ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB**QT1C **:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc. Development DepartmentⅡ Lighting Device Division http://www.sharp-world.com/products/device/ Electronic Components And Devices Group SHARP CORPORATION sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ ●Handle this document carefully it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. ●When using the products covered herein,please observe the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions. (1) Please do verify the validity of this part after assembling it in customerʼs products,when customer wants to make catalogue and instruction manual based on the specification sheet of this part. (2) The products covered herein are desigd and manufactured for the following application areas. When using the products covered herein for the equipment listed in paragraph(3),even for the following application areas, be sure to observe the precautions given in Paragraph(3). Never use the products for the equipment listed in Paragraph(4). ・Office electronics ・Instrumentation and measuring equipment ・Machine tools ・Audiovisual equipment ・Home appliances ・Communication equipment other than for trunk lines (3) These contemplating using the products covered herein for the following equipment which demands high reliability, should first contact a sales representative of the company and then accept responsibility for incorporating into the design fail-safe operation,redundansy, and other appropriate measures for ensuring reliability and safety of the equipment and the overall system. ・Control and safety devices for airplanes, trains,automobiles, and other transportation equipment ・Mainframe computers ・Traffic control systems ・Gas leak detectors and automatic cutoff devices ・Rescue and security equipment ・Other safety devices and safety equipment, etc. (4) Do not use the products covered herein for the followin equipment which demands extremely high performance in terms of functionality, reliability, or accuracy. ・Aerospace equipment ・Communications equipment for trunk lines ・Control equipment for the nuclear power industry ・Medical equipment related to life support, etc. (5) Please direct all queries and comments regarding the interpretation of the above four Paragraphs to a sales representative of the company. sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ GM2BB**QT1C Technical literature １．Application These technical literatures apply to light emitting diode Model No.GM2BB**QT1C. [ LED module (InGaN Blue LED chip + Phosphor) ] Main application : Lighting 2. External dimensions and equivalent circuit Refer to Page 2. 3. Ratings and characteristics Refer to Page 3-6. 3-1. 3-2. 3-3. 3-4. Absolute maximum ratings Electro-optical characteristics Derating curve Characteristics diagram (TYP.) 4. Reliability Refer to Page 7-8. 4-1. Test items and test conditions 4-2. Failure criteria 5. Quality level Refer to Page 9. 5-1. Applied standard 5-2. Sampling inspection 5-3. Inspection items and defect criteria 6. Supplements 6-1. 6-2. 6-3. 6-4. 6-5. Refer to Page 10-16. Chromaticity rank table Taping Label Packing Indication printed on product 7. Precautions Refer to Page 17-20. 1 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 2. External dimensions and equivalent circuit 2.4 2.8 ② ① （0.6） 2.8 （min.0.2） （1.9） TC Equivalent circuit ② -Cathode ① +Anode 2.8 2.8 （0.8） （2.4） ・ Unspecified tolerance to be ±0.2 This tolerance does not include dimensions of resin and substrate burr remained on edge. ・ Values inside parentheses are reference values. ・ Tc: Measurement point of case temperature Unit ｍｍ Finish Material Substrate : Ceramics Terminal：Au plating Lens : Silicone resin 2 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 3. Ratings and characteristics 3-1. Absolute maximum ratings Parameter Symbol Applied temperature [℃] Rating Operating temperature (Note 1) Tc - -30 to +100 ℃ Storage temperature (Note 2) Tstg - -40 to +100 ℃ Power dissipation (Note 3) P -30 ≦ Topr ≦ 85 384 