Data Sheets - Skyworks Solutions, Inc.

DATA SHEET
SKY65135-31: 2.4-2.5 GHz WLAN Power Amplifier
Applications
Description
• IEEE 802.11 b/g WLANs
The SKY65135-31 is a Microwave Monolithic Integrated Circuit
(MMIC) Power Amplifier (PA) with superior output power, linearity,
and efficiency. These features make the SKY65135-31 ideal for
Wireless Local Area Network (WLAN) applications. The high
linearity (low EVM) and high efficiency of this device makes it ideal
for use in the transmit chain of WLAN access points or modems.
• ISM band transmitters
• WCS fixed wireless
• Wireless access nodes
Features
• EVM < 2.8% for POUT > +27 dBm
• High gain = 31 dB
• Internal RF match with DC block and active bias circuits
• Single DC supply = +5 V
• Operating temperature = –40 °C to +85 °C
• Small, MCM (20-pin, 6 x 6 mm) package (MSL3, 260 °C per
JEDEC J-STD-020)
Figure 1. SKY65135-31 Block Diagram
The SKY65135-31 is fabricated using Skyworks high reliability
Heterojunction Bipolar Transistor (HBT) InGaP process, which
allows for single supply operation while maintaining high
efficiency and good linearity. The device is internally matched and
mounted in a 20-pin, 6 x 6 mm Multi-Chip Module (MCM)
Surface-Mounted Technology (SMT) package, which allows for a
highly manufacturable low cost solution.
A functional block diagram is shown in Figure 1. The pin
configuration and package are shown in Figure 2. Signal pin
assignments and functional pin descriptions are provided in
Table 1.
Figure 2. SKY65135-31 Pinout – 20-Pin MCM
(Top View)
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Table 1. SKY65135-31 Signal Descriptions
Pin #
1
GND
2
3
Description
Pin #
Name
Description
Ground
11
VCC3
Stage 3 collector voltage
GND
Ground
12
N/C
No connection
N/C
No connection
13
VCC2
Stage 2 collector voltage
4
VC_BIAS
Bias voltage
14
V_DET
Detector output signal
5
VREF1
Bias reference voltage 1
15
VCC_DET
Detector supply voltage
6
VREF2
Bias reference voltage 2
16
VCC1
Stage 1 collector voltage
7
VREF3
Bias reference voltage 3
17
GND
Ground
8
GND
Ground
18
RF_IN
RF input
9
RF_OUT
RF output
19
GND
Ground
GND
Ground
20
GND
Ground
10
Note:
Name
The center attachment pad must have a low inductance and low thermal resistance connection to the printed circuit board ground plane.
Functional Description
The SKY65135-31 is a three-stage, HBT InGaP device optimized
for high linearity and power efficiency. It contains all of the needed
RF matching and DC biasing circuits. An in-module active bias
circuit is included within the device for all three amplifier stages,
which provides excellent gain tracking over temperature and
voltage variations.
The first, second, and third output stages are independently
supplied using the VCC1, VCC2, and VCC3 signals (pins 16, 13 and
11,respectively). The DC control voltage that sets the bias for all
three stages is supplied by the VC_BIAS signal (pin 4). The
Evaluation Board includes shunt decoupling capacitors on these
pins to suppress any possible bias affect on the RF signal at low
frequencies.
The bias reference voltages for stages 1, 2, and 3 are supplied
using the common lines VREF1, VREF2, and VREF3 (pins 5, 6, and
7, respectively). The maximum voltage for these pins is 4 V.
Resistors R1, R2, and R3 on the Evaluation Board set the correct
bias to these pins when attached to a 5 V power supply.
The SKY65135-31 includes an output power detector voltage,
V_DET, at pin 14. A bias voltage is required to operate the
detector. The detector supply voltage is provided through the
VCC_DET signal (pin 15). The maximum voltage for this pin is 4 V.
