APG2C1-365-E High Power Single Chip LED APG2C1-365-E is a InGaN based, high power 365 nm single chip LED in standard emitter package for general application. Specifications • • • • • Structure: InGaN Peak Wavelength: 365 nm Optical Output Power: typ. 135 mW Life Time: > 10.000 hours Lead free product - RoHS compliant Absolute Maximum Ratings (Ta=25°C) Parameter Power Dissipation, DC Forward Current, DC Pulsed Current (1% duty cycle, 1kHz) Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature (max. 1,5 s) Symbol PD IF IFP UR Topr Tstg Tsol Value 1000 500 1000 -5 -30 … +70 -30 … +85 330 Unit mW mA mA V °C °C °C Electro-Optical Characteristics (Ta=25°C) Parameter Forward Current Viewing Angle CW Output Power Peak Wavelength Forward Voltage Half Width (FWHM) Symbol IF φ PO λP UF Δλ Condition IF = 350 mA IF = 350 mA IF = 350 mA IF = 350 mA IF = 350 mA Min. - Typ. 350 ± 75 135 365 3.8 15 Max. - Unit mA deg. mW nm V nm Wavelength measurements tolerance is +/- 2% Output power measurement tolerance is +/- 10% Voltage measurement tolerance is +/- 2% Device Materials Item Foundation Lens Electrodes Heat Sink 13.08.2012 Material Plastic Silicone resin AgCu AgCu APG2C1-365-E 1/4 Typical Performance Characteristics Normalized Output Power vs. Wavelength: Outline Dimensions Emitter: 13.08.2012 APG2C1-365-E 2/4 Radiation Pattern (lambertian lens without optics) Relative Intensity vs. Angular Displacement Accessories Reflectors CLP17CR, 6° metalized polycarbonate reflector CLP23CR, 20° metalized polycarbonate reflector Static Electricity LEDs are very sensitive to static Electricity and surge voltage. It is recommended to wear a wristband or an anti-electrostatic glove whenever handling the LEDs All devices, equipment, and machinery that is used when handling the LEDs must be grounded properly. Heat Generation It is advised to operate these LEDs at a reasonable low temperature for long lifetime and stability. High operating temperature will result in premature degradation and shortened lifetime. 13.08.2012 APG2C1-365-E 3/4 Soldering Conditions Reflow Soldering: APG2C1 LEDs have a maximum storage temperature of 85°. Therefor it is not possible to use a reflow soldering process for array assembly! Hot Bar Soldering: A Hot Bar Soldering process is recommended when soldering APG2C1 emitters. This process will only transfer heat to the leads and avoids overheating the emitter which will damage the device. In order to transfer sufficient heat from the hot bar to the device, following parameters must be carefully considered: • • • Amount of flux Pressing force of solder tip Hot bar temperature For the standard assembly process, following parameters should be maintained: • • • Hot Bar temperature: 330 °C Force of Hot Bar. 40 N Soldering time: 1.5 s It is recommended to use a copper nickel-plated hot bar mounted to standard temperature controlled soldering equipment. Manual Hand Soldering: For prototype build or small series production runs, it is possible to place and solder the emitters by hand. It is therefore recommended to maintain the following parameters: • • • Solder Tip Temperature 330 °C Soldering time. < 1.5 s Junction temperature must be kept below 70 °C A visual inspection may be used to check the quality of the solder joint General Soldering Precautions: • • • 13.08.2012 Mechanical stress, shock and vibration must be avoided during soldering Only use non corrosive flux. Do not apply current to the device until it has cooled down to room temperature after soldering. APG2C1-365-E 4/4