Winbond’s W29GL family of 3-Volt Page-Mode Parallel Flash memories are offered in densities from 32Mb to 512Mb and support industry standard interfaces, architectures and packages. They are drop-in replacements to the popular “x29GL” products available in the industry, with no firmware change. The W29GL family also offers faster program and erase times, which can improve production throughput and enable faster firmware updates. Winbond’s Parallel Flash products are offered in industrial and automotive grades and are ideal for a wide variety of applications requiring the higher performance of a parallel bus width and page mode operation. W29GL Page Mode Parallel Flash Family - 32Mb to 512Mb densities Compatible with Industry Standard x29GL products 2.7V to 3.6V operation; also supports VIO at 1.8V x8/x16 data bus configuration 70/90ns read access time, 25ns page mode access time Provides many sector protection mechanisms o Offers additional security of code/data Package Options - - Industry standard packages for 32Mb & 64Mb densities o 48-pin TSOP (Top/Bottom Boot) o 48-ball TFBGA (Top/Bottom Boot) o 56-pin TSOP (High/Low Sector protect) o 64-ball LFBGA (Top/Bottom Boot, High/Low Sector protect) Industry standard packages for 128Mb to 512Mb densities o 56-pin TSOP (High/Low Sector protect) o 56-ball TFBGA (High/Low Sector protect) o 64-ball LFBGA (High/Low Sector protect) Sector Erase Time (Typ) 600 400 mSec 200 0 Industry Standard Special Features - Drop-in replacement of Industry Standard x29GL o No firmware change needed Saves 40% erase time and 60% program time o Improves production throughput o Faster firmware updates Wide Range of Applications - Networking, Set-Top-Box, DSL and Cable modems Wireless routers, Digital TV, Industrial, Automotive PC peripherals, Printer, Mobile phones, Cameras and more Save 40% Erase Time Winbond Effective Word Program Time (Typ) 15 Save 60% Program Time 10 µSec 5 0 Industry Standard Winbond Winbond also offers a complete family of Serial Flash products ranging from 512Kb through 512Mb in SPI, Dual-SPI, Quad-SPI and QPI versions. Winbond Parallel Flash Memory Selection Guide 1,2,3 Density Winbond Part # 4 W29GL512S/PH9T7 W29GL512S/PH9B7 512M-bit W29GL512S/PL9T7 W29GL512S/PL9B7 W29GL256S/PH9T7 W29GL256S/PH9B7 W29GL256S/PH9C7 256M-bit W29GL256S/PL9T7 W29GL256S/PL9B7 W29GL256S/PL9C7 W29GL128CH9T W29GL128CH9B 128M-bit W29GL128CL9T W29GL128CL9B W29GL064CTxS W29GL064CTxA W29GL064CTxB W29GL064CBxS W29GL064CBxA 64M-bit W29GL064CB7B W29GL064CHxT W29GL064CHxB W29GL064CLxT W29GL064CLxB W29GL032CTxS W29GL032CTxA W29GL032CTxB W29GL032CBxS W29GL032CBxA 32M-bit W29GL032CBxB W29GL032CHxT W29GL032CHxB W29GL032CLxT W29GL032CLxB Secure Sectors Boot/Uniform Sector Sectors Location Uniform Sector Uniform Sector Uniform Sector Uniform Sector Uniform Sector Uniform Sector Uniform Sector Uniform Sector Uniform Sector Uniform Sector Uniform Sector Uniform Sector Uniform Sector Uniform Sector Top Boot Top Boot Top Boot Bottom Boot Bottom Boot Bottom Boot Uniform Sector Uniform Sector Uniform Sector Uniform Sector Top Boot Top Boot Top Boot Bottom Boot Bottom Boot Bottom Boot Uniform Sector Uniform Sector Uniform Sector Uniform Sector High Sector High Sector Low Sector Low Sector High Sector High Sector High Sector Low Sector Low Sector Low Sector High Sector High Sector Low Sector Low Sector Top two sectors Top two sectors Top two sectors Bottom two sectors Bottom two sectors Bottom two sectors High Sector High Sector Low Sector Low Sector Top two sectors Top two sectors Top two sectors Bottom two sectors Bottom two sectors Bottom two sectors High Sector High Sector Low Sector Low Sector Speed (ns) Page Access (ns) Package 5 Sample Availability 90 90 90 90 90 90 90 90 90 90 90 90 90 90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 70/90 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 TSOP56 LFBGA64 TSOP56 LFBGA64 TSOP56 LFBGA64 TFBGA56 TSOP56 LFBGA64 TFBGA56 TSOP56 LFBGA64 TSOP56 LFBGA64 TSOP48 TFBGA48 LFBGA64 TSOP48 TFBGA48 LFBGA64 TSOP56 LFBGA64 TSOP56 LFBGA64 TSOP48 TFBGA48 LFBGA646 TSOP48 TFBGA48 LFBGA646 TSOP566 LFBGA646 TSOP566 LFBGA646 Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now 1. All parts operate from 2.7V to 3.6V. 2. See data sheet for additional technical information. 3. Subject to change without notice. 4. In the part number x=7: Industrial (-40C to +85C) 70ns, x=9: Industrial (-40C to +85C) 90ns, x=J: Industrial Plus (-40C to +105C) 90ns, x=S: Automotive Grade1 (-40C to +125C) 90ns, x=A: Automotive Grade2 (-40C to +105C) 90ns, x=B: Automotive Grade3 (-40C to +85C) 90ns. 5. "Green", Halogen-Free and RoHS compliant packaging. KGD Wafer also available. S=TSOP48(12X20mm), T=TSOP56(14x20mm), C=TFBGA56(7x9mm), B=LFBGA64(11x13mm), A=TFBGA48(6x8mm). 6. Contact Winbond for availability of these LFBGA64 & TSOP56 packages. 7. S=Fast Program/Erase, x16 only; P=x8/x16. Winbond Electronics Corporation (Headquarters) No. 8, Keya Rd. I, Central Taiwan Science Park Taichung County, 428, Taiwan, R.O.C. Tel: 886-4-25218168 www.winbond.com Winbond Electronics Corporation America 2727 North First Street, San Jose, CA 95134 USA Tel: 1-408-943-6666 Fax: 1-408-544-1798 www.winbond-usa.com www.spiflash.com February 2015 REV 2.3