-26.00%
4.5
3.98
3
DIF
% change PRE-Test POST-Test
-0.06
14.57
14.54
0.06
13.42
13.48
-0.05
-1.11%
4.5
4.44
6
DIF
% change PRE-Test POST-Test
-0.05
14.56
14.52
0.14
13.45
13.6
-0.06
-1.33%
4.5
4.45
9
DIF
% change PRE-Test POST-Test
-0.04
14.56
14.52
0.31
13.45
13.66
-0.06
-1.33%
4.5
4.45
12
DIF
% change PRE-Test POST-Test
-0.06
14.55
14.5
0.03
13.45
13.51
-0.03
-0.67%
4.5
4.47
27
DIF
% change PRE-Test POST-Test
-13.59
14.56
13.57
-11.9
13.45
12.51
-0.52
-11.56%
Page 2 of 8
4.5
4.35
DIF
% change
-0.03
0.06
-0.06
-1.33%
DIF
% change
-0.04
0.15
-0.05
-1.11%
DIF
% change
-0.04
0.21
-0.05
-1.11%
DIF
% change
-0.05
0.06
-0.03
-0.67%
DIF
% change
-0.99
-0.94
-0.15
-3.33%
Table 2 – Machine Model
ERA - 4XSM
[50 v Machine Model]
Units
22
Gain (dB) Frequency PRE-Test POST-Test
100
14.56
14.46
2000
13.44
13.41
Vdd(v)
Idd=65mA
4.5
4.5
[100 v MM]
Units
28
Gain (dB) Frequency PRE-Test POST-Test
100
14.56
13.67
2000
13.45
12.52
Vdd(v)
Idd=65mA
4.5
5.1
[150 v MM]
Units
13
Gain (dB) Frequency PRE-Test POST-Test
100
14.56
-2.18
2000
13.43
-2.86
Vdd(v)
Idd=65mA
4.5
3.4
23
DIF % change PRE-Test POST-Test
-0.1
14.55
14.53
-0.03
13.43
13.46
0
0.00%
4.5
4.47
29
DIF % change PRE-Test POST-Test
-0.89
14.6
13.63
-0.93
13.49
12.54
0.6
13.33%
4.53
5.14
14
DIF % change PRE-Test POST-Test
-16.74
14.56
-15.05
-16.29
13.42
-13.06
-1.1
AN-60-028 Rev.: A M150261 (04/14/15) File: AN60028.doc
This document and its contents are the property of Mini-Circuits.
-24.44%
4.5
3.06
24
DIF % change PRE-Test POST-Test
-0.02
14.56
14.44
0.03
13.45
13.39
-0.03
-0.67%
4.5
4.5
30
DIF % change PRE-Test POST-Test
-0.97
14.59
13.93
-0.95
13.47
12.79
0.61
13.47%
4.53
4.94
15
DIF % change PRE-Test POST-Test
-29.61
14.56
-21.78
-26.48
13.45
-20.64
-1.44
-32.00%
Page 3 of 8
4.5
2.42
DIF
% change
-0.12
-0.06
0
0.00%
DIF
% change
-0.66
-0.68
0.41
9.05%
DIF
% change
-36.34
-34.09
-2.08
-46.22%
4.2
Additional Machine Model testing was done in three steps, to evaluate how much
performance degradation occurs when progressively increasing ESD voltage is applied to
a given device, and when a given ESD voltage is applied repeatedly with performance
monitored after each pulse. Separate device samples were used for each of the three steps.
1. In Step 1, one ESD pulse of each polarity was applied with fixed amplitude of 100V
to the different combinations of pins in order to determine the most sensitive pair of
pins and most sensitive polarity. Purpose: to reduce the amount of testing required in
the subsequent tests.
2. In Step 2, a sequence of ESD pulses was applied to each device at the most sensitive
pair of pins and polarity found in Step 1, one pulse at each of the following voltages
increasing in value: 50V, 70V, 100V, 150V, 200V. Gain and device voltage were
measured initially and after each ESD pulse.
3. In Step 3, an ESD pulse with fixed amplitude of 100V was applied multiple times, at
the most sensitive pair of pins and polarity found in Step 1, in order to determine
cumulative effect of ESD stress.
Step 1 Test. Applying 100V ESD pulse showed the following: The most sensitive pin
combination is input-to-ground where the “-” was applied to the input and “+” was applied to the
ground. With that condition the gain dropped by 0.3dB and device voltage rose by 0.32V. The
least sensitive pin combination is output-to-ground where the “+” was applied to the output and
“-” was applied to the ground. With that condition the gain dropped by 0.08dB and device
voltage rose by 0.02V. Table 3 lists the data.
