RClamp0521PA Ultra-Low Capacitance 1-Line ESD protection PROTECTION PRODUCTS - RailClamp® Description Features Transient protection for data lines to RailClamp® TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClamp®0521PA has a maximum capacitance of only 0.50pF. This allows it to be used on circuits operating in excess of 3GHz without signal attenuation. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (1.0 x 0.6 x 0.5mm) Protects one data or I/O line Low capacitance: 0.5pF Low clamping voltage Low operating voltage: 5.0V Solid-state silicon-avalanche technology Mechanical Characteristics The RClamp0521PA is in a 2-pin SLP1006P2 package measuring 1.0 x 0.6 x 0.5mm. The leads are spaced at a pitch of 0.65mm and feature a lead-free finish. Each device will protect one high-speed line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size, low capacitance, and high ESD surge capability makes them ideal for use in applications such as cellular phones and digital video interfaces. SLP1006P2 package Molding compound flammability rating: UL 94V-0 Marking: Marking code Packaging: Tape and Reel Lead Finish: NiPdAu Pb-Free, Halogen Free, RoHS/WEEE Compliant Applications Dimensions Cellular Handsets & Accessories Digital Visual Interface (DVI) Display Port MDDI Ports USB Ports PCI Express Serial ATA Schematic & PIN Configuration 1.0 0.60 0.65 0.50 Maximum Dimensions (mm) Revision 03/18/2010 SLP1006P2 (Bottom View) 1 www.semtech.com RClamp0521PA PROTECTION PRODUCTS Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Ppk 100 Watts Peak Pulse Current (tp = 8/20μs) IPP 4 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD +/- 15 +/- 8 kV TJ -55 to +125 °C TSTG -55 to +150 °C Operating Temperature Storage Temperature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units 5 V 9.3 11 V 0.025 1 μA Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C Clamping Voltage VC IPP = 1A, tp = 8/20μs 15 V Clamping Voltage VC IPP = 4A, tp = 8/20μs 25 V Junction Capacitance Cj 0.50 pF © 2010 Semtech Corp. VR = 0V, f = 1MHz 2 6 0.30 www.semtech.com RClamp0521PA PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 100 % of Rated Power or I PP Peak Pulse Power - PPP (kW) 90 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (μs) Normalized Capacitance vs. Reverse Voltage Clamping Voltage vs. Peak Pulse Current 24 2 f = 1 MHz 22 1.5 18 16 CJ(VR) / CJ(VR=0) Clamping Voltage - VC (V) 20 14 12 10 8 0.5 Waveform Parameters: tr = 8μs td = 20μs 6 4 2 1 0 0 0 0 1 2 3 Peak Pulse Current - IPP (A) 4 1 2 3 Reverse Voltage - VR (V) 5 ESD Clamping (8kV Contact per IEC 61000-4-2) 4 5 Insertion Loss S21 CH1 S21 LOG 6 dB / REF 0 dB 1: -0.01950 dB 900 MHz 2: 0.02630 dB 1.8 GHz 0 dB 1 2 3 3: 0.25850 dB 2.5 GHz -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB -42 dB -48 dB Note: Data is taken with a 10x attenuator © 2010 Semtech Corp. 1 MHz START . 030 MHz 3 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz www.semtech.com RClamp0521PA PROTECTION PRODUCTS Applications Information Device Connection Options Equivalent Circuit Diagram These low capacitance TVS diodes are designed to provide common mode protection for one high-speed line or differential protection for one line pair. The device is bidirectional and may be used on lines where the signal polarity is positive and negative. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. © 2010 Semtech Corp. 4 www.semtech.com RClamp0521PA PROTECTION PRODUCTS Outline Drawing - SLP1006P2 A B D E DIM TOP VIEW A SEATING PLANE aaa C C A1 A A1 b D E e L R N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .016 .020 .022 .000 .001 .002 .018 .020 .022 .035 .039 .043 .020 .024 .028 .026 BSC .008 .010 .012 .002 .004 .006 2 .003 .004 0.40 0.50 0.55 0.00 0.03 0.05 0.45 0.50 0.55 0.90 1.00 1.10 0.50 0.60 0.70 0.65 BSC 0.20 0.25 0.30 0.05 0.10 0.15 2 0.08 0.10 PIN 1 ID R bxN bbb C A B 2x L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1006P2 DIMENSIONS Y (C) DIM C G X Y Z Z G X INCHES (.033) .012 .024 .022 .055 MILLIMETERS (0.85) 0.30 0.60 0.55 1.40 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2010 Semtech Corp. 5 www.semtech.com RClamp0521PA PROTECTION PRODUCTS Marking Code Ordering Information N Part Number Lead Finish Qty per Reel R eel Size RClamp 0521PATCT Pb Free 3,000 7 Inch RailClamp and RClamp are marks of Semtech Corporation. Notes: 1)Marking will also include line matrix date code 2) Device is electrically symmetrical Tape and Reel Specification Cathode Band/Date Code Location User Direction of feed Device Orientation in Tape A0 B0 0.69 +/-0.10 mm K0 1.19 +/-0.10 mm 0.66 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.8 mm ±0.25 (.031) E 1.750±0.1 mm (.069±.004) F K (Max) P P0 P2 T (Max) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.10 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05 mm (.079±.002) 0.4mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2010 Semtech Corp. 6 www.semtech.com