Resistor R5 on the Evaluation Board sets the correct bias to this
pin when attached to a 5 V power supply.
Pin 18 is the RF input and Pin 9 is the RF output. External DC
blocking or RF matching is not required on the RF input and
output. Grounding is through several ground pins and the package
center ground.
These features make the device suitable for wideband digital
applications where PA linearity and power consumption are of
critical importance (e.g., WLANs). The device has been
characterized with the highest specified data rates for 802.11b
(11 Mbps) and 802.11g (54 Mbps). Under these stringent test
conditions, the device exhibits excellent spectral purity and power
efficiency.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY65135-31 are provided
in Table 2. The recommended operating conditions are specified
in Table 3 and electrical specifications are provided in Table 4.
Performance characteristics for the SKY65135-31 are illustrated
in Figures 3 through 17.
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Table 2. SKY65135-31 Absolute Maximum Ratings (Note 1)
Parameter
Symbol
RF output power
Minimum
POUT
Maximum
Units
+28
dBm
Supply voltage (VCC, VC_BIAS) (Note 2)
VCC
5.5
V
Total supply current
ICC
850
mA
Reference voltage (Note 2)
VREF
4
V
4
V
Power dissipation
PD
3.3
W
Case temperature
TC
–40
+85
°C
Storage temperature
TSTG
–55
+125
°C
Junction temperature
TJ
+150
°C
Thermal resistance
ΘJC
20
°C/W
Detector supply voltage (VCC_DET) (Note 2)
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
Note 2: Voltage levels measured at the pins of the package. The Evaluation Board supply voltage levels may be different. Refer to the Evaluation Board schematic diagram in this document.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65135-31 Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
+27
Units
RF output power
POUT
Supply voltage (Note 1)
VCC, VC_BIAS
Reference voltage (Note 1)
VREF
2.5
V
Detector supply voltage (Note 1)
VCC_DET
3.6
V
Operating frequency
f
2412
Case temperature
TC
–40
4.5
5.0
+25
dBm
5.5
V
2462
MHz
+85
°C
Note 1: Voltage levels measured at the pins of the package. The Evaluation Board supply voltage levels may be different. Refer to the Evaluation Board schematic diagram in this document.
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Table 4. SKY65135-31 Electrical Specifications (Note 1) (Note 2)
(VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = 5 V, Characteristic Impedance [ZO] = 50 Ω,
TC = 25 °C, Frequency = 2.442 GHz, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
IEEE 802.11g Orthogonal Frequency Division Multiplexing Input Signal, Data Rate = 54 Mbps
Maximum transmit power
Error Vector Magnitude
+27
EVM
@ POUT = +27 dBm
|S21|
PIN = –25 dBm
2.0
dBm
2.8
%
Continuous Wave Input Signal
Small signal gain
Gain flatness
31
2.4 GHz to 2.5 GHz
Input return loss
|S11|
Output power @ 1 dB compression
OP1dB
32
dB
1.0
1.4
dB
–10
–8
dB
+31.5
+32.5
410
465
dBm
Quiescent current
ICCQ
No RF input
Operational current
ICC_OP
POUT = +27 dBm
500
mA
820
mA
Noise Figure
NF
Detector voltage
VDET
POUT = +27 dBm
0.80
0.95
V
2nd harmonics
2fo
CW input
–26
–22
dBm
3rd harmonics
3fo
CW input
–33
–30
dBm
5
0.75
dB
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Note 2: Voltage measured at Evaluation Board pins.
