SKY33107 - Skyworks Solutions, Inc.

advance data sheet
SKY33107: BAW 2.495–2.690 GHz WiMAX Pass/
2.400–2.473 GHz WiFi Reject Filter
Applications
Functional Block Diagram
2 .5 GHz WiMAX
• PCMCIA cards
• USB dongles
• CPE
• Notebook and ultra mobile PC
• Pico and Femto base stations
l
Features
B
andwidth: 195 MHz
• Low insertion loss: 3 dB
• High out of band rejection in 802.11b,g,n band
l L
ead (Pb)-free and RoHS-compliant 3 x 3 mm package
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Description
The SKY33107 is a bulk acoustic wave (BAW) high pass filter in a
3 x 3 mm package. This filter has very low in-band insertion loss,
excellent out-of-band rejection in the 2.4 GHz WLAN band and very
low input and output return loss.
This filter is intended for use in 2.495–2.690 GHz WiMAX band
transmitter applications which also contain WLAN 802.11b, g, n
transmitters.
The filter can operate over the temperature range of
-20 °C to 85 °C.
The SKY33107 is available in a (Pb)-free, RoHS-compliant package.
NEW
Skyworks offers lead (Pb)-free, RoHS (Restriction of
Hazardous Substances)-compliant packaging.
Advance Data Sheet: Product is in development stages, performance is
based on simulation, and pin out and package are advanced and may change.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200909 Rev. E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 29, 2008
1
advance Data Sheet • SKY33107
Electrical Specifications
T = 25 °C, PINPUT = 0 dBm, ZO = 50 W, unless otherwise noted
Parameter
Condition
Frequency
Min.
Pass band
Typ.
Unit
2.690
GHz
2.495
Insertion loss
Pass band
2.495–2.690 GHz
3
dB
Ripple
Pass band
2.495–2.690 GHz
0.5
dB
Return loss
Pass band
2.495–2.690 GHz
10
12
dB
2.400–2.473 GHz
30
Attenuation
Withstand voltage
dB
100
Absolute Maximum Ratings
V
Pin Out/Suggested Circuit (Top View)
CharacteristicValue
Input power
41 dBm
Operating temperature
-20 °C to +85 °C
Storage temperature
-40 °C to +125 °C
ESD (HBM)
Class 1
RF In/Out
GND
GND
RF In/Out
8
7
6
5
Exposed
Paddle
Ground
Performance is guaranteed only under the conditions listed in the specifications table and is
not guaranteed under the full range(s) described by the Absolute Maximum Ratings. Exceeding
any of the absolute maximum/minimum specifications may result in permanent damage to the
device and will void the warranty.
CAUTION: A lthough this device is designed to be as robust as
possible, Electrostatic Discharge (ESD) can damage
this device. This device must be protected at all
times from ESD. Static charges may easily produce
potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be
employed at all times.
2
Max.
1
2
3
4
GND
GND
GND
GND
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
October 29, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200909 Rev. E
advance Data Sheet • SKY33107
Package Outline
Printed Circuit Board
3
Pin 1
Indicator
0.2 X 45°
MCM
Substrate
3
3.3 mm
8X 0.65 mm
8X 0.4 mm
2X 1.33 mm
2X 0.7
Stencil Aperture Size
of 60 to 80% of the
Module/Pkg. Solder
Mask Area.
0.2 X 0.2
Pin 1 Indicator
Pin 1
0
8X 1.4
1 ± 0.1
Pin 8
0.4 mm Typ.
CL
4X 1.2
A
0
CL
Package Outline
R 0.2 Typ.
2X 0.7 mm
Stencil Aperture
Top View
4X 0.4
B
2X 1.325
3X R0.2
1.65 mm
4X 1.4
8X SMT PAD
8X 0.65 mm
Pin 1
Solder Mask Opening
8X 0.4 mm
0.4±0.1
Metal Pad
Edge
0.4 ± 0.05
(0.1)
0.4±0.1
CL
Metal Pad
Edges
0.4 mm Typ.
0.4 ± 0.1
(0.1)
(0.1)
Detail A
1. Dimensioning and tolerancing in accordance with asme y14.5m-1994
unless otherwise specified.
2. Dimensions are in millimeters unless otherwise specified.
Detail B
Package Outline
Thermal Via Array
Ø0.3 mm On 0.6 mm Pitch
Additional Vias in Common
Ground Pad Will Improve
Thermal Performance
0.2 X 45°
0.25 mm
CL
Metallization
Top View
3.4 mm
8X 0.75 mm
8X 0.5 mm
2X 1.33 mm
CL
CL
2X 0.7 mm
0.4 mm Typ.
Package Outline
R 0.2 Typ.
Solder Mask Opening
Top View
Thermal vias should be tented and filled with solder mask 30–35 µm
copper plating recommended.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200909 Rev. E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 29, 2008
3
advance Data Sheet • SKY33107
Copyright © 2008, Skyworks Solutions, Inc. All Rights Reserved.
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by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
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4
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
October 29, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200909 Rev. E