TUSD03FB

ESD/TUSD** Series
Low Capacitance TVS Diode Array
APPLICATIONS
◆ Cell Phone Handsets and Accessories
◆ Microprocessor based equipment
SOD-323
◆ Personal Digital Assistants (PDA’s)
◆ Notebooks, Desktops, and Servers
◆ Portable Instrumentation
◆ Peripherals
◆ USB Interface
IEC COMPATIBILITY
◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
◆ IEC61000-4-4 (EFT) 40A (5/50ηs)
◆ IEC61000-4-5 (Lightning) 12A (8/20µs)
PIN CONFIGURATION
FEATURES
◆ 350 Watts Peak Pulse Power per Line (tp=8/20µs)
◆ Protects one I/O line (bidirectional)
◆ Low clamping voltage
◆ Working voltages: 3V, 5V, 8V, 12V, 15V, 24V
◆ Low leakage current
MECHANICAL CHARACTERISTICS
◆ JEDEC SOD-323 Package
◆ Molding Compound Flammability Rating : UL 94V-O
◆ Weight 5 Millgrams (Approximate)
◆ Quantity Per Reel : 3,000pcs
◆ Reel Size : 7 inch
◆ Lead Finish : Lead Free
REV.2015.02.01
01 | www.spsemi.cn
ESD/TUSD** Series
DEVICE CHARACTERISTICS
MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified)
SYMBOL
VALUE
UNITS
Peak Pulse Power (tp=8/20µs waveform)
PPP
350
Watts
Lead Soldering Temperature
TL
260 (10 sec.)
℃
Operating Temperature Range
TJ
-55 ~ 150
℃
TSTG
-55 ~ 150
℃
PARAMETER
Storage Temperature Range
ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified)
PART NUMBER
DEVICE
MARKING
VRWM
VB
(V)
(V)
(max.) (min.)
VC
IR
VC
(µA)
(pF)
(@A)
(max.)
(typ.)
@1A
(mA)
(max.) (max.)
CT
4.0
1
5.15
15.9
10
20
0.6
6.0
1
9.80
18.3
8
5
0.6
8.5
1
13.40
18.5
8
2
0.6
12.0
12.0
13.3
13.3
1
19.00
28.6
6
1
0.6
1.2
EC
15.0
16.7
1
24.00
31.8
5
1
0.6
HC
24.0
26.7
1
43.00
56.0
3
1
0.6
TUSD03FB
CC
TUSD05FB
AC
5.0
TUSD08FB
BC
8.0
TUSD12FB
LC12CI
DC
DC
TUSD15FB
TUSD24FB
REV.2015.02.01
IT
3.0
02 | www.spsemi.cn
ESD/TUSD** Series
SOD-323 PACKAGE OUTLINE & DIMENSIONS
* SOLDERING FOOTPRINT
REV.2015.02.01
03| www.spsemi.cn