ZENIGATA LED Feb 10, 2015 SPECIFICATIONS MEGA ZENIGATA-LED GW6DME**XFC **:27,30,35,40,50 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc. Development DepartmentⅡ Lighting Device Division http://www.sharp-world.com/products/device/ Electronic Components And Devices Group SHARP CORPORATION sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ Handle this document carefully for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. When using the products covered herein, please observe the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting form failure to strictly adhere to these conditions and precautions. (1) Please do verify the validity of this part after assembling it in customer’s products, when customer wants to make catalogue and instruction manual based on the specification sheet of this part. (2) The products covered herein are designed and manufactured for the following application areas. When using the products covered herein for the equipment listed in paragraph (3), even for the following application areas, be sure to observe the precautions given in Paragraph (3). Never use the products for the equipment listed in Paragraph (4). Office electronics Instrumentation and measuring equipment Machine tools Audiovisual equipment Home appliances Communication equipment other than for trunk lines (3) These contemplating using the products covered herein for the following equipment which demands high reliability, should first contact a sales representative of the company and then accept responsibility for incorporating into the design fail-safe operation, redundancy, and other appropriate measures for ensuring reliability and safety of the equipment and the overall system. Control and safety devices for airplanes, trains, automobiles, and other transportation equipment Mainframe computers traffic control systems Gas leak detectors and automatic cutoff devices Rescue and security equipment Other safety devices and safety equipment, etc. (4) Do not use the products covered herein for the following equipment which demands extremely high performance in terms of functionality, reliability, or accuracy. Aerospace equipment Communications equipment for trunk lines Control equipment for the nuclear power industry Medical equipment related to life support, etc. (5) please direct all queries and comments regarding the interpretation of the above four Paragraphs to a sales representative of the company. sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ GW6DME**XFC Specifications 1. Application These specifications apply to the light emitting diode module Model No. GW6DME**XFC. [ LED module (InGaN Blue LED chip + Phosphor) ] Main application : Lighting 2. External dimensions and equivalent circuit Refer to Page 2. 3. Ratings and characteristics Refer to Page 3-6. 3-1. 3-2. 3-3. 3-4. Absolute maximum ratings Electro-optical characteristics Derating curve Characteristics diagram (TYP.) 4. Reliability Refer to Page 7. 4-1. Test items and test conditions 4-2. Failure criteria 5. Quality level Refer to Page 8. 5-1. Applied standard 5-2. Sampling inspection 5-3. Inspection items and defect criteria 6. Supplements 6-1. 6-2. 6-3. 6-4. Refer to Page 9-12. Chromaticity rank table Packing Label Indication printed on product 7. Precautions Refer to Page 13-16. 1 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 2．External dimensions and equivalent circuit 24.0 +0.50/-0.10① （18.6） (Unit：mm) 20.0 ±0.50/-0.10 ② （12.5） Top view 3.5±0.1 1.4±0.1 （Φ17.2） （Φ15.6） Side view （1.8） 1.0±0.1 （Note）Values inside parentheses are reference values. External sizes of①、②are determined by maximum dimensions, that include salient areas on the edges of respective sides. R Equivalent circuit ＋connection terminal －connection terminal 16 series × 10parallel ＝ 160 pcs of LEDs Unit Material Finish ｍｍ Substrate : Ceramics Lens : Silicone resin Terminal：Ag 2 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 3．