TESD03FB

ESD/TESD** Series
BIDIRECTIONAL TVS DIODE ARRAY
APPLICATIONS
◆ Cell Phone Handsets and Accessories
◆ Microprocessor based equipment
SOD-323
◆ Personal Digital Assistants (PDA’s)
◆ Notebooks, Desktops, and Servers
◆ Portable Instrumentation
◆ Peripherals
◆ Pagers
IEC COMPATIBILITY
◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
◆ IEC61000-4-4 (EFT) 40A (5/50ηs)
◆ IEC61000-4-5 (Lightning) 21A (8/20µs)
PIN CONFIGURATION
FEATURES
◆ 320 Watts Peak Pulse Power per Line (tp=8/20µs)
◆ Protects one I/O or power line
◆ Low clamping voltage
◆ Working voltages: 3V, 5V, 12V, 15V, 18V, 24V and 36V
◆ Low leakage current
MECHANICAL CHARACTERISTICS
◆ JEDEC SOD-323 Package
◆ Molding Compound Flammability Rating : UL 94V-O
◆ Weight 5 Millgrams (Approximate)
◆ Quantity Per Reel : 3,000pcs
◆ Reel Size : 7 inch
◆ Lead Finish : Lead Free
REV.2015.02.01
01 | www.spsemi.cn
ESD/TESD** Series
DEVICE CHARACTERISTICS
MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified)
PARAMETER
SYMBOL
VALUE
UNITS
Peak Pulse Power (tp=8/20µs waveform)
PPP
320
Watts
Lead Soldering Temperature
TL
260 (10 sec.)
℃
Operating Temperature Range
TJ
-55 ~ 150
℃
TSTG
-55 ~ 150
℃
Storage Temperature Range
ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified)
PART NUMBER
DEVICE
MARKING
VRWM
VB
(V)
(V)
(max.) (min.)
IT
VC
VC
@1A
(mA)
(max.) (max.)
(@A)
IR
CT
(µA)
(pF)
(max.) (max.)
TESD03FB
2A
3
4
1
7.5
10.5
20
40
450
TESD05FB
2B
5
6
1
9.8
18
17
10
200
TESD12FB
2D
12
13.3
1
19
35
12
1
100
TESD15FB
2J
15
16.7
1
24
40
10
1
75
TESD18FB
2K
18
20.0
1
29
45
9
1
57
TESD24FB
2H
24
26.7
1
40
52
7
1
50
TESD36FB
2N
36
40
1
40
REV.2015.02.01
1
65
75
5
02| www.spsemi.cn
ESD/TESD** Series
SOD-323 PACKAGE OUTLINE & DIMENSIONS
* SOLDERING FOOTPRINT
REV.2015.02.01
03| www.spsemi.cn