Surface Mount PPTC RoHS Compliant & Halogen Free FSMD1210 Series Application: All high-density boards Product Features: Small surface mount, Solid state Faster time to trip than standard SMD devices Lower resistance than standard SMD devices Operation Current: 0.05A~2.00A Maximum Voltage: 6V~60VDC Temperature Range: -40℃ to 85℃ Agency Recognition : UL (E211981) C-UL (E211981) TÜV (R50090556) Electrical Characteristics(23℃ ℃) Part Number FSMD005-1210-R FSMD010-1210-R FSMD020-1210-R FSMD035-1210-R FSMD050-1210-R FSMD075-1210-R FSMD110-1210R FSMD150-1210R FSMD175-1210R FSMD200-1210R Hold Trip Current Current Rated Max Typ. Voltage Current Power Current Time RMIN R1MAX Max Time to Trip Resistance IH, A IT, A VMAX, VDC IMAX, A Pd, W A Sec Ohms Ohms 0.05 0.10 0.20 0.35 0.50 0.75 1.10 1.50 1.75 2.00 0.15 0.25 0.40 0.70 1.00 1.50 2.20 3.00 4.00 4.00 60 60 30 16 16 8 6 6 6 6 10 10 10 40 40 40 100 100 100 100 0.60 0.60 0.60 0.60 0.60 0.60 0.80 0.80 0.80 0.80 0.25 0.50 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 3.00 1.50 0.02 0.20 0.10 0.10 0.30 0.50 0.60 1.00 3.600 1.600 0.800 0.320 0.250 0.130 0.060 0.040 0.020 0.015 50.000 15.000 5.000 1.300 0.900 0.400 0.210 0.110 0.080 0.070 Termination pad characteristics Termination pad materials: Pure Tin Thermal Derating for PPTC Device at Various Ambient Temperatures TEMPERATURE DERATING % -40 -20 155% 132% 0 115% FSMD1210 Product Dimensions (mm) 23 30 40 50 60 70 85 100% 92% 83% 75% 64% 59% 46% C D E Part A B Min Max Min Max Min Max Min Max Min Max Number FSMD005-1210-R 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 0.10 0.45 FSMD010-1210-R 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 0.10 0.45 FSMD020-1210-R 3.00 3.43 2.35 2.80 0.40 0.85 0.25 0.75 0.10 0.45 FSMD035-1210-R 3.00 3.43 2.35 2.80 0.40 0.80 0.25 0.75 0.10 0.45 FSMD050-1210-R 3.00 3.43 2.35 2.80 0.30 0.75 0.25 0.75 0.10 0.45 FSMD075-1210-R 3.00 3.43 2.35 2.80 0.30 0.70 0.25 0.75 0.10 0.45 FSMD110-1210R 3.00 3.43 2.35 2.80 0.60 1.00 0.25 0.75 0.10 0.45 FSMD150-1210R 3.00 3.43 2.35 2.80 0.50 0.90 0.25 0.75 0.10 0.45 FSMD175-1210R 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45 FSMD200-1210R 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45 Thermal Derating Curve Thermal Derating Curve - FSMD1210 Series Percentage of Rated Hold and Trip Current 200% 150% 100% 50% 0% -40 -20 0 20 40 Ambient Temperature ( 60 80 ℃) Typical Time-To-Trip at 23℃ ℃ A =FSMD005-1210-R B =FSMD010-1210-R C =FSMD020-1210-R D =FSMD035-1210-R E =FSMD050-1210-R F =FSMD075-1210-R G =FSMD110-1210R H =FSMD150-1210R I =FSMD175-1210R J =FSMD200-1210R B 100 C D E FG H IJ 10 Time-to-trip (S) A 1 0.1 0.01 0.001 0.1 1 10 100 Fault current (A) Part Numbering System Part Marking System F75 F S M D □ □ □ - 1210 R Current Rating Example Standard Package FSMD005-1210-R~FSMD020-1210-R FSMD035-1210-R~FSMD075-1210-R FSMD110-1210R~FSMD200-1210R : : : 3.0K Reel/Tape 4.0K Reel/Tape 3.0K Reel/Tape F □ □ Part Identification F05 =FSMD005-1210-R F10 =FSMD010-1210-R F20 =FSMD020-1210-R F35 =FSMD035-1210-R F50 =FSMD050-1210-R F75 =FSMD075-1210-R F11 =FSMD110-1210R F15 =FSMD150-1210R F17 =FSMD175-1210R F21 =FSMD200-1210R Surface Mount PPTC Pad Layouts、 、Solder Reflow Recommendations The dimensions in the table below provide the recommended pad layout for Surface Mount Device in different footprints. Pad dimensions (Millimeter) A Device Nominal All 2920 Series 5.10 All 1812 Series 3.45 All 1210 Series 2.00 All 1206 Series 2.00 All 0805 Series 1.20 Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max. Preheat : Temperature Min (Tsmin) 150 ℃ Temperature Max (Tsmax) 200 ℃ Time (tsmin to tsmax) 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ ℃ of actual Peak : 20-40 seconds Temperature (tp) Ramp-Down Rate : 6 ℃/second max. 8 minutes max. Time 25 ℃ to Peak Temperature : Note 1: All temperatures refer to the package, measured on the package body surface. B Nominal 2.30 1.78 1.00 1.00 1.00 C Nominal 5.60 3.50 2.80 1.90 1.50 Solder reflow ※ Due to “Lead Free” nature, Temperature and Dwelling Time for the soldering zone is higher than those for Regular. This may cause damage to other components. 1. Recommended max paste thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Environment : < 30℃ / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board