mW - 85 ＜ Topr ≦ 100 15.6 mW/℃ IF -30 ≦ Topr ≦ 85 120 mA - 85 ＜ Topr ≦ 100 4.7 mA/℃ I FM -30 ≦ Topr ≦ 85 200 mA - 85 ＜ Topr ≦ 100 8.0 mA/℃ VR Tc=25 5 V Tsol - 350 ℃ Derating factor Forward current (Note 4) Derating factor Peak pulsed forward current Derating factor Derating factor Soldering temperature (Note 5) Unit (Note 1) The range of operating temperature is prescribed by case temperature, Case temperature (Refer to Page 2, External dimensions and equivalent circuit) (Note 2)Do not exceed specified temperature range under any packing condition. (Except when baking and soldering) (Note 3) The operating current value follows the derating curve. (Refer to Page5) (Note 4) Duty ratio = 1/10, Pulse width = 100 μs. (Note 5) Each terminal must be soldered with the soldering iron (under 60W) within 3 seconds (only once). Solder tip temperature: under 350℃ As for the reflow soldering profile, please refer to Page 19. 3 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 3-2. Electro-optical characteristics Parameter Forward voltage Luminous flux (Note 1) Chromaticity coordinates (Note 2) Color rendering index (Note 3) Symbol （Tc＝25℃） MIN. TYP. MAX. Unit VF - 3.0 3.2 V Φv - - lm ｘ Conditions I F =50mA - ｙ - Ra 80 See diagram below 3-2.1 - (83) 3-2.1 Fundamental characteristics in all models （Tc＝25℃） Colortemperature Typical of chromaticity Chromaticity Luminous flux Typ. coordinates Typ. diagram Typ. GM2BB65QT1C (6 500) (0.3123,0.3282) GM2BB57QT1C (5 700) (0.3287,0.3417) GM2BB50QT1C (5 000) (0.3447,0.3553) GM2BB45QT1C (4 500) (0.3611,0.3658) GM2BB40QT1C (4 000) (0.3818,0.3797) GM2BB35QT1C (3 500) (0.4073,0.3917) GM2BB30QT1C (3 000) (0.4338,0.4030) (17.0) GM2BB27QT1C (2 700) (0.4578,0.4101) (16.8) Model No. (18.5) (19.5) (19.5) 6-1 (18.8) Page 10 (18.5) (17.8) （IF＝50mA） (Note 1) Monitored by 8 inch integrating sphere of Sharp Standard. (After 20 ms drive) (Tolerance: ±10%) (Note 2) Measured by 8 inch integrating sphere of Sharp Standard. (After 20ms drive) (Tolerance: ±0.01) (Note 3) Measured by 8 inch integrating sphere of Sharp Standard. (After 20ms drive) (Tolerance: ±5) (Note 4) Values inside parentheses are indicated only for reference, and are not guaranteed. 4 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 3-3. Derating Curve Peak Pulsed Forward Current Derating Curve Peak Pulsed Forward Current I FM (mA) Forward Current Derating Curve Forward Current I F (mA) 150 120 100 80 50 0 -30 -40 -20 0 20 40 60 85 80 100 120 250 200 150 100 80 50 0 -30 -40 -20 0 20 40 60 85 80 100 120 Case Temperature Tc (℃) Case Temperature Tc (℃) Peak Pulsed Forward Current I FM (mA) Peak Pulsed Forward Current vs. Duty Ratio 250 (Tc=25 ℃) 200 150 120 100 50 0 1/10 1/10 1 Duty Ratio 5 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 3-4.Characteristics Diagram (TYP.) Forward Current vs. Forward Voltage Relative Luminous ｆlux vs. Forward Current (Tc=25 ℃) 120 100 F (mA) 200 150 100 50 0 (Tc=25 ℃) 140 Forward Current I Relative Luminous Flux (%) 250 0 50 100 80 60 40 20 0 2.0 150 2.5 3.0 3.5 4.0 Forward Voltage V F (V) Forward Current I F (mA) Relative Luminous flux vs. Case Temperature (I F = 50 mA) 150 Relative Luminous Flux (%) 140 130 120 110 100 90 80 70 60 50 -40 -20 0 20 40 60 80 100 120 Case Temperature Tc (℃) 6 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 4．Reliability 4-1. Test items and test conditions （Confidence level：90％） Samples Defective n C -40℃（30min）to +100℃（30min）,100cycles 22 0 10 Temperature humidity storage Tstg = +60℃,RH = 90%,Time = 1 000h 22 0 10 3 High temperature storage Tstg = +100℃,Time = 1 000h 22 0 10 4 Low temperature storage Tstg = -40℃,Time = 1 000h 22 0 10 5 Steady state operating life at room temperature Tc =25℃,I F = 120 mA,Time = 1 000h 22 0 10 6 Steady state operating life at high temperature Tc = +100℃,I F= 50mA,Time = 1 000h 22 0 10 7 Steady state operating life at high temperature and elevated humidity Tc = +60℃,RH=90%,I F = 120 mA,Time = 500h 22 0 10 8 Shock 11 0 20 No. Test items 1 Temperature cycle 2 Test conditions 2 Acceleration: 15 000 m/s2, Pulse width: 0.5 ms, Tc = +25 ℃ Direction: X, Y and Z, 3 trials in each direction 7 LTPD （％） sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. 