Parallel Flash Product Selection Guide

Winbond’s W29GL family of 3-Volt Page-Mode Parallel Flash memories are offered in densities from 32Mb to 512Mb
and support industry standard interfaces, architectures and packages. They are drop-in replacements to the popular
“x29GL” products available in the industry, with no firmware change. The W29GL family also offers faster program and
erase times, which can improve production throughput and enable faster firmware updates. Winbond’s Parallel Flash
products are offered in industrial and automotive grades and are ideal for a wide variety of applications requiring the
higher performance of a parallel bus width and page mode operation.
W29GL Page Mode Parallel Flash Family
-
32Mb to 256Mb densities
Compatible with Industry Standard x29GL products
2.7V to 3.6V operation; also supports VIO at 1.8V
x8/x16 data bus configuration
70/90ns read access time, 25ns page mode access time
Provides many sector protection mechanisms
o Offers additional security of code/data
Package Options
-
-
Industry standard packages for 32Mb & 64Mb densities
o 48-pin TSOP (Top/Bottom Boot)
o 48-ball TFBGA (Top/Bottom Boot)
o 56-pin TSOP (High/Low Sector protect)
o 64-ball LFBGA (Top/Bottom Boot, High/Low Sector protect)
Industry standard packages for 128Mb to 512Mb densities
o 56-pin TSOP (High/Low Sector protect)
o 64-ball LFBGA (High/Low Sector protect)
Sector Erase Time (Typ)
600
mSec
400
200
0
Industry Standard
Special Features
-
Drop-in replacement of Industry Standard x29GL
o No firmware change needed
Saves 40% erase time and 60% program time
o Improves production throughput
o Faster firmware updates
Wide Range of Applications
-
Networking, Set-Top-Box, DSL and Cable modems
Wireless routers, Digital TV, Industrial, Automotive
PC peripherals, Printer, Mobile phones, Cameras and more
Save 40% Erase Time
Winbond
Effective Word Program Time (Typ)
15
Save 60% Program Time
10
µSec
5
0
Industry Standard
Winbond
Winbond also offers a complete family of Serial Flash products ranging from 512Kb through 512Mb in SPI, Dual-SPI, Quad-SPI and QPI versions.
Winbond Parallel Flash Memory Selection Guide 1,2,3
Secure Sectors
Density
512M-bit
256M-bit
128M-bit
64M-bit
32M-bit
Winbond Part # 4
Speed
(ns)
Page
Access (ns)
Package 5
Sample
Availability
90
25
TSOP56
Q2-2014
90
25
LFBGA64
Q2-2014
90
25
TSOP56
Q2-2014
90
25
LFBGA64
Q2-2014
90
25
TSOP56
Q1-2014
High Sector
90
25
LFBGA64
Q1-2014
Uniform Sector
Low Sector
90
25
TSOP56
Q1-2014
Uniform Sector
Low Sector
90
25
LFBGA64
Q1-2014
Boot/Uniform
Sectors
Sector
Location
W29GL512S/PHxT7
Uniform Sector
High Sector
7
W29GL512S/PHxB
Uniform Sector
High Sector
W29GL512S/PLxT7
Uniform Sector
Low Sector
W29GL512S/PLxB7
Uniform Sector
Low Sector
W29GL256S/PHxT7
Uniform Sector
High Sector
W29GL256S/PHxB7
Uniform Sector
7
W29GL256S/PLxB7
W29GL256S/PLxT
W29GL128CHxT
Uniform Sector
High Sector
90
25
TSOP56
Now
W29GL128CHxB
Uniform Sector
High Sector
90
25
LFBGA64
Now
W29GL128CLxT
Uniform Sector
Low Sector
90
25
TSOP56
Now
W29GL128CLxB
Uniform Sector
Low Sector
90
25
LFBGA64
Now
W29GL064CTxS
Top Boot
Top two sectors
70/90
25
TSOP48
Now
W29GL064CTxA
Top Boot
Top two sectors
70/90
25
TFBGA48
Now
W29GL064CTxB
Top Boot
Top two sectors
70/90
25
LFBGA64
Now
W29GL064CBxS
Bottom Boot
Bottom two sectors
70/90
25
TSOP48
Now
W29GL064CBxA
Bottom Boot
Bottom two sectors
70/90
25
TFBGA48
Now
W29GL064CB7B
Bottom Boot
Bottom two sectors
70/90
25
LFBGA64
Now
W29GL064CHxT
Uniform Sector
High Sector
70/90
25
TSOP56
Now
W29GL064CHxB
Uniform Sector
High Sector
70/90
25
LFBGA64
Now
W29GL064CLxT
Uniform Sector
Low Sector
70/90
25
TSOP56
Now
W29GL064CLxB
Uniform Sector
Low Sector
70/90
25
LFBGA64
Now
W29GL032CTxS
Top Boot
Top two sectors
70/90
25
TSOP48
Now
W29GL032CTxA
Top Boot
Top two sectors
70/90
25
TFBGA48
6
Now
W29GL032CTxB
Top Boot
Top two sectors
70/90
25
LFBGA64
Now
W29GL032CBxS
Bottom Boot
Bottom two sectors
70/90
25
TSOP48
Now
W29GL032CBxA
Bottom Boot
Bottom two sectors
70/90
25
TFBGA48
Now
6
W29GL032CBxB
Bottom Boot
Bottom two sectors
70/90
25
LFBGA64
Now
W29GL032CHxT
Uniform Sector
High Sector
70/90
25
TSOP566
Now
6
W29GL032CHxB
Uniform Sector
High Sector
70/90
25
LFBGA64
Now
W29GL032CLxT
Uniform Sector
Low Sector
70/90
25
TSOP566
Now
W29GL032CLxB
Uniform Sector
Low Sector
70/90
25
LFBGA646
Now
1. All parts operate from 2.7V to 3.6V. 2. See data sheet for additional technical information. 3. Subject to change without notice. 4. In the part number x=7:
Industrial (-40C to +85C) 70ns, x=9: Industrial (-40C to +85C) 90ns, x=J: Industrial Plus (-40C to +105C) 90ns, x=S: Automotive Grade1 (-40C to +125C) 90ns,
x=A: Automotive Grade2 (-40C to +105C) 90ns, x=B: Automotive Grade3 (-40C to +85C) 90ns. 5. "Green", Halogen-Free and RoHS compliant packaging.
KGD Wafer also available. S=TSOP48(12X20mm), T=TSOP56(14x20mm), B=LFBGA64(11x13mm), A=TFBGA48(6x8mm). 6. Contact Winbond for
availability of these LFBGA64 & TSOP56 packages. 7. S=Fast Program/Erase, x16 only; P=x8/x16.
Winbond Electronics Corporation (Headquarters)
No. 8, Keya Rd. I, Central Taiwan Science Park
Taichung County, 428, Taiwan, R.O.C.
Tel: 886-4-25218168
www.winbond.com
Winbond Electronics Corporation America
2727 North First Street, San Jose, CA 95134 USA
Tel: 1-408-943-6666 Fax: 1-408-544-1798
www.winbond-usa.com
www.spiflash.com
January 2014 REV 2.0