uClamp2401T Low Profile µClampTM 1-Line ESD protection PROTECTION PRODUCTS - MicroClampTM Description Features The µClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The µClampTM2401T is in a 2-pin SLP1006P2T package. It measures 1.0 x 0.6 mm with a nominal height of only 0.4mm. The leads are spaced at a pitch of 0.65mm and are finished with lead-free NiPdAu. Each device will protect one line operating at 24 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. TM Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (1.0 x 0.6 x 0.4mm) Protects one data line Low clamping voltage Working voltage: 24V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics SLP1006P2T package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 1.0 x 0.6 x 0.4 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel Applications Dimensions Cellular Handsets & Accessories Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration 1.0 0.60 0.65 0.40 Nominal Dimensions (mm) Revision 09/15/2009 SLP1006P2T (Bottom View) 1 www.semtech.com uClamp2401T PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 150 Watts Maximum Peak Pulse Current (tp = 8/20µs) Ip p 3 Amps VESD +/- 20 +/- 15 kV TJ -55 to +125 °C TSTG -55 to +150 °C ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 24V, T=25°C Forward Voltage VF IF = 10mA Clamping Voltage VC Junction Capacitance Cj 2009 Semtech Corp. Minimum Typical Maximum Units 24 V 27 V 0.25 µA 1.2 V IPP = 3A, tp = 8/20µs 50 V VR = 0V, f = 1MHz 50 pF 2 1 www.semtech.com uClamp2401T PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 100 % of Rated Power or IPP Peak Pulse Power - P PP (kW) 90 1 0.1 80 70 60 50 40 30 20 10 0.01 0 0.1 1 10 100 1000 0 25 50 Pulse Duration - tp (us) 125 150 Ambient Temperature - TA ( C) Forward Voltage vs. Forward Current 60 2.5 Forward Voltage - V F (V) 50 Clamping Voltage - V C (V) 100 o Clamping Voltage vs. Peak Pulse Current 40 30 20 Waveform Parameters: tr = 8µs td = 20µs 10 0 0.5 1 1.5 2 2.5 3 2 1.5 1 Waveform Parameters: tr = 8µs td = 20µs 0.5 0 0 0 3.5 0.5 1 1.5 2 2.5 3 3.5 4 Forward Current - IF (A) Peak Pulse Current - IPP (A) Normalized Junction Capacitance vs. Reverse Voltage CJ(VR) / C J(VR=0) 75 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 ESD Clamping (8kV Contact per IEC 61000-4-2) f = 1 MHz 0 5 10 15 Reverse Voltage - VR (V) 20 25 Note: Data is taken with a 10x attenuator 2009 Semtech Corp. 3 www.semtech.com uClamp2401T PROTECTION PRODUCTS Typical Characteristics Insertion Loss S21 CH1 S21 LOG 6 dB / REF 0 dB 1: -16.256 dB 800 MHz 2: -18.898 dB 900 MHz 0 dB -6 dB 5 -12 dB 3: -13.561 dB 1.8 GHz 4 3 -18 dB 3: -9.5299 dB 2.5 GHz 1 2 -24 dB 3: -9.072 dB 2.7 GHz -30 dB -36 dB 1 MHz START. 030 MHz 2009 Semtech Corp. 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz 4 www.semtech.com uClamp2401T PROTECTION PRODUCTS Applications Information Device Connection Options Circuit Diagram This device is designed to protect one data or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. 2009 Semtech Corp. 5 www.semtech.com uClamp2401T PROTECTION PRODUCTS Applications Information - Spice Model uClamp2401T Spice Model uClamp2401T Spice Parameters 2009 Semtech Corp. Parameter Unit D1 (T VS) IS Amp 3.87E-13 BV Volt 31.1 VJ Volt 0.68 RS Ohm 4.35 IB V Amp 1.0E-3 CJO Farad 27E-12 TT sec 2.541E-9 M -- 0.32 N -- 1.1 EG eV 1.11 6 www.semtech.com uClamp2401T PROTECTION PRODUCTS Outline Drawing - SLP1006P2T A B D DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX E TOP VIEW A SEATING PLANE aaa C C A1 A A1 b D E e L R N aaa bbb .015 .016 .017 .000 .001 .002 .018 .020 .022 .035 .039 .043 .020 .024 .028 .026 BSC .008 .010 .012 .002 .004 .006 2 .003 .004 0.37 0.40 0.43 0.00 0.03 0.05 0.45 0.50 0.55 0.90 1.00 1.10 0.50 0.60 0.70 0.65 BSC 0.20 0.25 0.30 0.05 0.10 0.15 2 0.08 0.10 PIN 1 ID R bxN bbb C A B 2x L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1006P2T Y (C) DIM C G X Y Z Z G X DIMENSIONS INCHES MILLIMETERS (.033) (0.85) .012 0.30 .024 0.60 .022 0.55 .055 1.40 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2009 Semtech Corp. 7 www.semtech.com uClamp2401T PROTECTION PRODUCTS Marking Code Ordering Information 24 Part Number Working Voltage Qty per Reel Reel Size uClamp 2401T.TCT 24V 3,000 7 Inch Notes: 1) This is a Pb-Free, Halogen Free, RoHS/WEEE Compliant product MicroClamp, uClamp and µClamp are marks of Semtech Corporation PIN 1 ID Tape and Reel Specification Cathode Bar User Direction of feed Device Orientation in Tape A0 0.69 +/-0.10 mm B0 K0 1.19 +/-0.10 mm 0.66 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.4 mm ±0.25 (.031) E 1.750±.10 mm (.069±.004) F P P0 P2 T W 3.5±0.05 mm (.138±.002) 4.0±0.10 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05 mm (.079±.002) 0.254±0.02 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2009 Semtech Corp. 8 www.semtech.com