Ratings and characteristics 3-1.Absolute maximum ratings Item Symbol Rating Unit Power Dissipation（※1,4） P 61.8 W Forward Current（※1,4） IF 1200 mA Reverse Voltage（※2,4） VR -15 V Operating Temperature（※3） Topr -30 ～ +100 ℃ Storage Temperature Tstg -40 ～ +100 ℃ Junction Temperature Tj 145 ℃ *1 Power dissipation and forward current are the values when the module temperature is set lower than the rating by using an adequate heat sink. *2 The maximum rating of reverse voltage is assumed, after considering the voltage that occur due to initial connection error that may occur suddenly. (Not dealing with the possibility of always-on reverse voltage.) *3 Operating temperature is the Case temperature Tc (Refer to measuring point for case temperature in the next page.) Refer to "Derating curve" in the next page as for operating current. *4 Tc = 25℃ 3 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 3-2.Electro-optical characteristics Item common 27 （Tj＝90℃） Symbol Condition Forward Voltage※5 VF I F =950mA Luminous Flux※６ Φ 43.5 （47.5） 51.5 V 3820 （4240） - lm - - （0.4150） - - - - （2720） - K General Color Rendering Index※8 Ra 80 （82） - - Luminous Flux※６ Φ - lm y I F =950mA 4040 （4480） - （0.4370） - - - （0.4030） - - - - （3000） - K General Color Rendering Index※8 Ra 80 （82） - - Luminous Flux※６ Φ - lm x Chromaticity Coordinates※７ y I F =950mA 4160 （4620） x - （0.4090） - - - （0.3930） - - - - （3440） - K General Color Rendering Index※8 Ra 80 （82） - - Luminous Flux※６ Φ - lm Chromaticity Coordinates※７ y I F =950mA 4320 （4790） x - （0.3820） - - - （0.3800） - - - - （3980） - K General Color Rendering Index※8 Ra 80 （82） - - Luminous Flux※６ Φ - lm Chromaticity Coordinates※７ y Color Temperature 50 Unit - Color Temperature 40 MAX. （0.4610） Color Temperature 35 TYP. - x Chromaticity Coordinates※７ Color Temperature 30 MIN. I F =950mA 4330 （4810） x Chromaticity Coordinates※７ - （0.3480） - - - （0.3600） - - - - （4920） - K Ra 80 （82） - - y Color Temperature General Color Rendering Index※8 I F =950mA (Note) Values inside parentheses are shown for reference purpose only. *5 (After 20 ms drive, Measurement tolerance: ± 3 %) *6 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400 (After 20 ms drive, Measurement tolerance: ± 10 %) *7 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400 (After 20 ms drive, Measurement tolerance: ± 0.005) *8 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400 (After 20 ms drive, Measurement tolerance: ± 2) 4 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 3-3.Derating curve Forward Current Derating Curve 1400 Forward Current I F [mA] 1200 1000 800 600 400 200 0 -30 -20 -10 0 10 20 30 40 50 60 Case Temperature Tc[℃] 70 80 90 100 110 (Note) To keep the case temperature lower than the rating enough heat-radiation performance needs to be secured by using an adequate heat sink(refer to section8-③). For soldering connection,please evaluate in your usage environment to make sure soldering reliability. (Above derating curve is specified to LED device,not for soldering connection) And please consider to avoid physical stress between wire and substrate, and some protection like silicon bond on top of soldered wire is recommended. Please ensure the maintenance of heat radiation does not exceed case temperature over the rating in operation. （Measuring point for case temperature） Please take note of the following,when measuring case temperature. 1 The LED device mounting surface should be flat/plain surface. 2 The substrate surface temperature should be uniform. measuring point Thermal Resistance：1.0℃/W（Typical value） 5 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 3-4.Characteristics diagram(TYP.) 140 120 100 80 60 40 20 1200 1000 800 600 400 200 0 0 0 200 400 600 Tj=90℃ 1400 Forward Current I F [mA] Relative Luminous Flux [%] Forward Voltage vs. Forward Current Forward Current vs. Relative Luminous Flux Tj=90℃ 800 1000 1200 1400 41.5 42.5 43.5 44.5 45.5 46.5 47.5 48.5 Forward Current I F [mA] Forward Voltage V F [V] Case Temperature vs. Relative Luminous Flux I F ＝ 950mA 52 100 Forward Voltage V F [V] Relative Luminous Flux [%] 120 80 60 40 20 0 0 30 60 Case Temperature vs.Forward Voltage I F ＝ 950mA 50 48 46 44 42 90 Case Temperature Tc [℃] 0 30 60 90 Case Temperature Tc [℃] （Note）Characteristics data shown here are for reference purpose only.(Not guaranteed data) 6 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 4．