F-215 BSE–020–01–F–D–A BTE–060–02–F–D–A BTE–040–02–L–D–A (0,80 mm) .0315" BTE, BSE SERIES BASIC BLADE & BEAM HEADER & SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?BTE or www.samtec.com?BSE Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: 2 A per pin (1 pin powered per row) Operating Temp Range: -55°C to +125°C Voltage Rating: 225 VAC with 5 mm Stack Height Max Cycles: 100 RoHS Compliant: Yes Processing: Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (020-080) (0,15 mm) .006" max (100-120) Board Stacking: For applications requiring more than two connectors per board or 80 positions or higher, contact [email protected] NO. OF POSITIONS PER ROW BTE Mates with: BSE Specify LEAD STYLE from chart –020, –040, –060, –080, –100, –120 No. of positions x (0,80) .0315 + (4,00) .1575 (5,97) .235 02 LEAD STYLE MATED HEIGHT* –01 –02 (5,00) .197 (8,00) .315 –K A (0,20) .008 LEAD STYLE A –01 (4,27) .168 –02 (7,21) .284 (0,76) .030 –TR = 10µ" (0,25 µm) Gold on contact, Matte Tin on tail = Tape & Reel (60 positions maximum) –C* = Electro-Polished Selective 50µ" (1,27 µm) min Au over 150µ" (3,81 µm) Ni on Signal Pins in contact area, Matte Tin over 50µ" (1,27 µm) min Ni on all solder tails *Note: –C Plating passes 10 year MFG testing (0,89) .035 DIA • Passes 10 year MFG NO. OF POSITIONS PER ROW BSE 01 PLATING OPTION D OTHER OPTION A Mates with: BTE –F *Processing conditions will affect mated height. = Gold Flash on contact, Matte Tin on tail –020, –040, –060, –080, –100, –120 ALSO AVAILABLE –L (MOQ Required) 30µ" (0,76 µm) Gold Edge Mount Capability Friction Lock option 11 mm, 14 mm, 16,10 mm, 19,10 mm, 22 mm, 25 mm and 30 mm Stack Height (Caution: Some automatic placement/ inspection machines may have component height restrictions. Please consult machinery specifications.) Contact Samtec. = (7,00 mm) .275" DIA Polyimide Film Pick & Place Pad = Gold Flash on contact, Matte Tin on tail (7,11) .280 For complete scope of recognitions see www.samtec.com/quality MATED HEIGHT OTHER OPTION A –F (0,80) .0315 RECOGNITIONS D –L 01 (3,94) .155 PLATING OPTION LEAD STYLE –TR = Tape & Reel (80 positions maximum) = 10µ" (0,25 µm) Gold on contact, Matte Tin on tail • • • • –C* No. of positions x (0,80) .0315 + (5,27) .2075 02 (6,22) .245 (3,81) (7,24) .150 .285 01 (3,05) .120 = Electro-Polished Selective 50µ" (1,27 µm) min Au over 150µ" (3,81 µm) Ni on Signal Pins in contact area, Matte Tin over 50µ" (1,27 µm) min Ni on all solder tails *Note: –C Plating passes 10 year MFG testing (0,80) .0315 (3,25) .128 (0,15) .006 (7,49) .295 (1,78) .070 Note: Some lengths, styles and options are non-standard, non-returnable. (0,76) .030 (0,89) .035 DIA WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice.