tm TE CH T6340A Low-Dropout, Constant-Current White LED with Dimming Control and Low Voltage Detect FEATURES GENERAL DESCRIPTION • Low Voltage Detection and Indication: T6340A provides the low-dropout bias supply and the high performance alternative solution for the white LEDs application. The build-in Low Voltage Detection and Indication function can provide the internal LED dimming. Morse Code S.O.S Signal and Single Flash Loop Flicker Function are supported with the significantly lower dropout voltage. The T6340A is available in TO-252, SOP-8 and SOT-23 lead-free package. Detect Voltage Level Options by External Resistor • Up to 700mA LED Bias Current • External Resistor to set Output Current • Simple LED Dimming Control • Build-in Morse Code S.O.S Signal and Single Flash Loop Flicker Function • Low Dropout Voltage • Low 0.05uA Shutdown Current • 2.7V to 6V Supply Voltage Range • TO-252, SOP-8 and SOT-23 lead-free Package • ESD Human Body Mode Over 4KV • Thermal Protection 160 °C APPLICATIONS • Handheld Electronics • Flash Light • Lighting TM Technology Inc. reserves the right P. 1 to change products or specifications without notice. Publication Date: JUL. 2008 Revision: A tm TE CH T6340A PACKAGE DIMENSIONS 5-LEAD TO-252 E A A1 6 L2 2 3 4 D1 SEATING PLANE D 1 E1 c1 b2 5 H L L1 c e b e1 Symbol A A1 b b2 c c1 D D1 E E1 e e1 H L L1 L2 Dimension in inch Min. Max. 0.087 0.094 0.040 0.050 0.016 0.24 0.205 0.213 0.017 0.023 0.017 0.023 0.213 0.224 0.150 (REF.) 0.250 0.262 0.150 (REF.) 0.050 (TYP.) 0.200 (TYP.) 0.313 0.338 0.055 0.070 0.043 0.047 0.050 0.060 Dimension in mm Min. Max. 2.20 2.40 1.00 1.27 0.40 0.60 5.20 5.40 0.43 0.58 0.43 0.58 5.40 5.70 3.80 (REF.) 6.35 6.65 3.80 (REF.) 1.27 (TYP.) 5.08 (TYP.) 7.94 8.6 1.40 1.78 1.09 1.19 1.30 1.50 TM Technology Inc. reserves the right P. 2 to change products or specifications without notice. Publication Date: JUL. 2008 Revision: A tm TE CH T6340A PACKAGE DIMENSIONS 8-LEAD SOP B B1 K T h e rm a l P a d * J A1 C1 A C C2 F D Symbol A A1 B B1 C C1 C2 D E F J K H Min. 5.70 3.75 1.35 0.10 0.31 0.30 0.10 Dimension in mm Typ. 6.00 3.95 1.27 1.55 0.41 0.50 0.15 2.23 REF 2.97 REF 0~8° E H Max. 6.30 4.10 5.13 1.80 1.75 0.25 0.51 0.70 0.25 Min. 0.224 0.148 0.052 0.001 0.012 0.012 0.004 Dimension in inch Typ. 0.236 0.156 0.050 0.061 0.016 0.020 0.006 0.088 REF 0.117 REF 0~8° Max. 0.248 0.164 0.202 0.071 0.069 0.004 0.020 0.028 0.010 *Note : The thermal pad on the IC’s bottom has to be mounted on the copper foil. To eliminate the noise influence, the thermal pad is suggested to be connected to GND on PCB. In addition, desired thermal conductivity will be improved, if a heat-conducting copper foil on PCB is soldered with thermal pad. The thermal pad enhances the power dissipation. As a result, a large amount of current can be sunk safely in one package. TM Technology Inc. reserves the right P. 3 to change products or specifications without notice. Publication Date: JUL. 2008 Revision: A tm TE CH T6340A PACKAGE DIMENSIONS SOT23-6 B B 1 B 2 A 1 C 1 A C C 2 F D I Symbol A A1 B B1 B2 C C1 C2 D E F G H I Min. 2.60 1.40 2.70 0.95 0.90 0 0.30 0.08 Dimension in mm Typ. 2.80 1.575 2.85 1.90(BSC) 0.95(BSC) 1.20 1.10 0.075 0.40 0.45 0.15 0.60(REF) H Max. 3.00 1.60 3.00 Min. 0.102 0.055 0.106 1.45 1.30 0.150 0.037 0.035 0 0.60 0.22 0.012 0.003 G E Dimension in inch Typ. 0.110 0.062 0.112 0.075(BSC) 0.037(BSC) 0.047 0.043 0.003 0.015 0.018 0.006 5~15° TM Technology Inc. reserves the right P. 4 to change products or specifications without notice. Max. 0.118 0.063 0.118 0.057 0.051 0.06 0.023 0.009 0~8° 5~15° Publication Date: JUL. 2008 Revision: A