tm TE CH T8302 PWM Control 1A Step-Down Converter Data Sheet TM Technology Inc. tm TE CH T8302 PWM Control 1A Step-Down Converter FEATURES GENERAL DESCRIPTION • Wide Input Voltage Range: 6V to 60V • LED Output Current Up to 1A • Soft-start • Single pin on/off and brightness control using DC voltage or PWM • High efficiency (up to 97%) • Up to 1MHz switching frequency • Typical 5% output current accuracy • SOT-89 and SOP-8 Lead-free Package The T8302 is a continuous mode inductive step-down converter, designed for driving single or multiple series connected LEDs efficiently from a voltage source higher than the LED voltage. The device operates from an input supply between 6V and 60V and provides an externally adjustable output current of up to 1A. Depending upon supply voltage and external components, this can provide up to 58 watts of output power. The T8302 includes the output switch and a highside output current sensing circuit, which uses an external resistor to set the nominal average output current. Output current can be adjusted above, or below the set value, by applying an external control signal to the 'ADJ' pin. The ADJ pin will accept either a DC voltage or a PWM waveform. Depending upon the control frequency, this will provide either a continuous or a gated output current. The PWM filter components are contained within the chip. The T8302 is available in SOT-89 and SOP-8 Lead-free package. Applications • LED/Display Back Light Driver • Lightings • Portable Communication Devices • Handheld Electronics PART NUMBER EXAMPLES TM Technology, Inc. reserves the right to change products or specifications without notice. P. 1 PART NO. PACKAGE T8302-AXG SOT-89 T8302-CDG SOP-8 Publication Date: April. 2014 Revision:E tm TE CH T8302 PIN ARRANGEMENT(Top view) GND ISENSE 2 4 3 GND ADJ LX VIN 5 1 T8302-AXG SOT-89-5 PIN DESCRIPTION T8302-CDG SOP-8 SYMBOL SOT-89 SOP-8 DESCRIPTION LX GND 1 2 4 3,5,6 ADJ 3 1 ISENSE 4 8 Drain of NDMOS switch Ground Multi-function On/Off and brightness control pin: • Leave floating for normal operation.(VADJ = VREF = 1.25V giving nominal average output current IOUTnom = 0.1/RS) • Drive with DC voltage (0.1V < VADJ < 2.5V) to adjust output current from 0% to 200% of IOUTnom • Drive with PWM signal from open-collector or open-drain transistor, to adjust output current. Connect resistor RS from this pin to VIN to define nominal average output current IOUTnom = 0.1/RS Enable control signal, H: Ative, L : Power Down Input voltage (6V to 60V). Decouple to ground with 10uF or higher X7R ceramic capacitor close to device EN VIN 2 5 7 TM Technology, Inc. reserves the right P. 2 to change products or specifications without notice. Publication Date:April 2014 Revision: E tm TE CH T8302 Absolute Maximum Ratings Parameter Symbol Value Unit VIN -0.3 to +60 V ISENSE pin Voltage ( respect to VIN) -5 to +0.3 V ADJ and EN pin Voltage -0.3 to +6 V TA -40 to +125 °C TLEAD 300 °C TS -65 to +150 °C SOT-89 0.5 SOP-8 0.8 Voltage on intput pin relative to GND Operating Temperature Rang Maximum Soldering Temperature (at leads, 10 sec) Storage Temperature Rang Power Dissipation, PD @ TA = 25°C Package Thermal Resistance, θJA SOT-89 200 SOP-8 178 W °C/W Electrical Characteristics (TA = -40 to 85°C unless otherwise noted. Typical values are at TA =25°C, VDD =24V) Symbol Description VIN Input Voltage Conditions Min. Typ. Max 6 60 Unit V VIRU Internal regulator start-up threshold VIN rising 4.95 V VIRD Internal regulator shutdown VIN falling 4.30 V IQOFF Quiescent supply current with output off EN pin grounded 70 uA IQON Quiescent supply current with output switching ADJ pin floating f = 250kHz 1.8 5.0 mA 100 105 mV VSENSE Mean current sense threshold Voltage Measured on ISENSE pin with respect to (Defines LED current setting accuracy) VIN, VADJ = 1.25V 95 VSENTH Sense threshold hysteresis ISENSE ISENSE pin input current VSENSE =VIN – 0.1 VREF Internal reference voltage Measured on ADJ pin with pin floating ∆VREF/∆T Temperature coefficient of VREF VADJ External control voltage range on ADJ pin for DC brightness control* VIHEN EN Input Voltage Hight VILEN EN Input Voltage Low RADJ Resistance between ADJ pin and VREF 0< VADJ < 2.5V TADJ Soft-start delay time ILXM Continuous LX switch current RLX LX Switch ‘On’ resistance ILXI LX switch leakage current TTP Thermal Shutdown Protect ±15 % 10 uA 1.25 V 50 ppm/°C 2.5 0.1 2 V 0.8 ADJ floating @ ILX = 1A TM Technology, Inc. reserves the right P. 3 to change products or specifications without notice. V V 64 Kohm 1 ms 0.3 160 1 A 0.45 ohm 5 uA °C Publication Date:April 2014 Revision: E tm TE CH T8302 Electrical Characteristics (continuous) DPWML Duty cycle range of PWM signal applied to ADJ pin during low frequency PWM dimming mode Brightness control range Duty cycle range of PWM signal applied to ADJ pin during high DPWMH frequency PWM dimming mode Brightness control range fLX PWM frequency<300Hz PWM amplitude = VREF Measured on ADJ pin 0.001 PWM frequency>10KHz PWM amplitude = VREF Measured on ADJ pin 0.16 1000:1 1 5:1 ADJ pin floating, L = 33uH (0.093 ohm) IOUT=1A @VLED = 3.6V Driving 1 LED Operating frequency 1 280 KHz TONmin Minimum switch ‘ON’ time LX switch ‘ON’ 100** ns TOFFmin Minimum switch ‘OFF’ time LX switch ‘OFF’ 60** ns LX switch ‘ON’ 800 ns TONminR Recommended minimum switch 'ON' time fLXmax Recommended maximum operating frequency DLX Recommended duty cycle range of output switch at fLXmax TPD Internal comparator propagation delay 1 0.3 MHz 0.7 50 ns Notes : *100% brightness corresponds to VADJ = VADJ(nom) = VREF. Driving the ADJ pin above VREF will increase the VSENSE. threshold and output current proportionally. **Parameters are not tested at production. Parameters are guaranteed by design, characterization and process control. Block Diagram V CC D1 RS LED L1 LX V IN M N V ref. C1 4 .7 u F R1 B u ffe r + R4 - ADJ + EN V o lta g e re g u la to r B and gap R2 In te rn a l VD D O ver T em p. D riv e r R3 GND TM Technology, Inc. reserves the right P. 4 to change products or specifications without notice. Publication Date:April 2014 Revision: E tm TE CH T8302 Functional Description The device, in conjunction with the coil (L1) and current sense resistor (RS), forms a selfoscillating continuous-mode buck converter. Device operation Operation can be best understood by assuming that the ADJ pin of the device is unconnected and the voltage on this pin (VADJ) appears directly at the (+) input of the comparator. When input voltage VIN is first applied, the initial current in L1 and RS is zero and there is no output from the current sense circuit. Under this condition, the (-) input to the comparator is at ground and its output is high. This turns MN on and switches the LX pin low, causing current to flow from VIN to ground, via RS, L1 and the LED(s). The current rises at a rate determined by VIN and L1 to produce a voltage ramp (VSENSE) across RS. The supply referred voltage VSENSE is forced across internal resistor R1 by the current sense circuit and produces a proportional current in internal resistors R2 and R3. This produces a ground referred rising voltage at the (-) input of the comparator. When this reaches the threshold voltage (VADJ), the comparator output switches low and MN turns off. The comparator output also drives another NMOS switch, which bypasses internal resistor R3 to provide a controlled amount of hysteresis. The hysteresis is set by R3 to be nominally 15% of VADJ. When MN is off, the current in L1 continues to flow via D1 and the LED(s) back to VIN. The current decays at a rate determined by the LED(s) and diode forward voltages to produce a falling voltage at the input of the comparator. When this voltage returns to VADJ, the comparator output switches high again. This cycle of events repeats, with the comparator input ramping between limits of VADJ ± 15%. Switching thresholds With VADJ = VREF, the ratios of R1, R2 and R3 define an average VSENSE switching threshold of 100mV (measured on the ISENSE pin with respect to VIN). The average output current IOUTnom is then defined by this voltage and RS according to: IOUTnom = 100mV/RS Nominal ripple current is ±15mV/RS Adjusting output current The device contains a low pass filter between the ADJ pin and the threshold comparator and an internal current limiting resistor (64kohn nom) between ADJ and the internal reference voltage. This allows the ADJ pin to be overdriven with either DC or pulse signals to