BFG35 NPN 4 GHz wideband transistor

DISCRETE SEMICONDUCTORS
DATA SHEET
BFG35
NPN 4 GHz wideband transistor
Product specification
Supersedes data of 1995 Sep 12
1999 Aug 24
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
DESCRIPTION
BFG35
PINNING
NPN planar epitaxial transistor
mounted in a plastic SOT223
envelope, intended for wideband
amplifier applications. It features high
output voltage capabilities.
PIN
DESCRIPTION
1
emitter
2
base
3
emitter
4
collector
4
lfpage
1
2
Top view
3
MSB002 - 1
Fig.1 SOT223.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT


18
V


150
mA

1
W
70

VCEO
collector-emitter voltage
IC
DC collector current
Ptot
total power dissipation
up to Ts = 135 C (note 1)

hFE
DC current gain
IC = 100 mA; VCE = 10 V; Tj = 25 C
25
fT
transition frequency
IC = 100 mA; VCE = 10 V;
f = 500 MHz; Tamb = 25 C

4

GHz
GUM
maximum unilateral power gain IC = 100 mA; VCE = 10 V;
f = 500 MHz; Tamb = 25 C

15

dB
IC = 100 mA; VCE = 10 V;
f = 800 MHz; Tamb = 25 C

11

dB
IC = 100 mA; VCE = 10 V;
dim = 60 dB; RL = 75 ;
f(p+qr) = 793.25 MHz; Tamb = 25 C

750

mV
Vo
output voltage
open base
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
open emitter

25
V
collector-emitter voltage
open base

18
V
emitter-base voltage
open collector

2
V

150
mA
VCBO
collector-base voltage
VCEO
VEBO
IC
DC collector current
Ptot
total power dissipation

1
W
Tstg
storage temperature
up to Ts = 135 C (note 1)
65
+150
C
Tj
junction temperature

175
C
Note
1. Ts is the temperature at the soldering point of the collector tab.
1999 Aug 24
2
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
BFG35
THERMAL CHARACTERISTICS
SYMBOL
Rth j-s
PARAMETER
CONDITIONS
VALUE
UNIT
thermal resistance from junction to soldering point
up to Ts = 135 C (note 1)
40
K/W
Note
1. Ts is the temperature at the soldering point of the collector tab.
CHARACTERISTICS
Tj = 25 C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
ICBO
collector cut-off current
IE = 0; VCB = 10 V


1
hFE
DC current gain
IC = 100 mA; VCE = 10 V
25
70

Cc
collector capacitance
IE = ie = 0; VCB = 10 V; f = 1 MHz

2

Ce
emitter capacitance
IC = ic = 0; VEB = 0.5 V; f = 1 MHz

10

pF
Cre
feedback capacitance
IC = 0; VCE = 10 V; f = 1 MHz

1.2

pF
fT
transition frequency
IC = 100 mA; VCE = 10 V;
f = 500 MHz; Tamb = 25 C

4

GHz
GUM
maximum unilateral power gain
(note 1)
IC = 100 mA; VCE = 10 V;
f = 500 MHz; Tamb = 25 C

