TDA10027HN Dual cable demodulator with Out-Of Band receiver Rev. 1 — 8 November 2011 Product short data sheet 1. General description The TDA10027 is a Dual Cable Downstream Processor. The Cable Downstream Processor (CDP) implements the physical interfaces and protocols required to provide the highest quality services of an in-band DOCSIS, EuroDOCSIS, DVB, and OpenCable Set-Top Box (STB). The downstream signals are digitized by 12-bit ADC and passed to the Demod and Forward Error Correction (FEC) blocks, which do all the cable physical layer processing. This processing includes demodulating and Annex A (Europe), Annex B (US) or Annex C (Japan) FEC for the in-band data. The Out-Of Band (OOB) receiver consists of a QPSK demodulator with FEC, compliant to SCTE55-1 and SCTE55-2 standards, with either internal MAC or POD support. Data are digitized by a 10-bit ADC. 2. Features and benefits QPSK, 16 QAM, 32 QAM, 64 QAM, 128 QAM and 256 QAM Demodulator ITU-T J83 Annex A, B and C FEC Transport Stream Multiplex Frame (TSMF) module for Annex C compliance Time interleaved parallel mode or serial mode for Transport Stream (TS) interface On chip PLL for crystal frequency multiplication (16 MHz external) Reuse of the tuner clock, saving one crystal Embedded 12-bit ADC 3.3 V and 1.2 V power supplies Low power < 260 mW for dual stream operation Small size package Low cost Bill of Material OOB: QPSK demodulator SCTE55-1 and SCTE55-2 FEC Embedded 10-bit ADC TDA10027HN NXP Semiconductors Dual cable demodulator with Out-Of Band receiver 3. Quick reference data Table 1. Symbol P Quick reference data Parameter Conditions power dissipation Min Typ Max Unit - 10[1] 30[2] mW 1.2 V supply voltage; 2 simultaneous DVB-C demodulations (256 QAM 6.9 Msps) and 1 OOB SCTE55-1 - 225[1] 305[2] mW 3.3 V supply voltage; 2 simultaneous DVB-C demodulations (256 QAM 6.9 Msps) and 1 OOB SCTE55-1 - 35[1] 55[2] mW - 260[1] 360[2] mW Standby mode: all 3 ADC in Power-down mode and all clocks disabled operation mode: Ptot total power dissipation VDD(1V2) supply voltage (1.2 V) 1.15 1.2 1.3 V VDD(3V3) supply voltage (3.3 V) 3.0 3.3 3.6 V VIH HIGH-level input voltage VDD(3V3) related input levels 2.0 - VDD(3V3) + 0.5 V VIL LOW-level input voltage 0.5 - +0.8 V 2 simultaneous DVB-C demodulations (256 QAM 6.9 Msps) and 1 OOB SCTE55-1 [1] Tamb = 25 C, VDD(1V2) and VDD(3V3) typical. [2] Tj = 120 C, VDD(1V2) and VDD(3V3) maximum. 4. Ordering information Table 2. Ordering information Type number Package Name Description Version TDA10027HN/C1 HVQFN64 plastic thermal enhanced very thin quad flat package; SOT804-4 no leads; 64 terminals; body 9 9 0.85 mm TDA10027HN_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 November 2011 © NXP B.V. 2011. All rights reserved. 2 of 8 xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x ADC 0 (12-BIT) ADC data 0 CABLE DOWNSTREAM PROCESSOR 0 TS0 TSMF 0 ADC input 1 ADC 1 (12-BIT) ADC input 2 ADC 2 (10-BIT) I2C-BUS interface Block diagram TRANSPORT MUX CABLE DOWNSTREAM PROCESSOR 1 ADC data 2 OOB TS1 TSMF 1 TS output TS1 TS output I2C-BUS TO DTL-MMIO RGU CGU CONFIG distributes resets to all blocks distributes clocks to all blocks commands settings for different blocks 001aam421 TDA10027HN 3 of 8 © NXP B.V. 2011. All rights reserved. Fig 1. ADC data 1 TS0 Dual cable demodulator with Out-Of Band receiver Rev. 1 — 8 November 2011 All information provided in this document is subject to legal disclaimers. ADC data 0 NXP Semiconductors 5. Block diagram TDA10027HN_SDS Product short data sheet ADC input 0 TDA10027HN NXP Semiconductors Dual cable demodulator with Out-Of Band receiver 6. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Tstg storage temperature Tj junction temperature VESD electrostatic discharge voltage EIA/JESD22-A114 (human body model) [1] EIA/JESD22-C101-C (FCDM) [1] Min Max Unit 40 +150 C - 120 C 2 - kV 0.5 - kV It withstands class IV of JEDEC standard. 7. Abbreviations Table 4. Abbreviations Acronym Description ADC Analog to Digital Converter CDP Cable Downstream Processor CGU Clock Generation Unit DOCSIS Data Over Cable Service Interface Specifications DVB-C Digital Video Broadcasting - Cable FCDM Field-Induced Charged-Device Model FEC Forward Error Correction MAC Media Access Control OOB Out-Of Band PLL Phase-Locked Loop POD Point Of Deployement QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RGU Reset Generation Unit STB Set-Top Box TS Transport Stream TSMF Transport Stream Multiplex Frame US United States 8. Revision history Table 5. Revision history Document ID Release date Data sheet status Change notice Supersedes TDA10027HN_SDS v.1 20111108 Product short data sheet - - TDA10027HN_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 November 2011 © NXP B.V. 2011. All rights reserved. 4 of 8 TDA10027HN NXP Semiconductors Dual cable demodulator with Out-Of Band receiver 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. TDA10027HN_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 November 2011 © NXP B.V. 2011. All rights reserved. 5 of 8 TDA10027HN NXP Semiconductors Dual cable demodulator with Out-Of Band receiver Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TDA10027HN_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 November 2011 © NXP B.V. 2011. All rights reserved. 6 of 8 TDA10027HN NXP Semiconductors Dual cable demodulator with Out-Of Band receiver 11. Tables Table 1. Table 2. Table 3. Quick reference data . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . .2 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .4 Table 4. Table 5. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 4 12. Figures Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 TDA10027HN_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 November 2011 © NXP B.V. 2011. All rights reserved. 7 of 8 TDA10027HN NXP Semiconductors Dual cable demodulator with Out-Of Band receiver 13. Contents 1 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 11 12 13 General description . . . . . . . . . . . . . . . . . . . . . . Features and benefits . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 2 2 3 4 4 4 5 5 5 5 6 6 7 7 8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 November 2011 Document identifier: TDA10027HN_SDS