9 Vibration 10 Resistance to soldering heat http://www.sharp-world.com/products/device/ Acceleration: 200 m/s2 Frequency: 100 to 2 000 Hz (round-trip) 4 min Tc = +25 ℃ Direction: X, Y and Z 4 trials in each direction 11 0 20 2 trials, under the reflow condition mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705/ESR-250 Solder/ Flux: M705/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) 11 Solderability (Solder dip) Pretreatment ①High temp. storage : 150℃, 1h ②PCT(105℃, 100%RH, 1.22×105Pa, 4h) Applied only to terminal part Soldering Temperature：Tsol=240℃±2℃, 3s, Dipping depth：0.2～0.25mm (After pretreatment, leave 2h or more at room temperature and humidity. Dipping flux in 3～5s and soldering) M705-221BM5-42-11 Solder: M705-221BM5-42-11 (SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the reflow condition mentioned in Page 23 Temperature cycle -40℃～+100℃(30min.), 100cycles 8 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 5．Quality level 5-1. Applied standard（ISO 2859-1） 5-2. Sampling inspection（A single normal sampling plan, level S-4） 5-3. Inspection items and defect criteria No. Inspection items 1 No radiation 2 Radiation color 3 Taping 4 Electro-optical characteristics 5 External dimensions 6 Appearance Defect criteria Classification AQL Major defect 0.1 Minor defect 0.4 No light emitting Different from the specified color Not conforming to the inserted direction shown in the specification Not satisfied with specified values for VF, IR, φ and chromaticity coordinates mentioned in Page 4 Not satisfied with specified dimensions in Page 2 Foreign substances and scratches of light emitting face which are obstructed light emitting condition. (Except removable foreign substance) Resin or substrate burr which is over 0.3mm Resin crack and terminal crack, which are over φ0.3 mm 9 sharp LD-E7-1-14-A Model No. GM2BB**QT1C http://www.sharp-world.com/products/device/ Contents in this technical document be changed without any notice due to the product modification. 6．Supplements 6-1. Chromaticity diagram of each model Rank Point1 （Tc=25℃） Point2 Point3 Point4 x y x y x y x y GM2BB65QT1C 0.3205 0.3481 0.3208 0.3304 0.3068 0.3113 0.3221 0.3261 GM2BB57QT1C 0.3376 0.3616 0.3207 0.3462 0.3222 0.3243 0.3366 0.3369 GM2BB50QT1C 0.3551 0.3760 0.3376 0.3616 0.3366 0.3369 0.3515 0.3487 GM2BB45QT1C 0.4006 0.4044 0.3736 0.3874 0.3670 0.3578 0.3898 0.3716 GM2BB40QT1C 0.4006 0.4044 0.3736 0.3874 0.3670 0.3578 0.3898 0.3716 GM2BB35QT1C 0.4299 0.4165 0.3996 0.4015 0.3889 0.3690 0.4147 0.3814 GM2BB30QT1C 0.4562 0.4260 0.4299 0.4165 0.4147 0.3814 0.4373 0.3893 GM2BB27QT1C 0.4813 0.4319 0.4562 0.4260 0.4373 0.3893 0.4593 0.3944 （I F =50mA Tolerance：±0.01） 0.450 0.400 GM2BB27QT1C (2 700K) CIE y GM2BB30QT1C (3 000K) GM2BB35QT1C (3 500K) 0.350 GM2BB40QT1C (4 000K) GM2BB45QT1C (4 500K) GM2BB50QT1C (5 000K) GM2BB57QT1C (5 700K) 0.300 0.250 0.300 GM2BB65QT1C (6 500K) 0.350 0.400 0.450 0.500 CIE x 10 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 6-2．Taping 6.2.1 Shape and dimensions of tape (Ref.) P2 P0 A Cathode Mark t3 t2 P1 Symbol Dimension [mm] Parameter Pocket (embossed) Sprocket hole A 3.13 Width B 3.13 Pitch P1 4.0 Diameter D0 1.5 Pitch P0 4.0 Accumulated error ±0.5 mm/ 10 pitch E 1.75 Dimension from the edge of the tape to the center of the sprocket hole P2 2.0 F 3.5 Width W1 5.3 Thickness t3 0.1 Width W0 8.0 Thickness t1 0.25 t2 2.6 Pocket position Carrier tape Remarks Length Sprocket hole position Cover tape Feeding direction W1 B W0 F E t1 Overall thickness of the taping 11 Measured at inside bottom square corner Dimension at the extension of the center lines of the pocket to the center line of the sprocket hole Including the thickness of cover and carrier tape sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ A B C 0.2 0.4 0.6 W Parameter Hub 0.8 t Label Flange 0.6 0.4 0.2 0.8 E U 6-2-2．