15

dB
IC = 100 mA; VCE = 10 V;
f = 800 MHz; Tamb = 25 C

11

dB
note 2

750

mV
note 3

800

mV
note 4

55

dB
note 5

57

dB
Vo
output voltage
d2
second order intermodulation
distortion
Notes
A
pF
s 21 2
dB.
1. GUM is the maximum unilateral power gain, assuming S12 is zero and G UM = 10 log ------------------------------------------------------- 1 – s 11 2   1 – s 22 2 
2. dim = 60 dB (DIN 45004B); IC = 100 mA; VCE = 10 V; RL = 75 ; Tamb = 25 C
Vp = Vo at dim = 60 dB; fp = 795.25 MHz;
Vq = Vo 6 dB; fq = 803.25 MHz;
Vr = Vo 6 dB; fr = 805.25 MHz;
measured at f(p+qr) = 793.25 MHz.
3. dim = 60 dB (DIN 45004B); IC = 100 mA; VCE = 10 V; RL = 75 ; Tamb = 25 C
Vp = Vo at dim = 60 dB; fp = 445.25 MHz;
Vq = Vo 6 dB; fq = 453.25 MHz;
Vr = Vo 6 dB; fr = 455.25 MHz;
measured at f(p+qr) = 443.25 MHz.
4. IC = 60 mA; VCE = 10 V; RL = 75 ;
Vp = Vq = Vo = 50 dBmV;
f(p+q) = 450 MHz; fp = 50 MHz; fq = 400 MHz.
5. IC = 60 mA; VCE = 10 V; RL = 75 ;
Vp = Vq = VO = 50 dBmV;
f(p+q) = 810 MHz; fp = 250 MHz; fq = 560 MHz.
1999 Aug 24
3
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
BFG35
;;;;;;
VCC
handbook, full pagewidth
C4
L6
C5
L5
VBB
C3
input
75 Ω
C1
C6
L3
R1
output
75 Ω
R2
L1
L2
L4
DUT
C7
C2
R3
R4
MBB284
Fig.2 Intermodulation and second harmonic test circuit.
List of components (see test circuit)
DESIGNATION
DESCRIPTION
VALUE
DIMENSIONS
CATALOGUE NO.
C1, C3, C5, C6
multilayer ceramic capacitor
10 nF
2222 590 08627
C2, C7
multilayer ceramic capacitor
1 pF
2222 851 12108
C4 (note 1)
miniature ceramic plate capacitor
10 nF
2222 629 08103
L1
microstrip line
75 
length 7mm;
width 2.5 mm
L2
microstrip line
75 
length 22mm;
width 2.5 mm
L3 (note 1)
1.5 turns 0.4 mm copper wire
L4
microstripline
75 
L5
Ferroxcube choke
5 H
L6 (note 1)
0.4 mm copper wire
25 nH
R1
metal film resistor
10 k
2322 180 73103
R2 (note 1)
metal film resistor
200 
2322 180 73201
R3, R4
metal film resistor
27 
2322 180 73279
int. dia. 3 mm;
winding pitch 1 mm
length 19 mm;
width 2.5 mm
3122 108 20153
length 30 mm
Note
1. Components C4, L3, L6 and R2 are mounted on the underside of the PCB.
The circuit is constructed on a double copper-clad printed circuit board with PTFE dielectric (r = 2.2);
thickness 116 inch; thickness of copper sheet 132 inch.
1999 Aug 24
4
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
BFG35
handbook, full pagewidth
VBB
VCC
C3
C5
R1
75 Ω
input
L5
R3
C1
L3
L1
L2
C2
C6
75 Ω
output
L4
C7
R2
R4
L6
C4
MBB299
handbook, full pagewidth
80 mm
60 mm
MBB298
handbook, full pagewidth
MBB297
Fig.3 Intermodulation test circuit printed circuit board.
1999 Aug 24
5
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
BFG35
MBB336
MBB361
1.2
120
handbook, halfpage
handbook,
halfpage
P
tot
(W)
h FE
1.0
0.8
80
0.6
0.4
40
0.2
0
0
0
50
100
150
200
( o C)
Ts
0
40
80
120
160
I C (mA)
VCE = 10 V; Tj = 25 C.
Fig.5
DC current gain as a function of collector
current.
Fig.4 Power derating curve.
MBB381
MBB357
8
3
handbook, halfpage
handbook, halfpage
fT
(GHz)
C re
(pF)
6
2
4
1
2
0
0
0
4
8
12
0
16
20
VCE (V)
40
80
160
I C (mA)
IE = 0; f = 1 MHz; Tj = 25 C.
VCE = 10 V; f = 500 MHz; Tj = 25 C
Fig.6
Fig.7
Feedback capacitance as a function of
collector-emitter voltage.
1999 Aug 24
120
6
Transition frequency as a function of
collector current.
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
BFG35
MBB386
MBB385
40
45
handbook, halfpage
handbook, halfpage
d im
(dB)
G UM
(dB)
50
30
55
20
60
10
65
0
10
10
2
103
f (MHz)
10
70
20
4
40
60
80
100
120
I C (mA)
IC = 100 mA; VCE = 10 V; Tamb = 25 C.
VCE = 10 V; Vo = 800 mV; f(p+qr) = 443.25 MHz; Tamb = 25 C.
Fig.8
Fig.9
