ESD/TESD** Series Low Capacitance TVS Diode Array APPLICATIONS ◆ RS-232, RS-422 & RS-423 Data Lines ◆ Audio/Video Inputs SOP-08 ◆ Wireless Network Systems ◆ Digit Video Interface (DVI) ◆ Medical Sensors ◆ Notebook Computers IEC COMPATIBILITY ◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) ◆ IEC61000-4-4 (EFT) 40A (5/50ηs) ◆ IEC61000-4-5 (Lightning) 12A (8/20µs) PIN CONFIGURATION FEATURES ◆ 500 Watts Peak Pulse Power per Line (tp=8/20µs) ◆ Protects four bidirectional I/O lines ◆ Low clamping voltage ◆ Working voltages : 3.3V, 5V, 12V, 15V and 24V ◆ Low leakage current MECHANICAL CHARACTERISTICS ◆ JEDEC SOP-08 Package ◆ Molding Compound Flammability Rating : UL 94V-O ◆ Weight 70 Millgrams (Approximate) ◆ Quantity Per Reel : 3,000pcs ◆ Reel Size : 13 inch ◆ Lead Finish : Lead Free REV.2015.02.01 01 | www.spsemi.cn ESD/TESD** Series DEVICE CHARACTERISTICS MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified) PARAMETER SYMBOL VALUE UNITS Peak Pulse Power (tp=8/20µs waveform) PPP 500 Watts Lead Soldering Temperature TL 260 (10 sec.) ℃ Operating Temperature Range TJ -55 ~ 150 ℃ TSTG -55 ~ 150 ℃ Storage Temperature Range ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified) PART NUMBER DEVICE MARKING VRWM VB (V) (V) (max.) (min.) IT VC VC @1A (mA) (max.) (max.) (@A) IR CT (µA) (pF) (max.) (max.) TESD03K4B SMDA X33C 3.0 4.0 1 6.5 10.9 5 75 450 TESD05K4B SMDA X05C 5.0 6.0 1 9.8 13.5 5 5 300 TESD12K4B SMDA X12C 12.0 13.3 1 19.0 25.9 5 1 100 TESD15K4B SMDA15C SMDA X15C 15.0 16.7 1 24.0 30.0 5 1 80 TESD24K4B SMDA X24C 24.0 26.7 1 43.0 49.0 5 1 50 REV.2015.02.01 02 | www.spsemi.cn ESD/TESD** Series SOP-08 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT REV.2015.02.01 03 | www.spsemi.cn