Shape and dimensions of reel (Ref.) Symbol Dimension [mm] Diameter A 180 Thickness t 1.5 Clearance between the flanges W 10 External diameter B 60 Spindle hole diameter C 13 Width E 2.0 Depth U 4.5 Key slit Indication of Model No. etc. Remarks Dimension measured close to the core Label attached on flange (Model No., quantity, Lot No. etc.) Materials: Polystyrene 12 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 6-2-3．Taping technical specification Feeding direction Empty LEDs inside Leader(Empty) MIN. 160mm MIN. 400mm Cover tape separation F Cover Tape 0.1N ～ 1.0N（Θ＝10°以下） 0 ～ 10° Forward Tape speed：5mm/s Carrier Tape (1)Tape strength against bending: The radius of curvature should be more than 30 mm. If i bent at less than 30 mm, the cover may peel off. (2) Joint of the tape: No joint of cover tape or carrier tape in one reel (3) Quantity: 2 000 pcs. per reel (standard) (4) Product mass: Approx. 30mg (One piece of LED/ Reference value) (5) Others: ①There are no continuous empty pockets except leader and trailer part. ②The quantity of the products lacking should be less than 0.1% of total product quantity. ③Products should not be attached to the cover tape when it peeled off. 13 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 6-3．Label (on reel） EIAJC-3 compliant bar code (format e) label is attached on each reel. <Example> SHARP CORPORATION PART No. GM2BB□□ QT1C QUANTITY 2 000 ← Model No. ← Product quantity ← EIAJ C-3 Bar codes LOT No. XX12J19/ RANK ○△△－□ 〈EIAJ C-3〉 MADE IN XXXX ← LOT number and rank ← Production country <LOT Number> XX 12 J 19 ① ② ③ ④ ① Production plant code (to be indicated alphabetically) ② Year of production (the last two figures of the year) ③ Month of production (to be indicated alphabetically with January corresponding to A) ④ Date of production (01 to 31) <Rank> RANK○△△-□： ○ Luminous flux rank △△ Chromaticity rank □ Forward voltage rank 14 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 6-4．Packing 6-4-1．Moisture proof packing In order to avoid the absorption of humidity while transport and storage, the devices are packed in moisture proof aluminum bags. Aluminum bag Label SHIPMENT TABLE GM2BB□□QT1C PART No. QUANTITY. 2000 RANK LOT No. XXXXXXXXXXX SHARP CORPORATION M ADE IN XXXX Silica gel ○△△-□ R.C. (※１) SHARP LABEL Reel Label(EIAJ C-3 compliant) (Note 1) This mark indicates that this product is RoHS compliant product designed and manufactured in accordance with Sharp's Green Device Guidelines. 6-4-2．Recommended storage conditions Temperature: 5℃to 30 ℃ Relative humidity: 85% or less 6-4-3．Precautions after opening aluminum bags ①Please be sure to give them the soldering within 7 days under the following conditions. Temperature: 5 ℃to 30 ℃ Relative humidity: 60% or less ②Storage in a dry box is recommended in case that the products are not used for a long time after opened. Or repack the reels with a desiccative by the sealer and store them under the same conditions mentioned in 5.3.2. ③Please perform the baking treatment under the recommended conditions in the following cases; ・ The blue indicator of silica gel changes its color or fades. ・ 7days passed after opened under the specified storage conditions. ・ Products were stored out of storage condition. (Recommended baking conditions） ・ Products with taping Temperature: 60 ℃to 65 ℃, Time: 36 to 48 hours ・ Single piece of the products (on PCB or metallic tray) Temperature: 100 ℃to 120 ℃, Time: 2 to 3 hours. Avoid piling up the reels or applying stress to them during baking so as to protect from deformation. Please be sure to cool them to room temperature after baking. 15 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 6-5．Information on environmental impact substances 6-5-1．RoHS compliant product This product complies with the RoHS Directive (2011/65/EU) and manufactured in accordance with Sharp's Green Device Guidelines. 