SM030

PPTC/SM Series
Applications
Features
Surface Mount Devices
Almost anywhere there is a low voltage
Lead free deivce
power supply, up to DC60V and a load
Size 7555mm/2920 mils
to be protested, including:
Surface Mount packaging for automated assembly
Computer mother board, Modem.
Agency recognition:
Telecommunication equipments
Dimensions (mm)
A
2.3 ±0.1
2.3 ±0.1
5.6 ±0.1
ZZZL
B
5.1 ±0.1
C
D
Product dimensions (mm)
Model
SM030
SM050
SM075
SM100
SM125
SM150
SM185
SM200
SM200/24
SM250
SM300
Min.
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
A
Max.
Min.
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
4.8
4.8
4.8
4.8
4.8
4.8
4.8
4.8
4.8
4.8
4.8
B
Max.
Min.
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
0.6
0.5
0.6
0.4
0.4
0.4
0.4
0.3
0.7
0.3
0.5
C
Max
D
Min.
1.15
1.20
1.15
1.00
1.20
1.20
1.20
1.00
1.25
1.10
1.20
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
Environmental Specifications
Test
Conditions
Resistance change
Passive aging
85℃,1000hrs
±5% typical
Humidity aging
85℃,85%℃R.H.,168hrs
±5% typical
Thermal shock
85℃,to-40℃,13times
±33% typical
Resistance to solvent
MIL-STD-202,Method 215
No change
Vibration
MIL-STD-202,Method 201
No change
Ambient operating confitions:-40℃ to 85℃
Maximum surface of the device in the tripped state is 125℃
REV.2015.07.01
01 | www.spsemi.cn
PPTC/SM Series
Electrical characteristics(25℃)
Model
Ihold
(A)
Itrip
(A)
Vmax
(Vdc)
Imax
(A)
SM030
SM050
SM075
SM100
SM125
SM150
SM185
SM200
SM200/24
SM250
SM300
0.30
0.50
0.75
1.10
1.25
1.50
1.85
2.00
2.00
2.50
3.00
0.6
1.0
1.5
2.2
2.5
3.0
3.7
4.0
4.0
5.0
6.0
60
60
33
33
33
33
33
16
24
16
16
100
100
100
100
40
40
100
100
100
100
40
Pd Typ Maximum Time To Trip
(W)
Current
Time
(A)
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
(Sec)
1.5
2.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
3.0
4.0
0.3
0.5
2.0
2.0
2.5
4.5
4.5
16.0
20.0
Resistance
Rimin R1max
(Ω)
0.600
0.180
0.100
0.065
0.050
0.035
0.030
0.020
0.020
0.020
0.012
Ihold
Hold Current:Maximum current device will not trip in 25℃ still air.
Itrip
Trip current:Minimum current at which the device will always trip in 25℃ still air
Vmax
Maximum operating volatge device can withstand without damage at ratde current(imax).
Imax
Maximum fault current device can withstand without damage at rated voltage(Vmax).
Pd
Typical power dissipatde from device when in the tripped state in 25℃ still air.
Rmin/max
Minimum/Maximum device resistance prior to tripping at 25℃.
R1max
Maximum resistance of device at 25℃ measured one hour after trippde tripping.
*CAUTION
Operation beyond the specified rating may result in damage and possible arcing.
(Ω)
4.800
1.400
1.000
0.410
0.250
0.230
0.150
0.120
0.120
0.085
0.048
Ihold versus tempetature
Part Number
SM030
SM050
SM075
SM100
SM125
SM150
SM185
SM200
SM250
SM300
REV.2015.07.01
Maximum ambient operating temperature (Tmao) vs. hold current (Ihold)
-40°C
0.45
0.76
1.13
1.66
1.89
2.27
2.80
3.14
3.78
4.20
-20°C
0.40
0.67
1.01
1.47
1.68
2.01
2.47
2.77
3.35
3.85
0°C
0.35
0.59
0.88
1.29
1.46
1.76
2.17
2.42
2.93
3.44
25°C
0.30
0.50
0.75
1.10
1.25
1.50
1.85
2.00
2.50
3.00
40°C
0.25
0.42
0.62
0.91
1.04
1.25
1.54
1.73
2.08
2.69
50°C
0.23
0.38
0.56
0.83
0.94
1.13
1.39
1.56
1.88
2.50
60°C
0.20
0.33
0.50
0.73
0.83
1.00
1.22
1.38
1.65
2.31
70°C
0.17
0.29
0.44
0.64
0.73
0.87
1.07
1.20
1.45
2.12
85°C
0.14
0.23
0.34
0.50
0.56
0.74
0.85
0.98
1.13
1.83
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PPTC/SM Series
Termination pad characteristics
Terminal pad materials
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Terminal pad solderability
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Thermal Derating Curve
Typical Time-To-Trip At 25°C
Derating Curves for SMD Series
Average Time Current Curves
3.00A
0.50A
100
160
0.75A
Percentage of Derated
Current
140
1.00A
120
Time In Seconds
10
100
80
60
40
1.25A
1.5A
1.85A
1
2.0A
2.5A
2.6A
0.1
0.3A
20
0
-40
-20
0
20
40
60
80
0.01
0 .1
Temperature (°C)
1
10
100
Current In Amperes
Recommended Solder Reflow Conditions
Temperature(°C)
SMD Series
SMPreheating
300
Soldering
250
200
190
160
100
0
Cooling
‧Recommended reflow methods：IR, vapor phase oven, hot air oven.
‧Devices are not designed to be wave soldered to the bottom side
of the board.
‧Recommended maximum paste thickness is 0.25 mm (0.010 inch).
‧Devices can be cleaned using standard method and solvents.
Note：If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
60-120
sec.
30-60
sec.
120
sec.
Package Information
Reel:
SM030～ 15 0; , SM200 , SM25 0
2000pcs/reel
SM185 , SM200/24 , SM300
1500pcs／ｒｅｅｌ
REV.2015.07.01
03 | www.spsemi.cn