Apply Cu bonding wire on AME1117 SOT-223 package

Product Change Notices
PCN No.: 20110802
Date: September 1, 2011
Subject: Apply Cu bonding wire on AME1117 SOT-223 package
This is to inform you that Cu bonding wire will be applied on the AME1117 SOT-223
series with below conditions:
1. AME to ensure "Electrical Characteristic" of Cu bonding wire package is 100%
compliance AME1117 specifications.
2. AME qualified this new material package reliability.
3. The Part Number of each product is unchanged, but identification through D/C is
available.
This notification is for your information and concurrence.
If you require AME Qual/Rel data or samples to qualify this change, please contact AME,
Inc. directly or AME’s authorized Sales Representative or Distributor.
Please note this PCN will be effective after 30 days of issuing date automatically If
we do not receive any response, comment or questions from you within 30
calendar days.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Bill Chou – Director, Engineering Department I
Email: [email protected]
Phone: +886.2.2627.8687 # 2110
Expected 1st Device Shipment Date: 10/1/2011
Effective Year/Work Week of Changed Product: NA
AME1117 SOT-223 series Part Number – Au bonding wire
AME1117 SOT-223 series Part Number – Cu bonding wire
Reason of Change:
Add Cu bonding wire to ensure the sufficient material source.
Qual/Rel Report:
Test Item
HTOL
ESD
Result
Description
MIL-STD-883F 1005.8 TSTRESS=125℃, Duration= 1000hrs Biased Pass
MIL-STD-883G
Human Body Model, Class 2,
Pass
Method 3015.7
2kV minimum
JEDEC
Machine Model, Class B,
Pass
EIA/JESD22-A115
200V minimum
Method
JESD22-C101C
Charged Device Model, Class II,
200V minimum
Latch-up
MSL
HTS
JEDEC STANDARD
Pass
Level A, 100mA minimum
Pass
J-STD-020C
85/85 168 hours, IR-reflow 3 cycles
Peak Temp.= 260℃
MSL1
JESD22-A103D
150℃, 1000 hrs
Pass
85℃,85% RH, 1000hrs
Pass
Pass
NO.78 MARCH 1997
IPC/JEDEC
THT (85/85) JESD22-A101C
PCT
JESD22-A102D
121℃, 100% RH, 2atm, 168hrs
TCT
JESD22-A104D
-65℃ ~ 150℃, 500 cycles, DWELL=15min Pass
Solderability J-STD-D02C
IR-reflow
JESD22-A113F
Temp.=260℃, Duration=5sec
Pass
See IR reflow Profile, Perform 3 cycles test Pass
REL-1117-A-A
Cu Wire Reliability Report
for
AME1117 SOT-223 Series Product
Approved by
Prepared by
Amy Shen
Jess Lin
Quality & Reliability Dept.
Manager
Quality & Reliability Dept.
Engineer
Conclusion:
The AME1117 SOT-223 series product has successfully met AME’s reliability
standard that is required on all AME, Inc products.
Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make
sure that all AME1117 SOT-223 series product will still meet AME’s reliability standard in
the future.
Table of Contents
I、General Description
II、Product Information
III、Failures In Time Calculation
IV、Product Reliability Test Result
V、Package Reliability Test Result
VI、IR-reflow Test Result
I、General Description:
The AME1117 is a 1A low-dropout positive voltage regulator. It is available in fixed and
adjustable output voltage versions. Over current and thermal protection are integrated
onto the chip. Output current will limit as while it reaches the pre-set current or
temperature limit. The dropout voltage is specified at 1.4V Maximum at full rated output
current. The AME1117 series provides excellent regulation over line, load and
temperature variations.
II、Product Information:
Product
Grade
or Option
A: ADJ
B: 2.5V
C: 3.3V
D: 5.0V
E: 1.8V
Operating Ambient
Temperature Range
C: 0OC to 70OC
Package Type
G: SOT-223
Number of
Pins
T: 3
Special Feature
Z: Lead Free
III、Failures In Time Calculation:
Use HTOL test information mentioned in sectionⅣ, FIT (Failures In Time) can be calculated as below:
FIT = ( x 2 (ν ,
CL )
× 10 9 ) /( 2 × S × H × AF ) = ( 4 .61 × 10 9 ) /( 2 × 77 × 1000 × 280 .59 )
=106.69 (pieces per 109 hours) @ 40℃ with 90% Confidence Level.
Where AF is acceleration factor setting activation energy to 1.0eV as zero failure.
IV、Product Reliability Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
HTOL
TSTRESS=125℃
77 pcs / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
3 pcs package pair / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
Duration= 1000hrs
Biased, Read at
168/504/1000 hours
ESD
Human Body Model
Pin-to-Pin test
Class 2, 2kV minimum
Machine Model
Pin-to-Pin test
Class B, 200V minimum
Charged Device Model
Class II, 200V minimum
Latch-up
Level A, 100mA minimum
V、Package Reliability Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
MSL
85/85 168 hours
22 pcs / 0 pcs
Level 1
77 pcs / 0 pcs
Pass
77 pcs / 0 pcs
Pass
77 pcs / 0 pcs
Pass
77 pcs / 0 pcs
Pass
5 pcs / 0 pcs
Pass
IR-reflow 3 cycles
Peak Temp.= 260℃
IPC/JEDEC J-STD-020C
HTS
Precondition NOTE 2
Temp.=150℃
Duration=1000 hours
Unbiased, Read at
1000 hours
THT
Precondition NOTE 2
Temp.=85℃, R.H.=85%
Duration=1000 hours
Unbiased,
Read at 1000 hours
PCT
Precondition NOTE 2
Temp.=121℃, R.H.=100%
15PSIG, Unbiased
Duration=168 hours
Read at 168 hours
TCT
Precondition NOTE 2
-65℃ ~ 150℃
500 cycles Unbiased,
Read at 500 cycles
Solderability
Temp.=260℃ (lead-free)
Duration=5sec
NOTE 2: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 260℃
VI、IR-reflow Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
IR-reflow
See IR reflow Profile
22 pcs / 0 pcs
Pass
Perform 3 cycles test
IR reflow Profile:
Profile Feature
Average Ramp-Up Rate
(Tsmax to Tp)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (tsmin to tsmax)
Time maintained above
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5℃ of actual Peak
Temperature (tp)
Ramp-Down Rate
Time 25℃ to Peak Temperature
Pb-Free Assembly
3℃/second max.
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
20~40 seconds
6℃/second max.
8 minutes max.