® WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SMC Package Weight (mg) 210 Product Group Type No. SK32 – SK3200 SK52 – SK5200 SK82 – SK8200 ER3A – ER3J ER5A – ER5J UF3A – UF3M UF5A – UF5M FR3A – FR3M FR5A – FR5M S3A – S3M S5A – S5M S10A – S10M 1.5SMCJ Series 3.0SMCJ Series 5.0SMCJ Series 1SMC5333B – 1SMC5388B Component Die Doped Silicon* Die Attach Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material EMC Terminal Finish Matte Tin (Sn) MSL Rating 1 Description Diode Schottky 3A 20V – 200V Diode Schottky 5A 20V – 200V Diode Schottky 8A 20V – 200V Diode Superfast 3A 50V – 600V Diode Superfast 5A 50V – 600V Diode Ultrafast 3A 50V – 1000V Diode Ultrafast 5A 50V – 1000V Diode Fast 3A 50V – 1000V Diode Fast 5A 50V – 1000V Diode Standard 3A 50V – 1000V Diode Standard 5A 50V – 1000V Diode Standard 10A 50V – 1000V Diode TVS 1500W Diode TVS 3000W Diode TVS 5000W Diode Zener 5W Substance CAS No. Material Mass (%) Material Mass (mg) Component Mass (%) Component Mass (mg) 4.95 10.40 2.00 4.20 PPM Si 7440-21-3 100.00 10.40 Pb 7439-92-1 92.50 3.89 Sn 7440-31-5 5.00 0.21 Ag 7440-22-4 2.50 0.11 500 Cu 7440-50-8 97.50 86.09 409964 Fe 7439-89-6 2.40 2.12 Zn 7440-66-6 0.10 0.09 Sn 7440-31-5 100.00 2.10 Silica 7631-86-9 74.91 78.66 Epoxy Resin 29690-82-2 23.13 24.29 Sb2O3 Brominated Epoxy Resin 1309-64-4 0.98 1.03 6386-73-8 0.98 1.03 49524 18500 42.05 88.30 1000 10091 420 1.00 2.10 10000 374550 115650 50.00 105.00 4900 4900 ±10% *Dopant and metallization of the silicon die are not reported in this statement where their concentration is less than the minimum reportable level per EIA JIG-101. Data disclosed herewith is approximate and is based on information from suppliers surveys, Material Safety Datasheet, engineering calculations and measurements. Won-Top Electronics(WTE) has checked all information carefully and believes it to be correct and accurate. However, WTE cannot assume any responsibility for inaccuracies. WTE reserves the right to change any or all information herein without further notice. Revision: March, 2014 www.wontop.com RoHS Declaration The European Parliament and of the Council on the Restriction of the use of Certain Hazardous Substances in Electrical and Electronics Equipment (RoHS) directive restricts the concentration of Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr6+), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBD) to 0.1%(1000 PPM) and restricts the concentration of Cadmium (Cd) to 0.01%(100 PPM) in homogeneous materials of electronics products. The product group listed above and the homogenous materials are compliant with the Directive 2011/65/EU. WTE warrants that all its packing, components and/or products supplied to the Customer and/or its affiliated companies or designated contractors do not contain these hazardous substances in quantity levels higher than or equal to the thresholds to this directive. Exemptions as declared for the directive are: 7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead). 7(c)-I Lead in glass (applicable for glass passivated silicon die). Revision: March, 2014 www.wontop.com