Initial
Avg
Sigma
Avg
Sigma
Avg
Sigma
Avg
Sigma
Avg
Sigma
Avg
Sigma
#1…#5
Gain, dB
14.59
0.0075
Vdd, V
4.48
0.0063
After 100V Machine Model pulse After 100V Machine Model pulse
and previous pulse polarity
Input + , Ground Input - , Ground +
Gain, dB
Gain, dB
14.58
14.29
0.0102
0.0377
Vdd, V
Vdd, V
4.48
4.80
0.0040
0.0290
#6…#10
Gain, dB
14.59
0.0098
Vdd, V
4.47
0.0049
Output + , Ground Gain, dB
14.58
0.0117
Vdd, V
4.47
0.0089
Output - , Ground +
Gain, dB
14.51
0.0075
Vdd, V
4.49
0.0098
#11…#15
Gain, dB
14.59
0.0080
Vdd, V
4.47
0.0063
Output + , Input Gain, dB
14.47
0.0102
Vdd, V
4.71
0.0117
Output - , Input +
Gain, dB
14.45
0.0242
Vdd, V
4.72
0.0174
Table 3 – “Step 1” Machine Model Test Data to Determine Most Sensitive Case
AN-60-028 Rev.: A M150261 (04/14/15) File: AN60028.doc
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Step 2 Test. The results of progressively increasing the ESD stress, one pulse at each voltage,
are shown in Figures 1 and 2.
Figure 1 - Gain vs ESD pulse voltage
15
14.75
14.5
14.25
14
Gain, dB
13.75
13.5
ERA-4XSM at 1 MHz
ERA-4XSM at 2000 MHz
13.25
13
12.75
12.5
12.25
12
11.75
11.5
0
20
40
60
80
100
120
140
160
180
200
ESD voltage, V
Figure 2 - Vdd vs ESD pulse voltage
7
6.5
Vdd, V
6
5.5
5
ERA-4XSM at 65mA
4.5
4
3.5
0
20
40
60
80
100
120
140
160
180
200
ESD voltage, V
AN-60-028 Rev.: A M150261 (04/14/15) File: AN60028.doc
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Page 5 of 8
Figures 1 and 2 show that very little but still noticeable degradation in gain (0.1dB) and device
voltage (0.1V) starts with the 70V ESD pulse.
At ESD pulse of 100V the changes in gain and device voltage are gradually increasing. The
degradation caused by the 100V ESD pulse is in very good correlation with the Step 1
measurements that were performed on other samples of ERA-4XSM.
At ESD pulse of 150V more degradation is observed, but it is still gradual. This may be a
cumulative effect rather than simply the effect of increased ESD voltage, as demonstrated by
Step 3 (which was done with repeated 100V pulses).
Step 3 Test.
Five units were stressed repeatedly with 100V ESD pulses. Electrical tests
for gain and device voltage were made after each ESD pulse. The results are shown in Figures 3
and 4. After one pulse all 5 units passed the criteria of less than 1dB gain and less than 10%
device voltage change. After 2 pulses, one failed the voltage criterion.
Figure 3 - Gain at 1 MHz
vs. number of 100 V ESD pulses
15
14.75
14.5
Gain, dB
14.25
14
#-21
#-22
#-23
#-24
#-25
13.75
13.5
13.25
13
12.75
12.5
0
1
2
3
4
5
6
7
8
Number of 100V ESD pulses
AN-60-028 Rev.: A M150261 (04/14/15) File: AN60028.doc
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Page 6 of 8
Figure 4 - Vdd at 65mA
vs. number of 100 V ESD pulses
6.5
6.25
6
5.75
Vdd, V
5.5
#-21
#-22
#-23
#-24
#-25
5.25
5
4.75
4.5
4.25
4
0
1
2
3
4
5
6
7
8
Number of 100V ESD pulses
5.0
Conclusions
5.1
Human Body Model:
The new amplifier ERA-4XSM can withstand ESD at least up to 499V (Class
1A).
5.2
Machine Model:
The new amplifier ERA-4XSM shows gradual degradation in the gain and the
device voltage. That fact is not so bad. Even with the multiple stress a customer
would rather have gradual changes then catastrophic failure. The amplifier
withstands a single 100V ESD pulse, or 3 pulses at 50V.
AN-60-028 Rev.: A M150261 (04/14/15) File: AN60028.doc
This document and its contents are the property of Mini-Circuits.
Page 7 of 8
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