TU03FB-TU24FB

TU03FB-TU24FB
Low Capacitance TVS Diode Array
APPLICATIONS
◆ Cell Phone Handsets and Accessories
◆ Microprocessor based equipment
SOD-323
◆ Personal Digital Assistants (PDA’s)
◆ Notebooks, Desktops, and Servers
◆ Portable Instrumentation
◆ Peripherals
◆ USB Interface
IEC COMPATIBILITY
◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
◆ IEC61000-4-4 (EFT) 40A (5/50ηs)
◆ IEC61000-4-5 (Lightning) 12A (8/20µs)
PIN CONFIGURATION
FEATURES
◆ 350 Watts Peak Pulse Power per Line (tp=8/20µs)
◆ Protects one I/O line (bidirectional)
◆ Low clamping voltage
◆ Working voltages: 3V, 5V, 8V, 12V, 15V, 24V
◆ Low leakage current
MECHANICAL CHARACTERISTICS
◆ JEDEC SOD-323 Package
◆ Molding Compound Flammability Rating : UL 94V-O
◆ Weight 5 Millgrams (Approximate)
◆ Quantity Per Reel : 3,000pcs
◆ Reel Size : 7 inch
◆ Lead Finish : Lead Free
TUxxFB
DEVICE CHARACTERISTICS
MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified)
SYMBOL
VALUE
UNITS
Peak Pulse Power (tp=8/20µs waveform)
PPP
350
Watts
Lead Soldering Temperature
TL
260 (10 sec.)
℃
Operating Temperature Range
TJ
-55 ~ 150
℃
TSTG
-55 ~ 150
℃
PARAMETER
Storage Temperature Range
ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified)
PART NUMBER
DEVICE
MARKING
VRWM
VB
(V)
(V)
(max.) (min.)
TU03FB
CC
TU05FB
AC
5.0
TU08FB
BC
8.0
LC12CI
TU12FB
DC
DC
TU15FB
TU24FB
IT
VC
IR
VC
(µA)
(pF)
(@A)
(max.)
(typ.)
@1A
(mA)
(max.) (max.)
CT
4.0
1
5.15
13.9
8
20
0.6
6.0
1
9.80
18.3
8
5
0.6
8.5
1
13.40
18.5
8
2
0.6
12.0
12.0
13.3
13.3
1
19.00
28.6
6
1
1.2
0.6
EC
15.0
16.7
1
24.00
31.8
5
1
0.6
HC
24.0
26.7
1
43.00
56.0
3
1
0.6
3.0
TUxxFB
SOD-323 PACKAGE OUTLINE & DIMENSIONS
* SOLDERING FOOTPRINT