TDA18273HN Hybrid (analog and digital) Silicon Tuner for terrestrial and cable TV reception Rev. 2 — 15 December 2010 Preliminary data sheet 1. General description The TDA18273HN is a high performance Silicon Tuner designed for terrestrial and cable TV reception for both analog and digital signals. The TDA18273HN supports all analog and digital TV standards and delivers a LOW IF (LIF) signal to a demodulator for analog TV and/or a channel demodulator for digital TV. 2. Features and benefits Fully integrated IF selectivity; eliminating the need for external SAW filters Worldwide multistandard terrestrial and cable Fully integrated oscillators Alignment free Single 3.3 V supply voltage Power level detector Integrated wideband gain control Crystal oscillator output buffer (16 MHz) for single crystal applications I2C-bus interface compatible with 3.3 V microcontrollers Self AGC synchronization mode (VSYNC) Very fast tuning time LIF channel center frequency output ranging from 3 MHz to 5 MHz 1.7 MHz, 6 MHz, 7 MHz, 8 MHz and 10 MHz channel bandwidths Ready for DVB-T2 and DVB-C2 RoHS compliant Strong immunity to spurious and field interferences TDA18273HN NXP Semiconductors Hybrid Silicon Tuner for terrestrial and cable TV reception 3. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit fRF RF frequency full range of RF input 42 - 870 MHz NFtun tuner noise figure 75 source; maximum gain - 4.0 4.6 dB jit phase jitter UHF; integrated from 250 Hz to 4 MHz - 0.4 0.6 degree CSO composite second-order worst interferer over RF distortion frequency with respect to wanted carrier - 60 55 dBc CTB composite triple beat worst interferer over RF frequency with respect to wanted carrier for frequency 550 MHz - 65 60 dBc worst interferer over RF frequency with respect to wanted carrier for frequency > 550 MHz - - 55 dBc at tuner input and minimum gain 122 - - ICP1dB [1] 1 dB input compression point [1] dBV Channel loading assumptions: 129 channels at 75 dBV each. 4. Ordering information Table 2. Ordering information Type number Package Name TDA18273HN/C1 TDA18273HN_SDS Preliminary data sheet Description HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 6 0.85 mm All information provided in this document is subject to legal disclaimers. Rev. 2 — 15 December 2010 Version SOT618-1 © NXP B.V. 2010. All rights reserved. 2 of 8 CAPRFAGC UHFHIGH UHFLOW VHFLOW CB TRAP band-split filter H3H5/ wireless filter IR mixer IF filters AGCK IF AGC IFP RFIN IFN RF FILTER AGC1 AGC2 RFAGC AGC3 VIFAGC AGC5 AGC4 FRAC-N DIVIDER PLD AGC CONTROL I2C-BUS CONTROL SDA AND INTERFACES SCL IRQ VTUNE CP XTALN XTALP VSYNC AS_XTSEL TEMPERATURE SENSOR XTOUT2 PULSE SHAPER Xtal LC VCO XTOUT1 VSYNC DETECTOR loop filter 001aam151 Fig 1. Block diagram TDA18273HN 3 of 8 © NXP B.V. 2010. All rights reserved. Hybrid Silicon Tuner for terrestrial and cable TV reception Rev. 2 — 15 December 2010 All information provided in this document is subject to legal disclaimers. LO DIVIDERS CLOCKS NXP Semiconductors SURGE LNA 5. Block diagram TDA18273HN_SDS Preliminary data sheet RF input 42-870 MHz VHFHIGH xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x TDA18273HN NXP Semiconductors Hybrid Silicon Tuner for terrestrial and cable TV reception 6. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC supply voltage VI input voltage Conditions Min Max Unit 0.3 +3.6 V VCC < 3.3 V 0.3 VCC + 0.3 V VCC > 3.3 V 0.3 +3.6 V Tstg storage temperature 40 +150 C Tj junction temperature - 125 C Tamb ambient temperature C VESD electrostatic discharge voltage 20 [1] EIA/JESD22-A114 (HBM) 2 +2 kV EIA/JESD22-C101-C (FCDM) class III[2] 750 - V [1] The maximum allowed ambient temperature Tamb(max) depends on the assembly conditions of the package and especially on the design of the Printed-Circuit Board (PCB) and die connection. The application mounting must be done in such a way that the maximum junction temperature is never exceeded. The junction temperature: Tj = Tamb + Tj-c. where Tj-c = power Rth. [2] Class III: 500 V to 1000 V. 7. Abbreviations Table 4. TDA18273HN_SDS Preliminary data sheet Abbreviations Acronym Description AGC Automatic Gain Control AGCK Automatic Gain Control step Killer CB Citizen Band DVB Digital Video Broadcasting DVB-T/T2/C/C2/H DVB-Terrestrial/Terrestrial second generation/Cable/Handheld FCDM Field-induced Charged-Device Model FRAC-N Fractional-N HBM Human Body Model IF Intermediate Frequency IR Image Rejection LNA Low-Noise Amplifier LO Local Oscillator PCB Printed Circuit Board PLD Power Level Detector RF Radio Frequency RoHS Restriction of Hazardous Substances SAW Surface Acoustic Wave UHF Ultra High Frequency VHF Very High Frequency VSYNC Vertical SYNChronization Xtal Crystal All information provided in this document is subject to legal disclaimers. Rev. 2 — 15 December 2010 © NXP B.V. 2010. All rights reserved. 4 of 8 TDA18273HN NXP Semiconductors Hybrid Silicon Tuner for terrestrial and cable TV reception 8. Revision history Table 5. Revision history Document ID TDA18273HN_SDS [1] v.2[1] Release date Data sheet status Change notice Supersedes 20101215 Preliminary data sheet - - SDS revision 1 is not available. TDA18273HN_SDS Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 15 December 2010 © NXP B.V. 2010. All rights reserved. 5 of 8 TDA18273HN NXP Semiconductors Hybrid Silicon Tuner for terrestrial and cable TV reception 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. TDA18273HN_SDS Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 15 December 2010 © NXP B.V. 2010. All rights reserved. 6 of 8 TDA18273HN NXP Semiconductors Hybrid Silicon Tuner for terrestrial and cable TV reception Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Licenses ICs with DVB-T or DVB-T2 functionality Use of this product in any manner that complies with the DVB-T or the DVB-T2 standard may require licenses under applicable patents of the DVB-T respectively the DVB-T2 patent portfolio, which license is available from Sisvel S.p.A., Via Sestriere 100, 10060 None (TO), Italy, and under applicable patents of other parties. 9.5 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. Silicon Tuner — is a trademark of NXP B.V. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TDA18273HN_SDS Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 15 December 2010 © NXP B.V. 2010. All rights reserved. 7 of 8 TDA18273HN NXP Semiconductors Hybrid Silicon Tuner for terrestrial and cable TV reception 11. Contents 1 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 9.5 10 11 General description . . . . . . . . . . . . . . . . . . . . . . Features and benefits . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 2 2 3 4 4 5 6 6 6 6 7 7 7 8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 15 December 2010 Document identifier: TDA18273HN_SDS