F-215 SS5–20–3.00–L–D–K–TR SS5–10–3.00–L–D–K–TR TM SS5–20–3.50–L–D–K–TR LP SYSTEM (0,50 mm) .0197" SS5 SERIES ULTRA FINE PITCH SOCKET SPECIFICATIONS Mates with: ST5 For complete specifications and recommended PCB layouts see www.samtec.com?SS5 Insulator Material: Black LCP Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Operating Temp Range: -55°C to +125°C Current Rating: 1.5 A per pin (1 pin powered per row) RoHS Compliant: Yes Stack heights of 4 mm, 4,5 mm & 5 mm Ultra-fine (0,50 mm) .0197" pitch SS5/ST5 Rated @ 3dB Insertion Loss* 5 mm Stack Height Single-Ended Signaling 13.5 GHz / 27 Gbps Differential Pair Signaling 20 GHz / 40 Gbps *Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?SS5 or contact [email protected] Processing: Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max SS5 NO. OF POSITIONS Narrow body design saves space on board LEAD STYLE PLATING OPTION D K TR ALSO AVAILABLE (MOQ Required) –L –3.00 • Other lead styles Contact Samtec. = 10µ" (0,25 µm) Gold on contact, Matte Tin on tail = 3.00 mm –10, –15, –20, –30, –40, –50, –60, –70, –80 –3.50 = 3.50 mm (Required in callout) –K = (3,50 mm) .138" DIA Polyimide Film Pick & Place Pad (Per Row) 01 MATED HEIGHT* (4,35) .171 (0,50) .0197 SS5 LEAD STYLE ST5 LEAD STYLE –3.00 –3.50 –1.00 (4,00) .157 (4,50) .177 –1.50 (4,50) .177 (5,00) .197 LEAD STYLE 02 –3.00 –3.50 A B (2,85) .112 (3,35) .132 (3,50) .138 (4,00) .157 No. of positions per row x (0,50) .0197 + (3,54) .139 *Processing conditions will affect mated height. (3,50) .138 (0,15) .006 B A (5,00) .197 Note: Some lengths, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. (Required in callout) –TR = Tape & Reel