Surface Mountable PTC Resettable Fuse: FSMD050-24-1206R 1. Summary (a) RoHS Compliant & Halogen Free (b) Applications: All high-density boards (c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices (d) Operation Current: 500mA (e) Maximum Voltage: 24V (f) Temperature Range : -40℃ to 85℃ 2. Agency Recognition UL : E211981 C-UL: E211981 TÜV: R50090556 3. Electrical Characteristics (23℃) Part Number Hold Trip Rated Max Typical Max Time to Trip Current Current Voltage Current Power Current Time RMIN R1MAX IH, A IT, A VMAX, Vdc IMAX, A Pd, W Amp Sec Ω Ω 0.50 1.00 24 100 0.6 8.00 0.10 0.150 0.750 FSMD050-24-1206R Resistance IH=Hold current-maximum current at which the device will not trip at 23℃still air. IT=Trip current-minimum current at which the device will always trip at 23℃ still air. V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment. RMIN=Minimum device resistance at 23℃ prior to tripping. R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin 4. FSMD Product Dimensions (Millimeters) Part Number FSMD050-24-1206R A B C D E Min Max Min Max Min Max Min Max Min Max 3.00 3.50 1.50 1.80 0.90 1.30 0.25 0.75 0.10 0.45 NOTE : Specification subject to change without notice. 5. Thermal Derating Curve Thermal Derating Curve, FSMD050-24-1206R Percent of Rated Hold and Trip Current 200% 150% 100% 50% 0% -40 -20 0 20 40 60 80 Ambient Temperature (C) 6. Typical Time-To-Trip at 23℃ FSMD050-24-1206R 100 Time-to-Trip (s) 10 1 0.1 0.01 0.1 1 10 Fault current (A) NOTE : Specification subject to change without notice. 100 7. Material Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 8. Part Numbering and Marking System Part Numbering System Part Marking System F S M D □ □ □ – □ □ – 1206 R FN Voltage rating Current rating F □ Part Identification Example 9. Pad Layouts、Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD1206 device Pad dimensions (millimeters) A Device Nominal FSMD050-24-1206R 2.00 Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : 20-40 seconds Temperature (tp) Ramp-Down Rate : 6 ℃/second max. 8 minutes max. Time 25 ℃ to Peak Temperature : Note 1: All temperatures refer to of the package, measured on the package body surface. NOTE : Specification subject to change without notice. B Nominal 1.00 C Nominal 1.90 Solder reflow ※ Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 1. Recommended max past thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Envorinment : < 30℃ / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board. Reflow Profile Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible 甲、 electrical arcing and/or flame. -PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance. NOTE : Specification subject to change without notice. 7-P-823-4 Vol. 7 FSMD1206 Series tape and reel specifications (dimensions in millimeters) Dimension EIA MARK Dim(mm) Tol.(mm) W 8.0 +0.3 P0 4.0 +0.10 P1 4.0 +0.10 P2 2.0 +0.10 A0 1.95 +0.10 B0 3.58 +0.10 B1max 4.35 D0 1.5 +0.10 F 3.5 +0.05 E1 1.75 +0.10 E2 min. 6.25 T min. 0.6 T1 max. 0.1 K0 (FSMD005-1206~FSMD050-1206 & FSMD005-1206-R~FSMD050-1206-R) 0.8 +0.10 K0 ( FSMD075-1206R~FSMD200-1206R & FSMD050-24-1206R) 1.7 +0.10 Leader min. 390 Trailer min. 160 Reel Dimensions A max 185 N min. 50 W1 8.4 W2 max. 14.4 1 max +1.5/-0.0 7-P-823-4 Vol. 7 FSMD1206 Series Standard Package P/N FSMD005-1206 FSMD005-1206-R FSMD010-1206 FSMD010-1206-R FSMD012-1206 FSMD012-1206-R FSMD016-1206 FSMD016-1206-R FSMD020-1206 FSMD020-1206-R FSMD025-1206 FSMD025-1206-R Pcs /Bag Reel/Tape P/N Pcs /Bag Reel/Tape ------------------------------------------------------------------------- 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 FSMD035-1206 FSMD035-1206-R FSMD050-1206 FSMD050-1206-R FSMD050-24-1206R FSMD075-1206R FSMD075-16-1206R FSMD100-1206R FSMD110-1206R FSMD150-1206R FSMD200-1206R ------------------------------------------------------------------- 4000 4000 4000 4000 3000 3000 3000 3000 3000 2000 2000 2 7-P-823-4 Vol. 7 3