BSS138 GENERAL FEATURES ● VDS = 50V,ID = 0.22A RDS(ON) < 6Ω @ VGS=4.5V RDS(ON) < 3.5Ω @ VGS=10V ESD Rating：1000V HBM ● High Power and current handing capability ● Lead free product is acquired ● Surface Mount Package Schematic diagram APPLICATION ●Direct Logic-Level Interface: TTL/CMOS ●Drivers: Relays, Solenoids, Lamps, Hammers,Display, Memories, Transistors, etc. ●Battery Operated Systems ●Solid-State Relays Marking and pin Assignment SOT-23 top view PACKAGE MARKING AND ORDERING INFORMATION Device Marking Device Device Package Reel Size S138 BSS138 SOT-23 Ø180mm ABSOLUTE MAXIMUM RATINGS(TA=25℃unless otherwise noted) Parameter Symbol Tape width Quantity 8 mm 3000 units Limit Unit Drain-Source Voltage VDS 50 V Gate-Source Voltage VGS ±20 V ID 0.22 ID(70℃) 0.18 IDM 0.88 A PD 0.43 W TJ,TSTG -55 To 175 ℃ RθJA 350 ℃/W Drain Current-Continuous@ Current-Pulsed (Note 1) Maximum Power Dissipation Operating Junction and Storage Temperature Range A THERMAL CHARACTERISTICS Thermal Resistance,Junction-to-Ambient (Note 2) ©Silikron Semiconductor CO.,LTD. 1 http://www.silikron.com v2.3 BSS138 ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS VGS=0V ID=250μA Zero Gate Voltage Drain Current IDSS VDS=50V,VGS=0V 1 μA Gate-Body Leakage Current IGSS VGS=±20V,VDS=0V 10 uA BVGSO VDS=0V, IG=±250uA ±20 Gate Threshold Voltage VGS(th) VDS=VGS,ID=250uA 0.8 Drain-Source On-State Resistance RDS(ON) Gate-Source Breakdown Voltage 50 V V ON CHARACTERISTICS (Note 3) Forward Transconductance gFS 1.5 VGS=10V, ID=0.22A 3.5 VGS=4.5V, ID=0.22A 6 VDS=10V,ID=0.22A 0.1 V Ω S DYNAMIC CHARACTERISTICS (Note4) Input Capacitance Clss 30 VDS=25V,VGS=0V, F=1.0MHz Output Capacitance Coss 15 Reverse Transfer Capacitance Crss 6 Turn-on Delay Time td(on) 2.6 Turn–On Rise Time tr Turn-Off Delay Time td(off) PF SWITCHING CHARACTERISTICS (Note 4) VDD=30V,VGS=10V, RGEN=6Ω，ID=0.22A 9 nS 20 Turn–Off Fall Time tf 6 Total Gate Charge Qg 1.7 Gate–Source Charge Qgs Gate–Drain Charge Qgd VDS=25V,ID=0.22A,VGS=10V 2.4 0.1 nC 0.4 DRAIN-SOURCE DIODE CHARACTERISTICS Diode Forward Voltage (Note 3) VSD VGS=0V,IS=0.44A 1.4 V NOTES: 1. 2. 3. 4. Repetitive Rating: Pulse width limited by maximum junction temperature. Surface Mounted on FR4 Board, t ≤ 10 sec. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. Guaranteed by design, not subject to production testing. ©Silikron Semiconductor CO.,LTD. 2 http://www.silikron.com v2.3 BSS138 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS Vdd Vgs R gen td(on) Rl Vin D ton tr Vout 90% VOUT G toff tf td(off) 90% INVERTED 10% 10% 90% S VIN 50% 50% 10% PULSE WIDTH Figure 1:Switching Test Circuit PD Power(W) ID- Drain Current (A） Figure 2:Switching Waveforms TJ-Junction Temperature(℃) TJ-Junction Temperature(℃) Figure 3 Power Dissipation ID- Drain Current (A) Rdson On-Resistance(Ω ) Figure 4 Drain Current ID- Drain Current (A) Vds Drain-Source Voltage (V) Figure 5 Output CHARACTERISTICS ©Silikron Semiconductor CO.,LTD. Figure 6 Drain-Source On-Resistance 3 http://www.silikron.com v2.3 ID- Drain Current (A) Normalized On-Resistance BSS138 TJ-Junction Temperature(℃) Figure 7 Transfer Characteristics Figure 8 Drain-Source On-Resistance C Capacitance (pF) Rdson On-Resistance(Ω ) Vgs Gate-Source Voltage (V) Vds Drain-Source Voltage (V) Figure 9 Rdson vs Vgs Figure 10 Capacitance vs Vds Is- Reverse Drain Current (A) Vgs Gate-Source Voltage (V) Vgs Gate-Source Voltage (V) Qg Gate Charge (nC) Vsd Source-Drain Voltage (V) Figure 11 Gate Charge ©Silikron Semiconductor CO.,LTD. Figure 12 Source- Drain Diode Forward 4 http://www.silikron.com v2.3 ID- Drain Current (A) BSS138 Vds Drain-Source Voltage (V) Safe Operation Area r(t),Normalized Effective Transient Thermal Impedance Figure 13 Square Wave Pluse Duration(sec) Figure 14 Normalized Maximum Transient Thermal Impedance ©Silikron Semiconductor CO.,LTD. 5 http://www.silikron.com v2.3 BSS138 SOT-23 PACKAGE INFORMATION Dimensions in Millimeters (UNIT:mm) Symbol A A1 A2 b c D E E1 e e1 L L1 θ Dimensions in Millimeters MIN. MAX. 0.900 1.150 0.000 0.100 0.900 1.050 0.300 0.500 0.080 0.150 2.800 3.000 1.200 1.400 2.250 2.550 0.950TYP 1.800 2.000 0.550REF 0.300 0.500 0° 8° NOTES 1. 2. 3. 4. 5. All dimensions are in millimeters. Tolerance ±0.10mm (4 mil) unless otherwise specified Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils. Dimension L is measured in gauge plane. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. ©Silikron Semiconductor CO.,LTD. 6 http://www.silikron.com v2.3 BSS138 SOT 23 Tape and Reel Information Dimensions in Millimeters (UNIT:mm) NOTES： 1. 2. 3. All dimensions are in millimeters. 10 Sprocket hole pitch cumulative tolerance ±0.20MAX General tolerance ±0.25 ©Silikron Semiconductor CO.,LTD. 7 http://www.silikron.com v2.3 BSS138 ATTENTION: ■ ■ ■ ■ ■ ■ ■ ■ Any and all Silikron products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your Silikron representative nearest you before using any Silikron products described or contained herein in such applications. 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No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of Silikron Semiconductor CO.,LTD. Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. Silikron believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the Silikron product that you intend to use. ©Silikron Semiconductor CO.,LTD. 8 http://www.silikron.com v2.3