Technical Note AN-75-005 Power Handling Model Type: LTCC Low Pass Filters Methodology for Computation of Maximum Power Handling in LTCC Low Pass Filters Purpose: The purpose of this application note is to describe the procedure used for determining power handling capability of LFCW-Series LTCC Low Pass Filters due to thermal-related failures. Introduction: 2. Measure small signal insertion loss of the DUT in the pass band with a network analyzer. 3. Use the highest insertion loss in the pass band and the thermal resistance determined from step 1 to compute the power dissipation, and in turn the temperature rise and the max power handling. See detailed flow chart in Figure 2. LFCW series filters are made using LTCC (Low Temperature Co-fired Ceramic) technology. Due to low losses and high temperature handling capability of the ceramic material, they can handle reasonably high power levels, even though they are of small size. Testing of power and thermal resistance is required to determine the maximum power handling capability. Failure Mechanism: Applying RF power to the LFCW filters will generate heat due to Ohmic and dielectric losses and cause the rise of DUT temperature. LTCC technology uses thin layers of ceramic on which conductors are printed using noble metals. Various layers are bonded to each other by firing around 850°C. In actuality, the DUT is soldered onto a PCB. While the LTCC filter itself can handle very high temperatures, the weak point is the solder joint, whose melting point is much lower than 850°C. Therefore we use the solder melting point (with some margins) as the maximum allowable temperature of the DUT for maximum power computations. Assuming that the DUT is soldered onto a PCB using high temperature solder such as SnAgCu, whose melting point is 217°C, we can allow the DUT temperature to rise to 200°C without melting the solder joint. Note that the procedure described here can be used to compute max power for any user-defined maximum temperature. Methodology Employed: 1. Determine the thermal resistance of the DUT at a fixed frequency through thermal imaging measurements. See detailed flow chart in Figure 1. Figure 1: Thermal Resistance Measurement Flow Chart AN-75-005 Rev.: A M150261 (04/15/15) File: AN75005.doc This document and its contents are the property of Mini-Circuits. Page 1 of 6 Technical Note AN-75-005 Power Handling Model Type: LTCC Low Pass Filters Test Conditions: • Room temperature • RF input: continuous wave • Frequency = 4 GHz, see note 4 • Pin = 30, 33, 35, 36, 37, 38, 39, 40 dBm. Notes: 1) Calibration method: zero & calibrate each power meter before test, connect the throughline of TB-720+ as DUT, and offset power meter F until it shows the same reading as power meter H at 4 GHz. 2) Take thermal images after applying each power level for 5 minutes, or until the DUT temperature is stable. 3) Record power meter F as input power Pin; record power meter H as output power Pout. Insertion loss = Pout – Pin. 4) Choose the frequency at which you have a high power source. In this case, the test was performed only at mid-band frequency, 4 GHz. Figure 2: Flow Chart Representing Determination of Maximum Input Power AN-75-005 Rev.: A M150261 (04/15/15) File: AN75005.doc This document and its contents are the property of Mini-Circuits. Page 2 of 6 Technical Note Power Handling Model Type: LTCC Low Pass Filters AN-75-005 Test Sequence: A. Signal Generator I. DC Voltage Supply B. Attenuator C. High Power Amplifier J. Thermal Imaging Camera D. Bi-Directional Coupler B. Attenuator B. Attenuator F. Power Meter E. Termination H. Power Meter G. DUT Figure 3: LFCW Series Power Handling Test Block Diagram No. Type Description ESG Series Signal Generator, 250kHz4.0GHz 5W, 10dB Attenuator, DC-18GHz 16W, 45dB High Power Amplifier, 1800-4000 MHz 250W, 35dB Coupler, 900-9000MHz MFG. MFG/Model Agilent E4422B A Signal Generator B Attenuator C Power Amplifier D Bi-Directional Coupler E Termination 50-Ohm, SMA Male F Power Meter RF Power Meter G DUT Solder on Test Board H Power Meter EPM-P Series Power Meter, with E-Series Avg Power Sensor (-30 - +44 dBm), 10MHz – 18GHz Agilent E4416A I DC Power Supply 30V/50A, 1500W System DC Power Supply Agilent N5765A J Thermal Imaging Camera 12VDC, 1.25A Thermal Camera MiniCircuits MiniCircuits MiniCircuits MiniCircuits Boonton MiniCircuits BW-S10W5+ ZHL-16W-43-S+ ZGDC35-93HP+ 4231A TB-720+ Optotherm InfraSight EL Table 1 Power Handling Test Equipment List AN-75-005 Rev.: A M150261 (04/15/15) File: AN75005.doc This document and its contents are the property