MIXED TECHNOLOGY HEADER

F-215
MIT–019–01–F–D
MIT–038–01–F–D
®
MIT–057–01–L–D
(0,635 mm) .025"
MIT SERIES
MIXED TECHNOLOGY HEADER
SPECIFICATIONS
Board Mates:
MIS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MIT
Cable Mates:
MICD
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
275 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (019-057)
Board Stacking:
For applications requiring more
than two connectors per board
contact [email protected]
RECOGNITIONS
Integral metal plane
for power or ground
76 signal lines
per linear inch
Choice of
mated heights
• Mixed
technology
footprint
MIT/MIS
Type Rated @ 3dB Insertion Loss*
5 mm Stack Height
Single-Ended Signaling
–D
8.5 GHz / 17 Gbps
Differential Pair Signaling –D
8.5 GHz / 17 Gbps
Differential Pair Signaling –DP
9.5 GHz / 19 Gbps
*Performance data includes effects of a non-optimized PCB.
Performance data for other stack heights and complete
test data available at www.samtec.com?MIT or contact
[email protected]
MIT
NO. OF POSITIONS
PER ROW
For complete scope of
recognitions see
www.samtec.com/quality
• Board Spacing Standoffs.
See SO Series.
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
–019, –038, –057
(38 total positions per bank)
ALSO AVAILABLE
(MOQ Required)
PLATING
OPTION
–K
–F
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–L
= (7,00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
–TR
= Tape &
Reel
(No. of Positions/19) x (12,70) .500 + (11,43) .450
(12,70)
.500
02
= Electro-Polished Selective
50µ" (1,27 µm) min Au over
150µ" (3,81 µm) Ni on Signal Pins
in contact area, 10µ" (0,25 µm)
min Au over 50µ" (1,27 µm) Ni
on Ground Plane in contact area,
Matte Tin over 50µ" (1,27 µm) min
Ni on all solder tails
(5,97)
.235
(7,11)
.280
(0,20)
.008
STACK HEIGHTS
LEAD
MATED
A
STYLE
HEIGHT
01
–01
–02
(7,11)
.280
(1,40)
.055
Note: Some lengths, styles
and options are non-standard,
non-returnable.
OTHER
OPTION
–C*
(0,635)
.025
*Note: –C Plating passes
10 year MFG testing
D
= 10µ" (0,25 µm) Gold on
Signal Pins and Ground Plane,
Matte Tin on tails
• 11 mm, 16 mm,
18,75 mm and 22 mm
stack height
• 30µ" (0,76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & singleended banks in same
connector) available.
• 76, 95, 114 and 133
positions per row
• Edge Mount
Contact Samtec.
OTHER SOLUTIONS
Polarized
A
(0,58) .023 x (0,38) .015
(0,38)
.015
Note: Rugged through-hole ground plane soldered to board
(requires paste-over-hole, not press fit) for added retention to PCB.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
(4,27) .168 (5,00) .197
(7,26) .286 (8,00) .315
Processing conditions will
affect mated height.