Winbond’s W29GL family of 3-Volt Page-Mode Parallel Flash memories are offered in densities from 32Mb to 512Mb and support industry standard interfaces, architectures and packages. They are drop-in replacements to the popular “x29GL” products available in the industry, with no firmware change. The W29GL family also offers faster program and erase times, which can improve production throughput and enable faster firmware updates. Winbond’s Parallel Flash products are offered in industrial and automotive grades and are ideal for a wide variety of applications requiring the higher performance of a parallel bus width and page mode operation. W29GL Page Mode Parallel Flash Family - 32Mb to 256Mb densities Compatible with Industry Standard x29GL products 2.7V to 3.6V operation; also supports VIO at 1.8V x8/x16 data bus configuration 70/90ns read access time, 25ns page mode access time Provides many sector protection mechanisms o Offers additional security of code/data Package Options - - Industry standard packages for 32Mb & 64Mb densities o 48-pin TSOP (Top/Bottom Boot) o 48-ball TFBGA (Top/Bottom Boot) o 56-pin TSOP (High/Low Sector protect) o 64-ball LFBGA (Top/Bottom Boot, High/Low Sector protect) Industry standard packages for 128Mb to 512Mb densities o 56-pin TSOP (High/Low Sector protect) o 64-ball LFBGA (High/Low Sector protect) Sector Erase Time (Typ) 600 mSec 400 200 0 Industry Standard Special Features - Drop-in replacement of Industry Standard x29GL o No firmware change needed Saves 40% erase time and 60% program time o Improves production throughput o Faster firmware updates Wide Range of Applications - Networking, Set-Top-Box, DSL and Cable modems Wireless routers, Digital TV, Industrial, Automotive PC peripherals, Printer, Mobile phones, Cameras and more Save 40% Erase Time Winbond Effective Word Program Time (Typ) 15 Save 60% Program Time 10 µSec 5 0 Industry Standard Winbond Winbond also offers a complete family of Serial Flash products ranging from 512Kb through 512Mb in SPI, Dual-SPI, Quad-SPI and QPI versions. Winbond Parallel Flash Memory Selection Guide 1,2,3 Secure Sectors Density 512M-bit 256M-bit 128M-bit 64M-bit 32M-bit Winbond Part # 4 Speed (ns) Page Access (ns) Package 5 Sample Availability 90 25 TSOP56 Q2-2014 90 25 LFBGA64 Q2-2014 90 25 TSOP56 Q2-2014 90 25 LFBGA64 Q2-2014 90 25 TSOP56 Q1-2014 High Sector 90 25 LFBGA64 Q1-2014 Uniform Sector Low Sector 90 25 TSOP56 Q1-2014 Uniform Sector Low Sector 90 25 LFBGA64 Q1-2014 Boot/Uniform Sectors Sector Location W29GL512S/PHxT7 Uniform Sector High Sector 7 W29GL512S/PHxB Uniform Sector High Sector W29GL512S/PLxT7 Uniform Sector Low Sector W29GL512S/PLxB7 Uniform Sector Low Sector W29GL256S/PHxT7 Uniform Sector High Sector W29GL256S/PHxB7 Uniform Sector 7 W29GL256S/PLxB7 W29GL256S/PLxT W29GL128CHxT Uniform Sector High Sector 90 25 TSOP56 Now W29GL128CHxB Uniform Sector High Sector 90 25 LFBGA64 Now W29GL128CLxT Uniform Sector Low Sector 90 25 TSOP56 Now W29GL128CLxB Uniform Sector Low Sector 90 25 LFBGA64 Now W29GL064CTxS Top Boot Top two sectors 70/90 25 TSOP48 Now W29GL064CTxA Top Boot Top two sectors 70/90 25 TFBGA48 Now W29GL064CTxB Top Boot Top two sectors 70/90 25 LFBGA64 Now W29GL064CBxS Bottom Boot Bottom two sectors 70/90 25 TSOP48 Now W29GL064CBxA Bottom Boot Bottom two sectors 70/90 25 TFBGA48 Now W29GL064CB7B Bottom Boot Bottom two sectors 70/90 25 LFBGA64 Now W29GL064CHxT Uniform Sector High Sector 70/90 25 TSOP56 Now W29GL064CHxB Uniform Sector High Sector 70/90 25 LFBGA64 Now W29GL064CLxT Uniform Sector Low Sector 70/90 25 TSOP56 Now W29GL064CLxB Uniform Sector Low Sector 70/90 25 LFBGA64 Now W29GL032CTxS Top Boot Top two sectors 70/90 25 TSOP48 Now W29GL032CTxA Top Boot Top two sectors 70/90 25 TFBGA48 6 Now W29GL032CTxB Top Boot Top two sectors 70/90 25 LFBGA64 Now W29GL032CBxS Bottom Boot Bottom two sectors 70/90 25 TSOP48 Now W29GL032CBxA Bottom Boot Bottom two sectors 70/90 25 TFBGA48 Now 6 W29GL032CBxB Bottom Boot Bottom two sectors 70/90 25 LFBGA64 Now W29GL032CHxT Uniform Sector High Sector 70/90 25 TSOP566 Now 6 W29GL032CHxB Uniform Sector High Sector 70/90 25 LFBGA64 Now W29GL032CLxT Uniform Sector Low Sector 70/90 25 TSOP566 Now W29GL032CLxB Uniform Sector Low Sector 70/90 25 LFBGA646 Now 1. All parts operate from 2.7V to 3.6V. 2. See data sheet for additional technical information. 3. Subject to change without notice. 4. In the part number x=7: Industrial (-40C to +85C) 70ns, x=9: Industrial (-40C to +85C) 90ns, x=J: Industrial Plus (-40C to +105C) 90ns, x=S: Automotive Grade1 (-40C to +125C) 90ns, x=A: Automotive Grade2 (-40C to +105C) 90ns, x=B: Automotive Grade3 (-40C to +85C) 90ns. 5. "Green", Halogen-Free and RoHS compliant packaging. KGD Wafer also available. S=TSOP48(12X20mm), T=TSOP56(14x20mm), B=LFBGA64(11x13mm), A=TFBGA48(6x8mm). 6. Contact Winbond for availability of these LFBGA64 & TSOP56 packages. 7. S=Fast Program/Erase, x16 only; P=x8/x16. Winbond Electronics Corporation (Headquarters) No. 8, Keya Rd. I, Central Taiwan Science Park Taichung County, 428, Taiwan, R.O.C. Tel: 886-4-25218168 www.winbond.com Winbond Electronics Corporation America 2727 North First Street, San Jose, CA 95134 USA Tel: 1-408-943-6666 Fax: 1-408-544-1798 www.winbond-usa.com www.spiflash.com January 2014 REV 2.0