of Mini-Circuits. Page 3 of 6 Technical Note Power Handling Model Type: LTCC Low Pass Filters AN-75-005 Test Data and Calculations: Below is an example of test analysis for filter model LFCW-1142+. Testing was performed at 4 GHz at room temperature, and prediction was made at 11.4 GHz based on the calculated thermal resistance, assuming thermal resistance is frequency independent. Thermal imaging test for computing the Thermal Resistance of DUT Power Handling Test 4GHz (@25°C) TB#1 Input Power (dBm) Input Power (W) Power Out (dBm) Power Out (W) 0 30 33 35 36 37 38 39 40 0.001 1.00 2.00 3.16 3.98 5.01 6.31 7.94 10.00 -0.38 29.62 32.60 34.58 35.54 36.52 37.51 38.48 39.44 0.0009 0.92 1.82 2.87 3.58 4.49 5.64 7.05 8.79 Unit Insertion Loss Power Dissp Temperature (dB) (W) (°C) 0.38 0.0001 23.0 0.38 0.08 24.6 0.40 0.18 27.7 0.42 0.29 31.5 0.46 0.40 34.8 0.48 0.52 38.1 0.49 0.67 44.2 0.52 0.90 50.9 0.56 1.21 59.3 Calculating the max input power at room ambient temperature, 25°C To be conservative, we choose the max thermal resistance to do the calculation. Power Handling Analysis 11.4GHz (@25°C) TB#1 Thermal Input Power Input Power Insertion Loss Power Out Power Out Power Dissp Resitance (dBm) (W) (dB) (dBm) (W) (W) (ϴda) 0 0.001 2.13 -2.13 0.001 0.0004 31.5 30 1.00 2.13 27.87 0.61 0.39 31.5 33 2.00 2.15 30.85 1.22 0.78 31.5 35 3.16 2.17 32.83 1.92 1.24 31.5 36 3.98 2.21 33.79 2.39 1.59 31.5 37 5.01 2.23 34.77 3.00 2.01 31.5 38 6.31 2.24 35.76 3.77 2.54 31.5 39 7.94 2.27 36.73 4.71 3.23 31.5 40 10.00 2.29 37.71 5.90 4.10 31.5 2.31 38.69 7.40 5.19 31.5 41 12.59 42 15.85 2.33 39.67 9.27 6.58 31.5 Calculating the max input power at 100°C ambient temperature Power Handling Analysis 11.4GHz (@100°C) TB#1 Thermal Input Power Input Power Insertion Loss Power Out Power Out Power Dissp Resitance (dBm) (W) (dB) (dBm) (W) (W) (ϴda) 0 0.001 2.61 -2.61 0.001 0.0005 31.5 30 1.00 2.61 27.39 0.55 0.45 31.5 33 2.00 2.63 30.37 1.09 0.91 31.5 35 3.16 2.65 32.35 1.72 1.44 31.5 36 3.98 2.69 33.31 2.14 1.84 31.5 37 5.01 2.71 34.29 2.69 2.33 31.5 2.72 35.28 3.37 2.94 31.5 38 6.31 39 7.94 2.75 36.25 4.22 3.73 31.5 40 10.00 2.77 37.23 5.28 4.72 31.5 Temperature Change (°C) Thermal Resitance (ϴda) 1.6 4.7 8.5 11.8 15.1 21.2 27.9 36.3 19.1 26.8 29.2 29.5 28.8 31.5 31.1 30.0 Temperature Change (°C) 12.2 24.5 39.2 50.0 63.4 80.1 101.8 129.1 163.5 207.2 Temperature Change (°C) 14.2 28.5 45.5 57.9 73.3 92.5 117.3 148.5 Unit Temperature (°C) 25.0 37.2 49.5 64.2 75.0 88.4 105.1 126.8 154.1 188.5 232.2 Unit Temperature (°C) 100.0 114.2 128.5 145.5 157.9 173.3 192.5 217.3 248.5 Figure 4: Power Handling Test Analysis in Excel AN-75-005 Rev.: A M150261 (04/15/15) File: AN75005.doc This document and its contents are the property of Mini-Circuits. Page 4 of 6 Technical Note Power Handling Model Type: LTCC Low Pass Filters AN-75-005 Table 2 below shows the final results of maximum power for models LFCW-1062+, LFCW-1142+, and LFCW-133+. Max Input Power Max Input Power @25°C (W) @100°C (W) Model LFCW-1062+ 4.0 1.6 LFCW-1142+ 6.3 3.2 LFCW-133+ 12.6 6.3 Conclusion: The method for testing of power handling demonstrated in this application note feasibly predicts the maximum power rating of LFCW-Series low pass filters. Analysis shows that the model with less pass band insertion loss exhibits a higher maximum power rating. Table 2: Maximum Power Rating Comparison of LFCWSeries Max Power Computation at User-Defined Maximum DUT Temperature: Equations [1] and [2] below can be used to compute maximum power at any maximum DUT temperature defined by the user. Abbreviation TDUT Description Max. allowed DUT temperature (°C) TA Ambient temperature (°C) IL Insertion loss (dB) Pd Power dissipation (W) Θ Thermal resistance (°C/W) Table 3: Parameters for Computation of Power Dissipation and Maximum Power Handling [1] [2] AN-75-005 Rev.: A M150261 (04/15/15) File: AN75005.doc This document and its contents are the property of Mini-Circuits. Page 5 of 6 Technical Not AN-75-005 Power Handling Model Type: LTCC Low Pass Filters IMPORTANT NOTICE © 2015 Mini-Circuits This document is provided as an accommodation to Mini-Circuits customers in connection with Mini-Circuits parts only. In that regard, this document is for informational and guideline purposes only. Mini-Circuits assumes no responsibility for errors or omissions in this document or for any information contained herein. Mini-Circuits may change this document or the Mini-Circuits parts referenced herein (collectively, the “Materials”) from time to time, without notice. 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