change the VSENSE switching threshold and adjust the output current. The filter is third order, comprising three sections, each with a cut-off frequency of nominally 4kHz. Details of the different modes of adjusting output current are given in the applications section. Output shutdown The output of the low pass filter drives the shutdown circuit. When the input voltage to this circuit falls below the threshold, the internal regulator and the output switch are turned off. The voltage reference remains powered during shutdown to provide the bias current for the shutdown circuit. Quiescent supply current during shutdown is nominally 70uA. TM Technology, Inc. reserves the right P. 5 to change products or specifications without notice. Publication Date:April 2014 Revision: E tm TE CH T8302 Applications Information Setting nominal average output current with external resistor RS The nominal average output current in the LED(s) is determined by the value of the external current sense resistor (RS) connected between VIN and ISENSE and is given by: IOUTnom = 0.1/RS [for RS ≥ 0.1 ohm] The table below gives values of nominal average output current for several preferred values of current setting resistor (RS) in the typical application circuit : RS (ohm) 0.1 0.142 0.285 Nominal average output current (mA) 1000 700 350 The above values assume that the ADJ pin is floating and at a nominal voltage of VREF (=1.25V). Note that RS = 0.1ohm is the minimum allowed value of sense resistor under these conditions to maintain switch current below the specified maximum value. It is possible to use different values of RS if the ADJ pin is driven from an external voltage. (See next section) Output current adjustment by external DC control voltage The ADJ pin can be driven by an external dc voltage (VADJ), as shown, to adjust the output current to a value above or below the nominal average value defined by RS. The nominal average output current in this case is given by: IOUTdc = (VADJ /1.25) x (0.1V / RS), [for 0.1 < VADJ <2.5V] Note that 100% brightness setting corresponds to VADJ = VREF. When driving the ADJ pin above 1.25V, RS must be increased in proportion to prevent IOUTdc exceeding 1A maximum. The input impedance of the ADJ pin is 64kohm ±25%. Output current adjustment by PWM control Directly driving ADJ input A Pulse Width Modulated (PWM) signal with duty cycle DPWM can be applied to the ADJ pin, as shown below, to adjust the output current to a value above or below the nominal average value set by resistor RS: TM Technology, Inc. reserves the right P. 6 to change products or specifications without notice. Publication Date:April 2014 Revision: E tm TE CH T8302 Driving the ADJ input via open collector transistor The recommended method of driving the ADJ pin and controlling the amplitude of the PWM waveform is to use a small NPN switching transistor as shown below: This scheme uses the 64kohm resistor between the ADJ pin and the internal voltage reference as a pull-up resistor for the external transistor. Driving the ADJ input from a microcontroller Another possibility is to drive the device from the open drain output of a microcontroller. The diagram below shows one method of doing this: If the NMOS transistor within the microcontroller has high Drain / Source capacitance, this arrangement can inject a negative spike into ADJ input of the T8302 and cause erratic operation but the addition of a Schottky clamp diode (cathode to ADJ) to ground and inclusion of a series resistor (10K) will prevent this. See the section on PWM dimming for more details of the various modes of control using high frequency and low frequency PWM signals. Shutdown mode Taking the EN pin to a voltage below 0.8V for more than approximately 100us, will turn off the output and supply current will fall to a low standby level of 70uA nominal. TM Technology, Inc. reserves the right P. 7 to change products or specifications without notice. Publication Date:April 2014 Revision: E tm TE CH T8302 Capacitor selection A low ESR capacitor should be used for input decoupling, as the ESR of this capacitor appears in series with the supply source impedance and lowers overall efficiency. This capacitor has to supply the relatively