Typical Performance Characteristics
(VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = 5 V, CW, Characteristic Impedance [ZO] = 50 Ω,
TC = 25 °C, Frequency = 2.442 GHz, Unless Otherwise Noted)
Figure 3. Gain vs Output Power Over Frequency
Figure 4. Gain vs Output Power Over Voltage
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Figure 5. Small Signal Gain vs Frequency Over Temperature
@5V
Figure 6. Small Signal Gain vs Frequency Over VCC @ 25 °C
Figure 7. EVM vs Output Power Over Frequency
Figure 8. Current vs Output Power
Figure 9. Quiescent Current vs VCC Over Temperature
Figure 10. Current vs Output Power Over Temperature @ 5 V
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Figure 11. Supply Current vs Output Power Over Frequency
Figure 12. Supply Current vs Output Power Over VCC
Figure 13. Detector Voltage vs Output Power Over Frequency
Figure 14. Detector Voltage vs Output Power Over VCC
Figure 15. Spectral Response @ POUT = +30 dBm
(802.11g, OFDM, 64 QAM @ 54 Mbps)
Figure 16. Spectral Response @ POUT = +31 dBm
(802.11b, CCK @ 11 Mbps)
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Figure 17. Second Harmonic vs Output Power (802.11b)
Evaluation Board Description
The SKY65135-31 Evaluation Board is used to test the
performance of the SKY65135-31 PA. An Evaluation Board
schematic diagram is provided in Figure 18. An assembly drawing
for the Evaluation Board is shown in Figure 19.
An Evaluation Board layer detail drawing is shown in Figure 20.
Layer detail physical characteristics are noted in Figure 21.
Table 5 provides the Bill of Materials (BOM) list for Evaluation
Board components.
NOTE: A poor connection between the slug and ground increases
junction temperature (TJ), which reduces the lifetime of the
device.
Evaluation Board Test Procedure
Step 1: Connect a +5 V supply to the VCC1, VCC2, VCC3, VREF1,
VREF2, VREF3, VC_BIAS, and VCC_DET pins. If available,
enable the current limiting function of the power supply to
850 mA.
Circuit Design Considerations
Step 2: If desired, connect a voltage meter to the V_DET pin.
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
Step 3: Connect a signal generator to the RF signal input port. Set
it to the desired RF frequency at a power level of
–15 dBm or less to the Evaluation Board. DO NOT enable
the RF signal.
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65135-31 has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device. Therefore, design the connection to the ground pad to
dissipate the maximum wattage produced by the circuit board.
Multiple vias to the grounding layer are required.
3. Bypass capacitors should be used on the DC supply lines. An
RF inductor is required on the VCC supply line to block RF
signals from the DC supply. Refer to the schematic drawing in
Figure 18 for further details.
4. The RF lines should be well separated from each other with
solid ground in between traces to maximize input-to-output
isolation.
Step 4: Connect a spectrum analyzer to the RF signal output port.
Step 5: Enable the power supply.
Step 6: Enable the RF signal.
Step 7: Take measurements.
CAUTION: If the input signal exceeds the rated power, the
SKY65135-31 Evaluation Board can be permanently
damaged.
NOTE: It is important to adjust the VCC voltage source so that
+5 V is measured at the board. The high collector currents
will drop the collector voltage significantly if long leads are
used. Adjust the bias voltage to compensate.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Figure 18. SKY65135-31 Evaluation Board Schematic
Figure 19. SKY65135-31 Evaluation Board Assembly Diagram
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Figure 20. SKY65135-31 Evaluation Board Layer Detail
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Figure 21. Evaluation Board Layer Detail Physical Characteristics
Table 5. SKY65135-31 Evaluation Board Bill of Materials
Component
Value
Size
Product #
Manufacturer
Manufacturer’s Part #
Characteristics
C1, C2, C6
3300 pF
0603
5404R28-015
Murata
GRM188R71H332KD01J
C5, C7, C8, C10
8.2 pF
0603
5404R98-010
Murata
GRM1885C1H8R2CZ01D
C0G, 50 V, ±0.25 pF
C11, C15, C16, C17
10 μF
0603
5404R91-005
TDK
C3216X5R0J106KT
X5R, 6 V, ±10%
L2
27 nH
0603
5332R34-030
Taiyo-Yuden
HK160827NJ-T
±5%, SRF 3400 MHz
R1
680 Ω
0603
5424R20-045
Rohm
MCR03EZHUJ680
50 V, 0.063 W, ±5%
R2, R3
200 Ω
0603
5424R20-032
Rohm
MCR03EZHUJ200
50 V, 0.063 W, ±5%
R5
300 Ω
0603
5424R20-036
Rohm
MCR03EZHUJ300
50 V, 0.063 W, ±5%
Application Circuit Notes
Center Ground. It is extremely important to sufficiently ground the
bottom ground pad of the device for both thermal and stability
reasons. Multiple small vias are acceptable and will work well
under the device if solder migration is an issue.