6-5-2. Information relating to China RoHS Product Information Notification based on Chinese law, Management Methods for Controlling Pollution by Electronic Information Products. Names and Contents of the Toxic and Hazardous Substances or Elements in the Products. Toxic and Hazardous Substances or Elements. Lead Mercury Cadmium Hexavalent Chromium Polybrominated Biphenyls Polybrominated Diphenyl Ethers (Pb) (Hg) (Cd) (Cr(VI)) (PBB) (PBDE) ○ ○ ○ ○ ○ ○ ○：indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006. ×：indicates that the content of the toxic and hazardous substance in at least one homogeneous material of the part exceeds the concentration limit requirement as described in SJ/T 11363-2006 standard. 6-5-3．Ozone Depleting Substances ・ This product does not contain the following Ozone Depleting Substances. ・ This product does not have a production line whose process requires the following Ozone Depleting Substances. ・ Restricted substances: CFCs, Halones, CCl4, and 1, 1, 1-Trichloroethane (Methyl chloroform) 16 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 7 Precautions 7-1．General handling ① The voltage must be applied to LED only as a forward direction. Moreover, please design circuit diagram considering no voltage gap between Anode and Cathode during off state. If the reverse voltage is applied to LED for a long term, the electro-migration is generated and there is a possibility of the short-circuit of the circuit. ② This product is sensitive for electrostatic voltageand surge voltage.Static electricity or surge voltage can deteriorate product and its reliability. Please make sure that all devices and equipments must be grounded. We recommend to built in zener diode or TVS(Transient Voltage Suppression) as protectioncircuit against static electricity. ③ This product is composed of blue LED chip and special phosphor. Color tone is possibleto vary in some degree, depending on the operating conditions such as ambient temperature or current amount. Also it is subject to variation due to the afterglow of the phosphor in pulse drive. So please verify the performancebefore use. ④ Do not look directly at LEDs with unshielded eyes, or damage to your eyes may result. ⑤ Materials with high thermal conductivity are used in this product in order to allow generated heat to escape effectively out of the product.Avoid locating other heat sources (ex. resistance, etc.) near the products on circuit board to protect the devices from the heatdamage. Please make sure that case temperature is always under 100 ℃ during operation, including the self-heating. ⑥ Since dust on the surface of the radiation part is hard to remove and may decrease the luminous intensity, please handle the products in a clean, non-dusty condition. ⑦ The lensof this product is formed with silicone resin. In the case of handling this device, please do not push the lens portion by the sharp tools. The crackandpeeloffof the lens, and the wire deformation are generated and it causes not lighting. ・ Especially do not apply the load from horizontal direction to the side of the lens of this product. ・ Please do not apply the static loadof 2.5N or more (1.4mmφor less)fromthe diagonal 45 degrees of this productslens portion to the direction of an optical axis. ⑧ This product is the small size andthe lens portion is formed by silicone resin, there isa possibilityto have damage by the external stress. 17 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ ・ In the case of the handling withthe tweezers In the case of the handling with the tweezers, please pick up the products with the sides of the ceramic substrate and do not touch the lens portion . ・ In the case of the mount of the product Please use this productafter confirming the mounting condition, 1.2mm 1.66mm because there is a possibility to have damage by the external stress when the load is applied by the collet of the mounter. Please see the recommended collet of this product as right picture. 