H2A1-H1050 IR High Power single chip LED H2A1-H1050 is a GaAlAs based, high power 1050 nm single chip LED in standard hexagonal Aluminum package for general application. Slots in the Aluminum-core PCB allow for easy mounting of standard collimating optics and are also suitable for M3 or M4 mounting screws. Large electrical interconnection pads on the PCB allow for convenient installation. Specifications • • • • • Structure: GaAlAs Peak Wavelength: 1050 nm Optical Output Power: typ. 50 mW Life Time: > 10.000 hours Housing: standard emitter package Absolute Maximum Ratings (Ta=25°C) Parameter Power Dissipation, DC Forward Current, DC Pulsed Current (1% duty cycle, 1kHz) Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature (max. 1,5 s) Symbol PD IF IFP UR Topr Tstg Tsol Value 1000 500 1000 -5 -30 … +70 -30 … +85 330 Unit mW mA mA V °C °C °C Electro-Optical Characteristics (Ta=25°C) Parameter Forward Current Viewing Angle CW Output Power Peak Wavelength Forward Voltage Half Width (FWHM) Symbol IF φ PO λP UF Δλ Condition IF = 350 mA IF = 350 mA IF = 350 mA IF = 350 mA IF = 350 mA Min. - - Typ. 350 ± 75 50 1050 1.2 47 Max. - - Unit mA deg. mW nm V nm Wavelength measurements tolerance is +/- 2% Output power measurement tolerance is +/- 10% Voltage measurement tolerance is +/- 2% Device Materials Item foundation Lens Electrodes PCB 13.08.2012 Material Plastic Acryl AgCu Al H2A1-H1050 1/4 Typical Performance Characteristics Normalized Output Power vs. Wavelength: Outline Dimensions Emitter: 13.08.2012 H2A1-H1050 2/4 Radiation Pattern (lambertian lens without optics) Relative Intensity vs. Angular Displacement Accessories Collimating optics, holders, reflectors 10158 + 10146, 2° half angle spot optic + optic holder 10048 + 10076, 4° half angle spot optic + optic holder 10003 + 10043, 6° half angle spot optic + optic holder 10003/15 + 10043, 15° half angle spot optic + optic holder 10003/25 + 10043, 25° half angle spot optic + optic holder CLP17CR, 6° metalized polycarbonate reflector CLP23CR, 20° metalized polycarbonate reflector 13.08.2012 H2A1-H1050 3/4 Soldering Conditions Reflow Soldering: APG2C1 LEDs have a maximum storage temperature of 85°. Therefor it is not possible to use a reflow soldering process for array assembly! Hot Bar Soldering: A Hot Bar Soldering process is recommended when soldering APG2C1 emitters. This process will only transfer heat to the leads and avoids overheating the emitter which will damage the device. In order to transfer sufficient heat from the hot bar to the device, following parameters must be carefully considered: • • • Amount of flux Pressing force of solder tip Hot bar temperature For the standard assembly process, following parameters should be maintained: • • • Hot Bar temperature: 330 °C Force of Hot Bar. 40 N Soldering time: 1.5 s It is recommended to use a copper nickel-plated hot bar mounted to standard temperature controlled soldering equipment. Manual Hand Soldering: For prototype build or small series production runs, it is possible to place and solder the emitters by hand. It is therefore recommended to maintain the following parameters: • • • Solder Tip Temperature 330 °C Soldering time. < 1.5 s Junction temperature must be kept below 70 °C A visual inspection may be used to check the quality of the sodler joint General Soldering Precautions: • • • 13.08.2012 Mechanical stress, shock and vibration must be avoided during soldering Only use non corrosive flux. Do not apply current to the device until it has cooled down to room temperature after soldering. H2A1-H1050 4/4