Reliability 4-1.Test items and test conditions No. 1 2 3 4 5 Test item Temperature Cycle Temperature Humidity Storage High Temperature Storage Low Temperature Storage Steady State Operaring Life Confidence level：90％ samples Defective Test conditions LTPD n C (%) -40℃（30 min）～ +100℃（30 min）,100cycles 11 0 20 Tstg=+60℃,RH=90%,Time=1 000 h 11 0 20 Tstg=+100℃,Time=1 000 h 11 0 20 11 0 20 11 0 20 5 0 50 5 0 50 Tstg=-40℃,Time=1 000 h Tc=90℃,I F =950mA,Time=1000 h 2 6 Shock Acceleration：15000m/s,Pulse width：0.5ms Direction：3 directions (X,Y and Z) Frequency：100 ～ 2000Hz for 4 minutes per trial 7 Vibration Acceleration：200m/s2 Direction：3 directions (X,Y and Z) 4 trials each direction 4-2.Failure criteria No. Parameter Symbol 1 2 Forward Voltage Luminous Flux VF Φ Failure criteria V F ＞Initial value×1.1 Φ ＜Initial value×0.7 7 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 5．Quality level 5-1.Applied standard (ISO2859-1) 5-2.Sampling inspection (A single normal sampling plan,level S-4) 5-3.Inspection items and defect criteria No. Item 1 No radiation 2 3 Defect criteria No light emitting Electro-optical Not conforming to the specification characteristics External (Forward voltage, Luminous flux and Chromaticity values) dimensions Appearance Major defect AQL 0.1 Not conforming to the specification (External dimensions of ①and②shown in Page2) Nonconformity observed in product appearance is determined 4 Classification as defective only when electro-optical characteristics is affected by. Minor <If any question arises regardless of above mentioned criterion> defect ■Foreign material,scratch, or bubble at emitting area:0.8mm 0.4 ■Fiber generation at emitting area:0.2mm ib width and 2.5mm inlengh ■Foreign material at connection terminal:0.8mmΦ ■Substrate burr on edge:Over dimension tolerance (Note) Products with removable foreign material attached on are not determined to be defective. (Note) Substrate cracks that do not effect the electrical/optical charecterustics are not determined to be defective. 8 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 6．Supplements 6-1.Chromaticity rank table (Tolerance：x,y±0.005) (I F =950mA,Tj=90℃) 2 700K Rank 1 x y Rank 1 Chromaticity coordinates Point 1 Point 2 Point 3 Point 4 0.4600 0.4555 0.4620 0.4665 0.4200 0.4100 0.4100 0.4200 x y x y 1 (I F =950mA,Tj=90℃) Rank x y 1 Chromaticity Point 1 Point 2 0.3810 0.3765 0.3850 0.3750 x y Chromaticity Point 1 Point 2 0.3175 0.3420 0.3650 0.3550 coordinates Point 3 Point 4 0.3485 0.3540 0.3550 0.3650 2 700K Chromaticity Diagram 3 000K Chromaticity Diagram 0.435 0.425 0.425 0.415 0.415 2800K 2700K 0.405 y y 1 2600K 1 0.395 3100K 0.395 0.440 coordinates Point 3 Point 4 0.3830 0.3875 0.3750 0.3850 (I F =950mA,Tj=90℃) Rank 0.405 Chromaticity coordinates Point 1 Point 2 Point 3 Point 4 0.4360 0.4315 0.4380 0.4425 0.4080 0.3980 0.3980 0.4080 4 000K Chromaticity coordinates Point 1 Point 2 Point 3 Point 4 0.4080 0.4035 0.4100 0.4145 0.3980 0.3880 0.3880 0.3980 5 000K 1 Rank (I F =950mA,Tj=90℃) 3 500K (I F =950mA,Tj=90℃) 3 000K 0.450 0.460 x 0.470 0.480 9 0.385 0.415 0.425 3000K 2900K 0.435 x 0.445 0.455 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 4 000K Chromaticity Diagram 0.415 0.400 0.405 0.390 0.395 y y 3 500K Chromaticity Diagram 0.380 1 1 0.385 0.370 3300K 3500K 4100K 3400K 0.375 0.390 0.400 0.410 x 0.420 0.430 0.360 0.360 4000K 0.370 3900K 3800K 0.380 x 0.390 0.400 5 000K Chromaticity Diagram 0.380 5200K 5000K 4800K 4600K y 0.370 0.360 1 0.350 0.340 0.330 0.340 0.350 x 0.360 0.370 10 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 6-2.Packing ・ One tray composed of 40 pieces ・ 5 trays(200 piecies)and one upper lid-tray in one moisture-proof bag ・ 2 bags(400 pieces) in one carton ・ Dimensions of outer carton:235×220×90mm (Reference value) (Note 1)Thre are cases of one carton composed of one bag (200 pieces) (Note 2) State of packing is dubject to change. ＜Outer carton＞ ＜One bag＞ 200 pieces×２bags＝400 pieces 40 pieces×5 trays＝200 pieces ＜One tray＞ 5×8＝40 pieces Silica gel Silica gel 11 (225mm) (210mm) sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 6-3.Label 1) Outer carton Following label is attached on outer carton. ・ Lot No.indication (Note 3) Label format is subjected to change. SHIPMENT TABLE PART No. GW6DME**XFC QUANTITY：400 SHARP MADE IN *********** ③Shipping month ←Lot No. 1 CORPORATION ②Shipping year（Year last 2 digits） ←Quantity XX11B25 RANK ←Model number ←（Model number+ suffix code） (GW6DME**XFCM) LOT No. XX 11 B 25 ① ② ③ ④ ①Production plant code （from january to Doccmber in ABC order） ←Rank RC ←Production country ④Shipping date（01 ～ 31） ・ MADE IN **** ※Notation may be different ・ MADE IN **** SHARP LABEL ・ Lot No.indication 1)Moisture-Proof bag Following label