Material Composition Declaration - Won

®
WON-TOP ELECTRONICS
Material Composition Declaration
Package Information
Package
SMC
Package Weight (mg)
210
Product Group
Type No.
SK32 – SK3200
SK52 – SK5200
SK82 – SK8200
ER3A – ER3J
ER5A – ER5J
UF3A – UF3M
UF5A – UF5M
FR3A – FR3M
FR5A – FR5M
S3A – S3M
S5A – S5M
S10A – S10M
1.5SMCJ Series
3.0SMCJ Series
5.0SMCJ Series
1SMC5333B – 1SMC5388B
Component
Die
Doped Silicon*
Die Attach
Solder Alloy
Leadframe
Copper Alloy
Plating
Matte Tin
Encapsulation
Tolerance
Material
EMC
Terminal Finish
Matte Tin (Sn)
MSL Rating
1
Description
Diode Schottky 3A 20V – 200V
Diode Schottky 5A 20V – 200V
Diode Schottky 8A 20V – 200V
Diode Superfast 3A 50V – 600V
Diode Superfast 5A 50V – 600V
Diode Ultrafast 3A 50V – 1000V
Diode Ultrafast 5A 50V – 1000V
Diode Fast 3A 50V – 1000V
Diode Fast 5A 50V – 1000V
Diode Standard 3A 50V – 1000V
Diode Standard 5A 50V – 1000V
Diode Standard 10A 50V – 1000V
Diode TVS 1500W
Diode TVS 3000W
Diode TVS 5000W
Diode Zener 5W
Substance
CAS No.
Material
Mass
(%)
Material
Mass
(mg)
Component
Mass
(%)
Component
Mass
(mg)
4.95
10.40
2.00
4.20
PPM
Si
7440-21-3
100.00
10.40
Pb
7439-92-1
92.50
3.89
Sn
7440-31-5
5.00
0.21
Ag
7440-22-4
2.50
0.11
500
Cu
7440-50-8
97.50
86.09
409964
Fe
7439-89-6
2.40
2.12
Zn
7440-66-6
0.10
0.09
Sn
7440-31-5
100.00
2.10
Silica
7631-86-9
74.91
78.66
Epoxy Resin
29690-82-2
23.13
24.29
Sb2O3
Brominated
Epoxy Resin
1309-64-4
0.98
1.03
6386-73-8
0.98
1.03
49524
18500
42.05
88.30
1000
10091
420
1.00
2.10
10000
374550
115650
50.00
105.00
4900
4900
±10%
*Dopant and metallization of the silicon die are not reported in this statement where their concentration is less than the minimum reportable
level per EIA JIG-101.
Data disclosed herewith is approximate and is based on information from suppliers surveys, Material Safety Datasheet, engineering
calculations and measurements. Won-Top Electronics(WTE) has checked all information carefully and believes it to be correct and accurate.
However, WTE cannot assume any responsibility for inaccuracies. WTE reserves the right to change any or all information herein without
further notice.
Revision: March, 2014
www.wontop.com
RoHS Declaration
The European Parliament and of the Council on the Restriction of the use of Certain Hazardous Substances in Electrical and Electronics
Equipment (RoHS) directive restricts the concentration of Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr6+), Polybrominated Biphenyls
(PBB), Polybrominated Diphenyl Ethers (PBD) to 0.1%(1000 PPM) and restricts the concentration of Cadmium (Cd) to 0.01%(100 PPM) in
homogeneous materials of electronics products.
The product group listed above and the homogenous materials are compliant with the Directive 2011/65/EU. WTE warrants that all its packing,
components and/or products supplied to the Customer and/or its affiliated companies or designated contractors do not contain these
hazardous substances in quantity levels higher than or equal to the thresholds to this directive.
Exemptions as declared for the directive are:
7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).
7(c)-I Lead in glass (applicable for glass passivated silicon die).
Revision: March, 2014
www.wontop.com