ESD/TUSD** Series Low Capacitance TVS Diode Array APPLICATIONS ◆ Cell Phone Handsets and Accessories ◆ Microprocessor based equipment SOD-323 ◆ Personal Digital Assistants (PDA’s) ◆ Notebooks, Desktops, and Servers ◆ Portable Instrumentation ◆ Peripherals ◆ USB Interface IEC COMPATIBILITY ◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) ◆ IEC61000-4-4 (EFT) 40A (5/50ηs) ◆ IEC61000-4-5 (Lightning) 12A (8/20µs) PIN CONFIGURATION FEATURES ◆ 350 Watts Peak Pulse Power per Line (tp=8/20µs) ◆ Protects one I/O line (bidirectional) ◆ Low clamping voltage ◆ Working voltages: 3V, 5V, 8V, 12V, 15V, 24V ◆ Low leakage current MECHANICAL CHARACTERISTICS ◆ JEDEC SOD-323 Package ◆ Molding Compound Flammability Rating : UL 94V-O ◆ Weight 5 Millgrams (Approximate) ◆ Quantity Per Reel : 3,000pcs ◆ Reel Size : 7 inch ◆ Lead Finish : Lead Free REV.2015.02.01 01 | www.spsemi.cn ESD/TUSD** Series DEVICE CHARACTERISTICS MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified) SYMBOL VALUE UNITS Peak Pulse Power (tp=8/20µs waveform) PPP 350 Watts Lead Soldering Temperature TL 260 (10 sec.) ℃ Operating Temperature Range TJ -55 ~ 150 ℃ TSTG -55 ~ 150 ℃ PARAMETER Storage Temperature Range ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified) PART NUMBER DEVICE MARKING VRWM VB (V) (V) (max.) (min.) VC IR VC (µA) (pF) (@A) (max.) (typ.) @1A (mA) (max.) (max.) CT 4.0 1 5.15 15.9 10 20 0.6 6.0 1 9.80 18.3 8 5 0.6 8.5 1 13.40 18.5 8 2 0.6 12.0 12.0 13.3 13.3 1 19.00 28.6 6 1 0.6 1.2 EC 15.0 16.7 1 24.00 31.8 5 1 0.6 HC 24.0 26.7 1 43.00 56.0 3 1 0.6 TUSD03FB CC TUSD05FB AC 5.0 TUSD08FB BC 8.0 TUSD12FB LC12CI DC DC TUSD15FB TUSD24FB REV.2015.02.01 IT 3.0 02 | www.spsemi.cn ESD/TUSD** Series SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT REV.2015.02.01 03| www.spsemi.cn