(Chip Common Mode Filter) Engineering Specification MCM2012B Series Features and Application Powerful components with composite co-fired material to solve EMI problem for high speed differential signal transmission line as USB, and LVDS, without distortion to high speed signal transmission PRODUCT DETAIL Imp.Com. (Ω)±25% @100MHz DCR Max. (Ω) Rated Current Max.(m A) Rated Voltage (V) Withstand Voltage (V) Insulation Resistance Min.(MΩ) MCM2012B670GBE 67 0.40 400 10 25 200 MCM2012B900GBE 90 0.40 400 10 25 200 MCM2012B121GBE 120 0.40 400 10 25 200 MCM2012B161GBE 160 0.50 400 10 25 200 MCM2012B181GBE 180 0.50 400 10 25 200 MCM2012B221FBP 220 0.50 300 10 25 200 Part Number ◆ ◆ ◆ ◆ Test Instruments Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER HP4338 MILLIOHMMETER Agilent E5071C ENA SERIES NETWORK ANALYZER Keithley 2410 1100V SOURCE METER PART NUMBER CODE MCM 2012 B 1 2 3 90 0 4 G B E 5 6 7 8 1: Series name 2: Size Code:the first two digitals:length(mm),the last two digitals:width(mm) 3: Material code 4: Impedance(Ω) ±25% (ex：900=90Ω ；121=120Ω) 5: Fixed Decimal Point 6: Rated Current Code A=50mA B=80mA C=100mA D=150mA E=200mA F=300mA G=400mA H=500mA I=600mA J=700mA K=800mA 7: Soldering:Green Parts:A-Soldering Lead-Free B-Lead-Free for whole chip 8: Packaging style E – Embossed paper tape, 7”reel. UN Semiconductor Co., Ltd. www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 1/8 Specifications are subject to change without notice. (Chip Common Mode Filter) Engineering Specification MCM2012B Series TYPICAL CHARACTERISTIC MCM2012B670 Fig2. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS Fig1. IMPEDANCE vs. FREUQENCY CHARACTERISTICS MCM2012B900 Fig3. IMPEDANCE vs. FREUQENCY CHARACTERISTICS Fig4. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS UN Semiconductor Co., Ltd. www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 2/8 Specifications are subject to change without notice. (Chip Common Mode Filter) Engineering Specification MCM2012B Series MCM2012B121 Fig6. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS Fig5. IMPEDANCE vs. FREUQENCY CHARACTERISTICS MCM2012B161 Fig8. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS Fig7. IMPEDANCE vs. FREUQENCY CHARACTERISTICS UN Semiconductor Co., Ltd. www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 3/8 Specifications are subject to change without notice. (Chip Common Mode Filter) Engineering Specification MCM2012B Series MCM2012B181 Fig9. IMPEDANCE vs. FREUQENCY CHARACTERISTICS Fig10. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS MCM2012B221 Fig11. IMPEDANCE vs. FREUQENCY CHARACTERISTICS Fig12. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS UN Semiconductor Co., Ltd. www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 4/8 Specifications are subject to change without notice. (Chip Common Mode Filter) Engineering Specification MCM2012B Series SHARES AND DIMENSIONS TYPE Dimension L 2.00±0.20 W 1.25±0.20 T 1.00±0.10 P 1.60±0.20 C1 0.40±0.20 C2 0.30±0.20 Unit : mm MEASURING CIRCUITS CIRCUIT CONFIGURATION & LAYOUT PAD UN Semiconductor Co., Ltd. www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 5/8 Specifications are subject to change without notice. (Chip Common Mode Filter) Engineering Specification MCM2012B Series TAPE AND REEL SPECIFICATIONS / TAPING DIMENSIONS Type : Paper Carrier Unit : mm Symbol size symbol size W 8.00±0.10 D1 1.00±0.10 P 4.00±0.10 Po 4.00±0.10 E 1.75±0.10 Ao 1.40±0.10 F 3.50±0.05 Bo 2.30±0.10 P2 2.00±0.05 Ko 1.13±0.10 D 1.50+0.1/-0 t 0.22±0.05 UN Semiconductor Co., Ltd. www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 6/8 Specifications are subject to change without notice. (Chip Common Mode Filter) Engineering Specification MCM2012B Series REEL DIMENSIONS STANDARD QUANTITY FOR PACKAGING Packaging style : Taping Reel packaging quantity : 3000 pcs/reel Inner box : 5 reel/inner box RECOMMENDED SOLDERING CONDITIONS GENERAL TECHNICAL DATA Opertation temperatur range : -40℃ ~ +85℃ Storage Condition : Less than 40℃ and 70% RH Storage Time: 6 months Max. Soldering method: Reflow or Wave Soldering UN Semiconductor Co., Ltd. www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 7/8 Specifications are subject to change without notice. (Chip Common Mode Filter) Engineering Specification MCM2012B Series RELIABILITY AND TEST CONDITION Test item Temperature Cycle Operational Life Biased Humidity Test condition A. Temperature : -40 ~ +85℃ B. Cycle : 100 cycles C. Dwell time : 30minutes A. No mechanical damage B. Impedance value should be within ± 20 % of the initial Measurement : at ambient temperature value 24 hrs after test completion A. Temperature : 85℃ ± 5℃ B. Test time : 1000 hrs C. Apply current : full rated current A. No mechanical damage B. Impedance value should be within ± 20 % of the initial Measurement : at ambient temperature value 24 hrs after test completion A. Temperature : 40 ± 2℃ B. Humidity : 90 ~ 95 % RH C. Test time : 1000 hrs D. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion A. Solder temperature : 260 ± 5℃ Resistance to Solder B. Flux : Rosin Heat C. DIP time : 10 ± 1 sec Steam Aging Test Criteria A. Temperature : 93 ± 2℃ B. Test time : 4 hrs(MCA) Others : 8 hrs C. Solder temperature : 235 ± 5℃ D. Flux : Rosin E. DIP time : 5 ± 1 sec UN Semiconductor Co., Ltd. A. No mechanical damage B. Impedance value should be within ± 20 % of the initial value A. More than 95 % of terminal electrode should be covered with new solder B. No mechanical damage C .Impedance value should be within ± 20 % of the initial value More than 95 % of terminal electrode should be covered with new solder www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 8/8 Specifications are subject to change without notice.