Maximum unilateral power gain as a
function of frequency.
Intermodulation distortion as a function of
collector current.
MBB383
MBB382
45
45
handbook, halfpage
handbook, halfpage
d im
(dB)
d2
(dB)
50
50
55
55
60
60
65
65
70
20
40
60
80
70
20
100
120
I C (mA)
40
60
80
100
120
I C (mA)
VCE = 10 V; Vo = 750 mV; f(p+qr) = 793.25 MHz; Tamb = 25 C.
VCE = 10 V; Vo = 50 dBmV; f(p+q) = 450 MHz; Tamb = 25 C.
Fig.10 Intermodulation distortion as a function of
collector current.
Fig.11 Second order intermodulation distortion as
a function of collector current.
1999 Aug 24
7
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
BFG35
MBB384
45
handbook, halfpage
d2
(dB)
50
55
60
65
70
20
40
60
80
100
120
I C (mA)
VCE = 10 V; Vo = 50 dBmV; f(p+q) = 810 MHz; Tamb = 25 C.
Fig.12 Second order intermodulation distortion as
a function of collector current.
1999 Aug 24
8
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
BFG35
50
handbook, full pagewidth
25
100
0
10
250
+j
10
0
25
50
100
250
–j
250
10
3 GHz
100
25
MBB380
50
IC = 100 mA; VCE = 10 V; Tamb = 25 C; Zo = 50 .
Fig.13 Common emitter input reflection coefficient (S11).
90 o
handbook, full pagewidth
60 o
120 o
150 o
180 o
50
30 o
40
30
20
10
0o
30 o
150 o
60 o
120 o
90 o
MBB286
IC = 100 mA; VCE = 10 V; Tamb = 25 C.
Fig.14 Common emitter forward transmission coefficient (S21).
1999 Aug 24
9
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
BFG35
90 o
handbook, full pagewidth
60 o
120 o
150 o
30 o
0.1 0.2
180 o
0.3 0.4
0.5
0.6
0o
30 o
150 o
60 o
120 o
90 o
MBB285
IC = 100 mA; VCE = 10 V; Tamb = 25 C.
Fig.15 Common emitter reverse transmission coefficient (S12).
50
handbook, full pagewidth
25
100
10
250
0
+j
0
10
25
50
100
250
–j
250
10
3 GHz
100
25
50
MBB379
IC = 100 mA; VCE = 10 V; Tamb = 25 C; Zo = 50 .
Fig.16 Common emitter output reflection coefficient (S22).
1999 Aug 24
10
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
BFG35
PACKAGE OUTLINE
Plastic surface-mounted package with increased heatsink; 4 leads
D
SOT223
E
B
A
X
c
y
HE
v M A
b1
4
Q
A
A1
1
2
3
Lp
bp
e1
w M B
detail X
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
b1
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.8
1.5
0.10
0.01
0.80
0.60
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3
4.6
2.3
7.3
6.7
1.1
0.7
0.95
0.85
0.2
0.1
0.1
OUTLINE
VERSION
SOT223
1999 Aug 24
REFERENCES
IEC
JEDEC
JEITA
SC-73
11
EUROPEAN
PROJECTION
ISSUE DATE
04-11-10
06-03-16
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
BFG35
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
Right to make changes  NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
DEFINITIONS
Product specification  The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
Suitability for use  NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
DISCLAIMERS
Limited warranty and liability  Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications  Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
1999 Aug 24
12
NXP Semiconductors
Product specification
NPN 4 GHz wideband transistor
BFG35
Export control  This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Quick reference data  The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products  Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Limiting values  Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
Terms and conditions of commercial sale  NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license  Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
1999 Aug 24
13
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R77/03/pp14
Date of release: 1999 Aug 24