W29GL Page Mode Parallel Flash Family Package

Winbond’s W29GL family of 3-Volt Page-Mode Parallel Flash memories are offered in densities from 32Mb to 512Mb
and support industry standard interfaces, architectures and packages. They are drop-in replacements to the popular
“x29GL” products available in the industry, with no firmware change. The W29GL family also offers faster program and
erase times, which can improve production throughput and enable faster firmware updates. Winbond’s Parallel Flash
products are offered in industrial and automotive grades and are ideal for a wide variety of applications requiring the
higher performance of a parallel bus width and page mode operation.
W29GL Page Mode Parallel Flash Family
-
32Mb to 512Mb densities
Compatible with Industry Standard x29GL products
2.7V to 3.6V operation; also supports VIO at 1.8V
x8/x16 data bus configuration
70/90ns read access time, 25ns page mode access time
Provides many sector protection mechanisms
o Offers additional security of code/data
Package Options
-
-
Industry standard packages for 32Mb & 64Mb densities
o 48-pin TSOP (Top/Bottom Boot)
o 48-ball TFBGA (Top/Bottom Boot)
o 56-pin TSOP (High/Low Sector protect)
o 64-ball LFBGA (Top/Bottom Boot, High/Low Sector protect)
Industry standard packages for 128Mb to 512Mb densities
o 56-pin TSOP (High/Low Sector protect)
o 56-ball TFBGA (High/Low Sector protect)
o 64-ball LFBGA (High/Low Sector protect)
Sector Erase Time (Typ)
600
400
mSec
200
0
Industry Standard
Special Features
-
Drop-in replacement of Industry Standard x29GL
o No firmware change needed
Saves 40% erase time and 60% program time
o Improves production throughput
o Faster firmware updates
Wide Range of Applications
-
Networking, Set-Top-Box, DSL and Cable modems
Wireless routers, Digital TV, Industrial, Automotive
PC peripherals, Printer, Mobile phones, Cameras and more
Save 40% Erase Time
Winbond
Effective Word Program Time (Typ)
15
Save 60% Program Time
10
µSec
5
0
Industry Standard
Winbond
Winbond also offers a complete family of Serial Flash products ranging from 512Kb through 512Mb in SPI, Dual-SPI, Quad-SPI and QPI versions.
Winbond Parallel Flash Memory Selection Guide 1,2,3
Density
Winbond Part # 4
W29GL512S/PH9T7
W29GL512S/PH9B7
512M-bit
W29GL512S/PL9T7
W29GL512S/PL9B7
W29GL256S/PH9T7
W29GL256S/PH9B7
W29GL256S/PH9C7
256M-bit
W29GL256S/PL9T7
W29GL256S/PL9B7
W29GL256S/PL9C7
W29GL128CH9T
W29GL128CH9B
128M-bit
W29GL128CL9T
W29GL128CL9B
W29GL064CTxS
W29GL064CTxA
W29GL064CTxB
W29GL064CBxS
W29GL064CBxA
64M-bit
W29GL064CB7B
W29GL064CHxT
W29GL064CHxB
W29GL064CLxT
W29GL064CLxB
W29GL032CTxS
W29GL032CTxA
W29GL032CTxB
W29GL032CBxS
W29GL032CBxA
32M-bit
W29GL032CBxB
W29GL032CHxT
W29GL032CHxB
W29GL032CLxT
W29GL032CLxB
Secure Sectors
Boot/Uniform
Sector
Sectors
Location
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Top Boot
Top Boot
Top Boot
Bottom Boot
Bottom Boot
Bottom Boot
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
Top Boot
Top Boot
Top Boot
Bottom Boot
Bottom Boot
Bottom Boot
Uniform Sector
Uniform Sector
Uniform Sector
Uniform Sector
High Sector
High Sector
Low Sector
Low Sector
High Sector
High Sector
High Sector
Low Sector
Low Sector
Low Sector
High Sector
High Sector
Low Sector
Low Sector
Top two sectors
Top two sectors
Top two sectors
Bottom two sectors
Bottom two sectors
Bottom two sectors
High Sector
High Sector
Low Sector
Low Sector
Top two sectors
Top two sectors
Top two sectors
Bottom two sectors
Bottom two sectors
Bottom two sectors
High Sector
High Sector
Low Sector
Low Sector
Speed
(ns)
Page
Access (ns)
Package 5
Sample
Availability
90
90
90
90
90
90
90
90
90
90
90
90
90
90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
70/90
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
TSOP56
LFBGA64
TSOP56
LFBGA64
TSOP56
LFBGA64
TFBGA56
TSOP56
LFBGA64
TFBGA56
TSOP56
LFBGA64
TSOP56
LFBGA64
TSOP48
TFBGA48
LFBGA64
TSOP48
TFBGA48
LFBGA64
TSOP56
LFBGA64
TSOP56
LFBGA64
TSOP48
TFBGA48
LFBGA646
TSOP48
TFBGA48
LFBGA646
TSOP566
LFBGA646
TSOP566
LFBGA646
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
1. All parts operate from 2.7V to 3.6V. 2. See data sheet for additional technical information. 3. Subject to change without notice. 4. In the part number x=7:
Industrial (-40C to +85C) 70ns, x=9: Industrial (-40C to +85C) 90ns, x=J: Industrial Plus (-40C to +105C) 90ns, x=S: Automotive Grade1 (-40C to +125C) 90ns,
x=A: Automotive Grade2 (-40C to +105C) 90ns, x=B: Automotive Grade3 (-40C to +85C) 90ns. 5. "Green", Halogen-Free and RoHS compliant packaging.
KGD Wafer also available. S=TSOP48(12X20mm), T=TSOP56(14x20mm), C=TFBGA56(7x9mm), B=LFBGA64(11x13mm), A=TFBGA48(6x8mm). 6. Contact
Winbond for availability of these LFBGA64 & TSOP56 packages. 7. S=Fast Program/Erase, x16 only; P=x8/x16.
Winbond Electronics Corporation (Headquarters)
No. 8, Keya Rd. I, Central Taiwan Science Park
Taichung County, 428, Taiwan, R.O.C.
Tel: 886-4-25218168
www.winbond.com
Winbond Electronics Corporation America
2727 North First Street, San Jose, CA 95134 USA
Tel: 1-408-943-6666 Fax: 1-408-544-1798
www.winbond-usa.com
www.spiflash.com
February 2015 REV 2.3