SANGDEST MICROELECTRONICS MBRS360 Technical Data Data Sheet N0865. Rev. - Green Products MBRS360 SCHOTTKY RECTIFIER Applications: z z z z z z Switching power supply Converters Free-Wheeling diodes Reverse battery protection Disk drives Battery charging Features: z z z z z z z z Small foot print, surface mountable Very low forward Voltage Drop High frequency operation Guard ring for enhanced ruggedness and long term reliability Green Products in Compliance the ROHS Directive This is a Pb − Free Devic All SMC parts are traceable to the wafer lot Additional testing can be offered upon request Mechanical Dimensions: In mm / Inches SMC • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS MBRS360 Technical Data Data Sheet N0865. Rev. - Green Products Marking Diagram: Where XXXXX is YYWWL MBRS 3 60 YY WW L = Device Type = Forward Current (3A) = Reverse Voltage (60V) = Year = Week = Lot Number Cautions：Molding resin Epoxy resin UL:94V-0 Ordering Information: Device Package SMC (Pb-Free) MBRS360 Shipping 3000pcs / reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification. Maximum Ratings: Characteristics Peak Inverse Voltage Average Forward Current (per device) Peak One Cycle NonRepetitive Surge Current (per leg) Symbol Max. IF(AV) Condition 50% duty cycle @TC =118°C, rectangular wave form IFSM 8.3 ms, half Sine pulse VRWM • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 Units 60 V 3.0 A 80 A (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS MBRS360 Technical Data Data Sheet N0865. Rev. - Green Products Electrical Characteristics: Characteristics Forward Voltage Drop (per leg)* Reverse Current (per leg) * Symbol VF1 VF2 IR1 IR2 Junction Capacitance (per leg) * CT Condition @ 3A, Pulse, TJ = 25 °C @ 3A, Pulse, TJ = 125 °C @VR = rated VR TJ = 25 °C @VR = rated VR TJ = 125 °C @VR = 5V, TC = 25 °C fSIG = 1MHz Max. 0.57 0.51 1.0 Units V V mA 30 mA 180 pF Pulse Width < 300µs, Duty Cycle <2% Thermal-Mechanical Specifications: Characteristics Junction Temperature Storage Temperature Maximum Thermal Resistance Junction to Case Maximum Thermal Resistance, Case to Heat Sink Approximate Weight Case Style Symbol TJ Tstg RθJC Condition DC operation Specification -55 to +125 -55 to +150 12 Units °C °C °C/W RθCS - 46 °C/W wt - 0.65 g SMC • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS Technical Data Data Sheet N0865. Rev. - • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 MBRS360 Green Products (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS Technical Data Data Sheet N0865. Rev. - MBRS360 Green Products DISCLAIMER: 1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales department for the latest version of the datasheet(s). 2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment, medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by means of users’ fail-safe precautions or other arrangement . 3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information, products or circuits described in the datasheets. 4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any secondary damage resulting from use at a value exceeding the absolute maximum rating. 5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC Sangdest Microelectronics (Nanjing) Co., Ltd. 7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations.. • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •