v2 07/14 UVLUX270-3 ► Deep Ultraviolet Light Emission Source ► 275 nm, 1-3 mW ► 4 chip LED array ► Water Sterilization, DNA Sequencing Description UVLUX270-3 is a series of AlGaN based deep UV multi chip LED arrays, utilizing 4 parallel connected chip dies, with a typical peak wavelength of 270 nm and optical output power of 1-3 mW. It comes in hermetically sealed TO39 metal can package with hemispherical lens or flat glass window. UVLUX270-3 is widely used for forensic analysis, disinfection, water sterilization, protein analysis, DNA sequencing and drug discovery. Maximum Rating (T CASE = 25°C) Parameter Power Dissipation, DC* Forward Current (TA=25°C) Values Symbol Max. Min. PD IF Unit 600 mW 80 mA Operating Temperature TOPR - 30 + 55 °C Storage Temperature TSTG - 30 + 100 °C Soldering Temperature TSOL + 190 °C * Maximum dissipated power must not exceed 200mW without thermal management Electro-Optical Characteristics (T CASE = Parameter Peak Wavelength *1 Spectral Width (FWHM) Forward Voltage *2 Symbol λP Min. 270 ∆λ VF 25°C, IF = 80 mA) Values Typ. Max. Unit 275 280 nm 12 15 nm 6.2 7.5 V 3 mW *3 PO Beam Angle (hemispherical lens) 2Ө1/2 20 deg. Beam Angle (flat window) 2Ө1/2 120 deg. Radiated Power 1 *1wavelength measurement tolerance: ± 2 nm 2 * forward voltage measurement tolerance: ± 2 % 3 * output power measurement tolerance: ± 10 % Electrical Connection Bottom view: Pin # Function Pin 1 Anode Pin 2 Cathode Pin 3 Case www.roithner-laser.com Electrical layout: 1 Outline Dimensions FW - Flat window All dimensions in mm HL - Hemispherical lens All dimensions in mm Device Materials Part Header Leads Bonding wires Lens www.roithner-laser.com Material Fe-Ni alloy, plated Ni-Au Fe-Ni alloy, plated Ni-Au Au SiO2 2 Emission Characteristics FW - Flat window HL - Hemispherical lens www.roithner-laser.com 3 Precautions Soldering: • • • • • • • • • • Do avoid overheating of the LED Do avoid electrostatic discharge (ESD) Do avoid mechanical stress, shock, and vibration Do only use non-corrosive flux. Do only solder the leads. Soldering of header or cap will damage the LED Do only cut the leads at room temperature with an ESD protected tool Do not solder closer than 3 mm from base of the header Do form leads prior to soldering Do not impose mechanical stress on the header when forming the leads Do not apply current to the LED until it has cooled down to room temperature after soldering Recommended soldering conditions: dip soldering pre-heat time dipping time solder bath temperature hand soldering max 30 s max 5 s max 190 °C soldering time solder temperature max 5 s max 190 °C It is strongly advised to perform soldering at the shortest time and lowest temperature possible. Cleaning: Cleaning with isopropyl alcohol, propanol, or ethyl alcohol is recommended DO NOT USE acetone, chloroseen, trichloroethylene, or MKS DO NOT USE ultrasonic cleaners Static Electricity: UVTOP are sensitive to electrostatic discharge (ESD). Precautions against ESD must be taken when handling or operating these LEDs. Surge voltage or electrostatic discharge can result in complete failure of the device. UV-Radiation: During operation these LEDs do emit high intensity ultraviolet light, which is hazardous to skin and eyes, and may cause cancer. Do avoid exposure to the emitted UV light. Protective glasses are recommended. It is further advised to attach a warning label on products/systems that do utilize UV-LEDs: Class 1 Operation: Do only operate UVTOP LEDs with a current source. Running these LEDs from a voltage source will result in complete failure of the device. Current of a LED is an exponential function of the voltage across it. Usage of current regulated drive circuits is mandatory © All Rights Reserved The above specifications are for reference purpose only and subjected to change without prior notice www.roithner-laser.com 4