high peak current to the coil and smooth the current ripple on the input supply. A minimum value of 47uF is acceptable if the input source is close to the device, but higher values will improve performance at lower input voltages, especially when the source impedance is high. In order to avoid high frequency noise influence and improve circuit stability, it is recommended to shunt a value of 0.22uF Capacitor. The input capacitor should be placed as close as possible to the IC. For maximum stability over temperature and voltage, capacitors with X7R, X5R, or better dielectric are recommended. Capacitors with Y5V dielectric are not suitable for decoupling in this application and should not be used. Inductor selection Recommended inductor values for the T8302 are in the range 33uH to 100uH. Higher values of inductance are recommended at higher supply voltages in order to minimize errors due to switching delays, which result in increased ripple and lower efficiency. Higher values of inductance also result in a smaller change in output current over the supply voltage range. The inductor should be mounted as close to the device as possible with low resistance connections to the LX and VIN pins. The chosen coil should have a saturation current higher than the peak output current and a continuous current rating above the required mean output current. The inductor value should be chosen to maintain operating duty cycle and switch 'on'/'off' times within the specified limits over the supply voltage and load current range. LX switch on time : ton = L∆I / (VIN – VLED - Iavg (RS+rL+RLX)) , note: tonmin > 100ns LX switch off time : toff = L∆I / (VLED + VD + Iavg (RS+rL)) , note: toffmin > 60ns Where: “L” is the coil inductance (H) “∆I” is the coil peak-peak ripple current (A) {Internally set to 0.3 x Iavg} “rL” is the coil resistance (ohm) “RS” is the current sense resistance “Iavg” is the required LED current (A) “VIN” is the supply voltage (V) “VLED” is the total LED forward voltage (V) “RLX” is the switch resistance (ohm) {=0.3 ohm nominal} “VD” is the diode forward voltage at the required load current (V) TM Technology, Inc. reserves the right P. 8 to change products or specifications without notice. Publication Date:April 2014 Revision: E tm TE CH T8302 Typical Application Circuits * note : When outputs the big current, the noise are big, this and the system environment and PCB layout have the influential, may defer to the actual need to increase the capacitor filtration noise. TM Technology, Inc. reserves the right P. 9 to change products or specifications without notice. Publication Date:April 2014 Revision: E tm TE CH T8302 PACKAGE DIMENSIONS SOT-89 D POLISHED(2X) E 1 B1 3 2 H L C B 10'(2X) A e e1 Symbol A B B1 C D E H e e1 L Dimension in mm Min. Max. 1.40 1.60 0.44 0.56 0.36 0.48 0.35 0.44 4.40 4.60 2.29 2.60 3.94 4.25 1.50 BSC 3.00 BSC 0.89 1.2 Dimension in inch Min. Max. 0.055 0.063 0.017 0.022 0.014 0.019 0.013 0.017 0.173 0.181 0.090 0.102 0.155 0.167 0.059 BSC 0.118 BSC 0.035 0.047 TM Technology, Inc. reserves the right P. 10 to change products or specifications without notice. Publication Date:April 2014 Revision: E tm TE CH T8302 PACKAGE DIMENSIONS 8-LEAD SOP B B1 K T h e rm a l P a d * J A1 C1 A C C2 F D Symbol A A1 B B1 C C1 C2 D E F J K H Min. 5.70 3.75 1.35 0 0.31 0.30 0.10 Dimension in mm Typ. 6.00 3.95 1.27 1.55 0.41 0.50 0.15 2.23 REF 2.97 REF 0~8° E H Max. 6.30 4.10 5.13 1.80 1.75 0.15 0.51 0.70 0.25 Min. 0.224 0.148 0.052 0.000 0.012 0.012 0.004 Dimension in inch Typ. 0.236 0.156 0.050 0.061 0.016 0.020 0.006 0.088 REF 0.117 REF 0~8° Max. 0.248 0.164 0.202 0.071 0.069 0.006 0.020 0.028 0.010 *Note : The thermal pad on the IC’s bottom has to be mounted on the copper foil. To eliminate the noise influence, the thermal pad is suggested to be connected to GND on PCB. In addition, desired thermal conductivity will be improved, if a heat-conducting copper foil on PCB is soldered with thermal pad. The thermal pad enhances the power dissipation. As a result, a large amount of current can be sunk safely in one package. TM Technology, Inc. reserves the right P. 11 to change products or specifications without notice. Publication Date:April 2014 Revision: E