MBR0540T1/MBR0540T3 0.5A Surface Mount Schottky Power Rectifier Features · Guardring for Stress Protection · Very Low Forward Voltage · Epoxy Meets UL 94 V−0 @ 0.125 in · Package Designed for Optimal Automated Board Assembly · Pb−Free Packages are Available C H A B K M Mechanical Data L · · · · · Reel Options: 3,000 per 7 inch reel/8 mm tape Reel Options: 10,000 per 13 inch reel/8 mm tape Device Marking: B4 Polarity Designator: Cathode Band Weight: 11.7 mg (approximately) · Case: Epoxy Molded · Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable · Lead and Mounting Surface Temperature for Soldering Purposes: 260°C max. for 10 Seconds Maximum Ratings and Electrical Characteristics Rating SOD-123 Dim Min Max A 0.55 Typ B 1.40 1.70 C 3.55 3.85 H 2.55 2.85 J 0.00 0.10 K 1.00 1.35 L 0.25 0.40 M 0.10 0.15 0 8° α All Dimensions in mm @ TA = 25°C unless otherwise specified Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 40 V Average Rectified Forward Current (At Rated VR, TC = 115°C) IO 0.5 A Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = 115°C) IFRM 1.0 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 5.5 A Tstg, TC −55 to +150 °C TJ −55 to +150 °C dv/dt 1000 V/s Storage/Operating Case Temperature Range Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25°C) vF Maximum Instantaneous Forward Voltage (Note 3) (iF = 0.5 A) (iF = 1 A) IR Maximum Instantaneous Reverse Current (Note 3) (VR = 40 V) (VR = 20 V) 1. Mounted with minimum recommended pad size, PC Board FR4. 2. 1 inch square pad size (1 X 0.5 inch for each lead) on FR4 board. 3. Pulse Test: Pulse Width ≤ 250 s, Duty Cycle ≤ 2.0%. 1 of 3 TJ = 25°C TJ = 100°C 0.51 0.62 0.46 0.61 TJ = 25°C TJ = 100°C 20 10 13,000 5,000 V A IF, INSTANTANEOUS FORWARD CURRENT (AMPS) i F, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 10 25°C 1.0 TJ = −40°C TJ = 125°C TJ = 25°C TJ = 100°C 0.1 0.2 0.4 0.6 0.8 1.2 1.0 TJ = 100°C TJ = 25°C 0.1 0.4 0.2 0.6 0.8 1.0 1.2 Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 100E−3 10E−3 TJ = 125°C 1.0E−3 TJ = 125°C 10E−3 1.0E−3 TJ = 100°C 100E−6 100E−6 TJ = 100°C 10E−6 1.0E−6 TJ = 25°C 0 10 20 40 30 10E−6 100E−9 10 20 30 40 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current dc 0.7 FREQ = 20 kHz 0.6 SQUARE WAVE 0.5 Ipk/Io = 0.4 Ipk/Io = 5 0.3 Ipk/Io = 10 0.2 Ipk/Io = 20 0.1 0 0 VR, REVERSE VOLTAGE (VOLTS) 0.8 0 TJ = 25°C 1.0E−6 PFO , AVERAGE POWER DISSIPATION (WATTS) I O , AVERAGE FORWARD CURRENT (AMPS) TJ = 125°C VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) I R, MAXIMUM REVERSE CURRENT (AMPS) I R, REVERSE CURRENT (AMPS) 1.0 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 100E−3 100E−9 10 20 40 60 80 100 120 140 0.45 0.40 SQUARE WAVE 0.35 dc Ipk/Io = 0.30 Ipk/Io = 5 0.25 Ipk/Io = 10 0.20 Ipk/Io = 20 0.15 0.10 0.05 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (AMPS) Figure 5. Current Derating Figure 6. Forward Power Dissipation 2of3 0.8 TJ , DERATED OPERATING TEMPERATURE ( °C) 100 C, CAPACITANCE (pF) TJ = 25°C 10 R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) 0 1E+00 5.0 10 15 20 25 30 35 40 126 124 Rtja = 118°C/W 122 120 118 149°C/W 116 180°C/W 114 206°C/W 112 110 228°C/W 0 5.0 10 15 20 25 30 35 40 VR, REVERSE VOLTAGE (VOLTS) VR, DC REVERSE VOLTAGE (VOLTS) Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating* 50% 20% 1E−01 10% 5.0% 2.0% 1.0% 1E−02 Rtjl(t) = Rtjl*r(t) 1E−03 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1,000 10 100 1,000 T, TIME (s) R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) Figure 9. Thermal Response Junction to Lead 1E+00 50% 1E−01 20% 10% 5.0% 2.0% 1E−02 1.0% Rtjl(t) = Rtjl*r(t) 1E−03 0.00001 0.0001 0.001 0.01 0.1 1.0 T, TIME (s) Figure 10. Thermal Response Junction to Ambient 3of3