GND (pins 1, 2, 8, 10, 17, 19, and 20). Attach all ground pins to
the RF ground plane with the largest diameter and lowest
inductance via that the layout allows. Multiple small vias are
acceptable and will work well under the device if solder migration
is an issue.
N/C (pins 3 and 12). These pins are open and may or may not be
connected to ground.
VC_BIAS (pin 4). The bias supply voltage for stages 1 and 2,
typically set to +5 V.
VREF1 (pin 5). Bias reference voltage for amplifier stage 1. This
signal should be operated over the same voltage range as VCC
with a nominal voltage of +5 V.
VREF2 (pin 6). Bias reference voltage for amplifier stage 2. This
signal should be operated over the same voltage range as VCC
with a nominal voltage of +5 V.
VREF3 (pin 7). Bias reference voltage for amplifier stage 3. This
signal should be operated over the same voltage range as VCC
with a nominal voltage of +5 V.
X7R, 50 V, ±10%
RF_OUT (pin 9). Amplifier RF output pin (ZO = 50 Ω). The module
includes an onboard internal DC blocking capacitor. All impedance
matching is provided internal to the module.
VCC3 (pin 11). Supply voltage for the output (final) stage collector
bias (typically +5 V). To bypass VCC3, capacitors C10 and C17
(see Figure 15) should be placed in the approximate location
shown on the Evaluation Board, although exact placement is not
critical.
VCC2 (pin 13). Supply voltage for the second stage collector bias
(typically +5 V). To bypass VCC2, capacitors C8 and C16 (see
Figure 15) should be placed in the approximate location shown on
the Evaluation Board, although exact placement is not critical.
V_DET (pin 14). The output power detector voltage signal. The
detector load and settling time constant are set external to the
device. Inductor L2 and capacitor C7 (see Figure 18) are set to
yield a settling time of < 0.5 μs.
VCC_DET (pin 15). The power detector supply voltage signal.
Resistor R5 and capacitor C5 (see Figure 18) are used for proper
bias and bypassing of this pin.
VCC1 (pin 16). Supply voltage for the first stage collector bias
(typically +5 V). To bypass VCC1, capacitors C5 and C15 (see
Figure 15) should be placed in the approximate location shown on
the Evaluation Board, although exact placement is not critical.
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
RF_IN (pin 18). Amplifier RF input pin (ZO = 50 Ω). The module
includes an onboard internal DC blocking capacitor. All impedance
matching is provided internal to the module.
Package Dimensions
The PCB layout footprint for the SKY65135-31 is shown in
Figure 22. Typical case markings are shown in Figure 23.
Package dimensions for the 20-pin MCM are shown in Figure 24,
and tape and reel dimensions are provided in Figure 25.
Package and Handling Information
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
THE SKY65135-31 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 °C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
Figure 22. SKY65135-31 PCB Layout Footprint
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Figure 23. SKY65135-31 Typical Case Markings
Figure 24. SKY65135-31 20-Pin MCM Package Dimensions
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Figure 25. SKY65135-31 20-Pin MCM Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65135-31 POWER AMPLIFIER
Ordering Information
Model Name
SKY65135-31 WLAN Power Amplifier
Manufacturing Part Number
SKY65135-31
Evaluation Board Part Number
TW16-D280-031
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