is attached on moisture-proof bags. ①Production plant code (Note 3) Label format is subjected to change. SHIPMENT TABLE PART No. GW6DME**XFC QUANTITY：200 RANK １ LOT No. SHARP 5020G2064A CORPORATION MADE IN *********** ②Shipping year（Year last digit） ③Shipping month（1 ～ 9 or O,N,D） ←Model number ←（Model number+suffix code） (GW6DME**XFCM) ④Fixed code G ←Quantity ⑤Shipping date （01 ～ 31） ←Lot No. RC SHARP LABEL XX 1 9 G 11 123 A ① ② ③ ④ ⑤ ⑥ ⑦ ⑥Serial No. ←Production country ⑦Backup code A ・ MADE IN **** ・ MADE IN **** ※Notation may be different Model No. and control No. are indicated on substrate surface. １）Model No. Abbreviated Model No” 6DME**XFC” is indicated. ２）Control No. Indicated as follows; M 12 B 11 - 1 ① ② ③ ④ ⑤ ①Production plant code（to be indicated alphabetically） ②Year of production（the last two figures of the year） ③Month of production （to be indicated alphabetically with january corresponding to A） ④Date of production（01 ～ 31） ⑤Rank:Chromaticity rank is indicated as follows; Model No. Rank 1→1 12 Control No. sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 7．Precautions ① Storage conditions Please follow the conditions below. ・ Before opend:Temperature 5 ～ 30℃, Relative humidity less than 60%. (Before opened LED should be used within a year) ・ After opened:Temperature 5 ～ 30℃, Relative humidity less than 60%. (Please apply soldering within 1 week) ・ Avoid exposing to air with corrosive gas. If exposed, electrode surface would be damaged,which may affect soldering. ② Usage conditions This product is not designed for use under any of the following conditionds. Pleasecarefully check the performance and reliability well enough in case of using under any of the following conditions; ・ In a please with a lot of moisture,dew condensation,briny air, and corrosive gas. (CL,H2S,NH3,SO2,NOX,etc) ・ Under the direct sumlight,outdoor exposure,and in a dusty please. ・ In water, oil,medical finrd, and organic solvent. Please do not use component parts like rujbberwhich may contain sulfur(gasket packing, adhesive material,etc.) Please note that any strong acidic or alcoholic elements could effect the silicon resin used in the LED device. The heat and light released from the LED device,could generate halogen gas from the surounding materials,which may have adverse impact on the module.Before using please consider carefully about this issue. ③ Heat radiation and Installation If forward curent (IF) is applied to single-state module at any curent,there is a risk of damaging LED or emitting smoke,due to increase in temperature. Equip with specified heat radiator(heat sink),and avoid heart being stuffed inside the module. Material of substrate is alumina ceramic.IF installed inappropriately,trouble of insufficient heat radiation may occur,which may result in board cracks or lighting defects due to overheat. Please take particular notice for installation. Refer to the following cautions while installing the LED device on heat sink. ・ Apply thermolysis adhesive,adhesive sheet or peculiar connector when mounted on heat radiator. In case of applying adhesive or adhesive sheet only,check the effectiveness and reliability before fixing. If LED comes off from heat radiator,unusual temperature rise entails hazardous phenomena including device deterioration,comming off of solder at leads,and emitting smoke,slong with LED device deffects. 13 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ ・ When LED device is mechanically fixed or locked,Please take into consideration regarding the method of attachment due to fail from stress. ・ Please apply appropriate stress and design carefully,when fixing the LED device using holder. Any excessive or uneven stress could break LED deviceʼ s substrate. ・ Avoid convexly uneven boards. Convex board is subject to substrate cracking or debasement of heat release. ・ It is recommented to apply adhesive or adhesive sheet with high thermal conductivity for radiation of heat effectively. ・ Please take care about the influence of color change of adhesive or adhesive sheet in initial and long termperiod,which may affect light output or color due to change of reflectance from backside. ・ Any excessive or uneven stress on the ceramic substrate could break the substrate. Please design such that,proper/uniform stress is applied on the substrate,when fixing the LED device using a