2.6mm 3.2mm ⑨ Please make sure not to apply any external stress to resin after mounted as well.When the substrate bends after mounted, the product might be applied by an external stress, and thecrack will be generated in the soldering part. Please arrange the product in the direction not stressed for thewarp of the substrate after mounted. ⑩ Please do not pile the substrate after this product is mounted.This product will be damaged by the substrate, and it causes the crack ofthe lens and not lighting bythe inner-wire deformation or wiringdisconnection. ⑪ The products are not designed for the use under any of the following conditions. Please verify their performance and reliability well enough if you use under any of the following conditions; (1) In a place with a lot of moisture, dew condensation, briny air, and corrosive gas (Cl, H2S, NH3, SO2, NOX, etc.) (2) Under the direct sunlight, outdoor exposure, and in a dusty place (3) In water, oil, medical fluid, and organic solvents ⑫ Guarantee covers the compliance to the quality standards mentioned in the Specifications; however it does not cover the compatibility with application in the end-use, including assembly and usage environment. In case any quality problems occurred in the application of end-use, details will be separately discussed and determined between the parties hereto. 18 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ 7-2 Soldering This product is reflow ready model (within 2 times), but it is not ready for solder dipping. Reflow ① Package temperature at reflow soldering is defined in the Fig. below. However, even when it is under the profile condition, external stress can damage the internal packages. Please test your reflow method and verify the solderability before use. ② Giving the soldering process promptly after opened aluminum package is recommended. Soldering process must be completed including 2ndreflow as repairing within 7 days (Temperature: 5 ℃ to 30 ℃ Relative humidity: 60% or less) after opened. (Storage in a dry box after the first reflow is recommended.) ③ Recommended solder paste Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Temperature [℃] ④ Recommended Temperature Profile 260( MAX) 1 to 4℃/s 220 200 150 1 to 2.5℃/s 60s (MAX) 60 to 120s 5s (MAX) 1 to 4℃/s 25 Time [second] In order to secure the product reliability, it is recommended to control the peak temperature and temperature gradient. Moreover, since the thermal conduction to the products depends on the specification of the reflow machine, and the size and layout of the PCBs please test your solder conditions carefully. Moreover, after the reflow process, if the activator remains in the flux between anode and cathode, the remaining activator might react during high temperature operation, and the electro-migration is generated and there will be a possibility of a short-circuit. Please use it after confirming the electro-migration is not generated while mounted actual. 19 sharp LD-E7-1-14-A Model No. GM2BB**QT1C Contents in this technical document be changed without any notice due to the product modification. http://www.sharp-world.com/products/device/ ⑤ Recommended solder pad design We recommend the metal mask of thickness 0.15mm for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials of the PCBs etc. Please test and verify the solderability under the actual solder method. Moreover, it might have a risk of short-circuit (leakage) with the electro-migration by the remaining activator in the flux. Please make a suitable selection and test of the metal mask in terms of pitch size and thickness before mass production. 2.8 3.2 1.2 0.8 1.2 0.4 1.15 0.5 0.25 0.5 （Unit：mm） ⑥ Precautions for PCB backside dip process Please verify your conditions carefully in giving the dip process on the backside of the PCBs, since the warped boards caused by heat and heat itself affect the inside of the package. It is recommended to give the reflow process after dip process. Though it is also available to give the reflow process before the dip process, the interval of the two processes should be as short as possible. 7-3 Cleaning ・ Avoid cleaning the PCBs, since packages and resin are eroded by cleaning. Please use the soldering paste without need of cleaning. ・ Avoid ultrasonic cleaning. 20 sharp LD-E7-1-14-A http://www.sharp-world.com/products/device/