F-215 MIT–019–01–F–D MIT–038–01–F–D ® MIT–057–01–L–D (0,635 mm) .025" MIT SERIES MIXED TECHNOLOGY HEADER SPECIFICATIONS Board Mates: MIS For complete specifications and recommended PCB layouts see www.samtec.com?MIT Cable Mates: MICD Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Operating Temp Range: -55°C to +125°C Voltage Rating: 275 VAC Max Cycles: 100 RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (019-057) Board Stacking: For applications requiring more than two connectors per board contact [email protected] RECOGNITIONS Integral metal plane for power or ground 76 signal lines per linear inch Choice of mated heights • Mixed technology footprint MIT/MIS Type Rated @ 3dB Insertion Loss* 5 mm Stack Height Single-Ended Signaling –D 8.5 GHz / 17 Gbps Differential Pair Signaling –D 8.5 GHz / 17 Gbps Differential Pair Signaling –DP 9.5 GHz / 19 Gbps *Performance data includes effects of a non-optimized PCB. Performance data for other stack heights and complete test data available at www.samtec.com?MIT or contact [email protected] MIT NO. OF POSITIONS PER ROW For complete scope of recognitions see www.samtec.com/quality • Board Spacing Standoffs. See SO Series. LEAD STYLE Specify LEAD STYLE from chart –019, –038, –057 (38 total positions per bank) ALSO AVAILABLE (MOQ Required) PLATING OPTION –K –F = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails –L = (7,00 mm) .275" DIA Polyimide film Pick & Place Pad –TR = Tape & Reel (No. of Positions/19) x (12,70) .500 + (11,43) .450 (12,70) .500 02 = Electro-Polished Selective 50µ" (1,27 µm) min Au over 150µ" (3,81 µm) Ni on Signal Pins in contact area, 10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1,27 µm) min Ni on all solder tails (5,97) .235 (7,11) .280 (0,20) .008 STACK HEIGHTS LEAD MATED A STYLE HEIGHT 01 –01 –02 (7,11) .280 (1,40) .055 Note: Some lengths, styles and options are non-standard, non-returnable. OTHER OPTION –C* (0,635) .025 *Note: –C Plating passes 10 year MFG testing D = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails • 11 mm, 16 mm, 18,75 mm and 22 mm stack height • 30µ" (0,76 µm) Gold • Differential Pair and “Partitionable” (combine differential & singleended banks in same connector) available. • 76, 95, 114 and 133 positions per row • Edge Mount Contact Samtec. OTHER SOLUTIONS Polarized A (0,58) .023 x (0,38) .015 (0,38) .015 Note: Rugged through-hole ground plane soldered to board (requires paste-over-hole, not press fit) for added retention to PCB. WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. (4,27) .168 (5,00) .197 (7,26) .286 (8,00) .315 Processing conditions will affect mated height.