holder. ・ When fixing the LED device with a holder,please take note if any excessive or uneven stress is applied when pressing the substrate with holder.Due to this,the gap may arise between LED device and adhesive material,which may affect the heat dissipation of the device. ・ Do not touch resin part including white resin part on the surface of LED. No light emission may occur due to damage of resin or cutting wire of LEDs by outer force. When using tweezers,please handle by side part of ceramic or the specified area shown below. （0.9） （10.0） Handring area （4.8） ・ The outer edges of the substrate may be uneven in some cases. Please avoid choosing these areas as fixing points,while designing for installation. ・ In case of using heat radiation sheet or heat radiation adhesive,light reflection or absorption of these materials may influence the output of LED device. and hence careful consideration is required while choosing the radiation sheet ro adhesive. ④ Connecting method Use soldering for connections. Follow the conditioons mentioned below,to preserve the connection strength. ・ Use soldering iron with thermo controller(tip temperature 380℃,within 5 seconds per one place. 14 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ ・ Secure the solderwettability on whole solder pad and leads. ・ During the soldering process,put the ceramic board on materials whose conductivity is poor enough not to radiate heat of soldering. ・ Warm up(with using a heated plate) the substrate is recommended before soldering. (preheat condition:100℃～ 150℃,within 60sec) ・ Avoid touching any part of resin with soldering iron. ・ This product is not designed for reflow and flow soldering. ・ Avoid such lead arrangement as applying stress to solder-applied area. ・ Please do not detach solder and make re-solder. ・ Please solder evenly on each electrode. ・ Please prevent flux from touching to resin. ・ Do the soldering on stable stand.Avoid soldering on moving or vibrating objects. ・ Please avoid touching the soldering unit to resin. ⑤ Static electricity This product is subject to static electricity,so take measures like wearing wrist band to cope with it. Install circuit protection device to drive circuit, if necessary. ⑥ Drive method ・ Any reverse voltage cannot be applied to LEDs when they are in operation or not. Design a circuit so that any flow of reverse or forward voltage can not be applied to LEDs when they are out of operation. ・ Module is composed of LEDs connected in both series and parallel. Constant voltage power supply runs off more than specified current amount due to lowered VF caused by temperature rise.Constant current power supply is recommended to drive. ・ Be cautious while putting on/off the power supply,as excess current,excess voltage or reverse voltage may get injucted to the device in some cases. ⑦ Cleaning Avoid cleaning,since LED device may be effected in some cases by cleaning. ⑧ Color-tone variation Chromaticity of this product is monitored by integrating sphere right after the operation. Chromaticity varies depending on measuring method,light spread condition,or ambient temperature. Please verify your actual conditions before use. 15 sharp LD-E6-6-14-B Model No. GW6DME**XFC Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ ⑨ Safety ・ Looking directly at LEDs for a long time may result in hurting your eyes. ・ In case that excess curent(over ratings)is supplied to the device,hazardous phenomena including abnormal heat generation,emitting smoke,or catching fire can caused. Take appropriate measures to excess current and voltage. ・ In case of solder connecting method,there is a possibility of fatigue failure by heat. Please fix the leads in such case to protect from short circuit or leakage of electricity caused by contact. ・ Please confirm the safety standards or regulations of application devices. ・ Please be careful with substrate edges,that may injure your hands. ⑩ Other cautions Guarantee covers the compliance to the quality standards mentioned in the specifications, however it does not cover the compatibility with application of the end-use,including assembly and usage environment. In case any quality problems ocurred in the application of end-use,details will be separately discussed and determined between the parties hereto. 16 sharp LD-E6-6-14-B http://www.sharp-world.com/products/device/