® WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SOD-123 Package Weight (mg) 10 Product Group Type No. SD101AW – SD101CW 1N5711W BAT42W – BAT43W MMSD301 MMSD701 SD103AW – SD103CW SS0520 – SS0540 SS1040 1N4148W 1N4151W BAV16W 1N4150W MMSD914 MMSD4148 BAV19W – BAV21W MMSD103 1N4448W BZT52B2V4 – BZT52B51 BZT52C2V0 – BZT52C51 MMSZ4681 – MMSZ4717 MMSZ5221B – MMSZ5262B Component Material Terminal Finish Matte Tin (Sn) Description Diode Schottky 15mA 40V – 60V Diode Schottky 15mA 70V Diode Schottky 200mA 30V Diode Schottky 200mA 30V Diode Schottky 200mA 70V Diode Schottky 350mA 20V – 40V Diode Schottky 500mA 20V – 40V Diode Schottky 1000mA 40V Diode Switching 150mA 75V Diode Switching 150mA 75V Diode Switching 150mA 75V Diode Switching 200mA 50V Diode Switching 200mA 100V Diode Switching 200mA 100V Diode Switching 200mA 120V – 250V Diode Switching 200mA 250V Diode Switching 250mA 75V Diode Zener 500mW Diode Zener 500mW Diode Zener 500mW Diode Zener 500mW Substance CAS No. Material Mass (%) Material Mass (mg) Component Mass (%) Component Mass (mg) 0.38 3.83 0.38 0.31 0.03 Die Doped Silicon* Si 7440-21-3 100.00 Wire Bond Gold Au 7440-57-5 100.00 0.03 Fe 7439-89-6 56.40 1.58 Leadframe Ferrous Alloy Die Bond Silver Silicone Plating Matte Tin Encapsulation Tolerance EMC MSL Rating 1 Ni 7440-02-0 42.00 1.18 Mn 7439-96-5 0.80 0.02 Co 7440-48-4 0.50 0.01 PPM 38000 3000 158484 118020 28.07 2.81 2248 1405 Si 7440-21-3 0.30 0.01 843 Ag 7440-22-4 80.00 0.10 9600 Bisphenol F Glycidyl neodeconate 28064-14-4 15.00 0.02 26761-45-5 5.00 0.01 Sn 7440-31-5 100.00 0.20 Silica 7631-86-9 79.00 5.10 Epoxy Resin 29690-82-2 20.00 1.29 Carbon Black 1333-86-4 1.00 0.06 1.15 0.12 1800 600 2.00 0.20 20000 510340 64.64 6.46 129200 6460 ±10% *Dopant and metallization of the silicon die are not reported in this statement where their concentration is less than the minimum reportable level per EIA JIG-101. Revision: March, 2014 www.wontop.com Data disclosed herewith is approximate and is based on information from suppliers surveys, Material Safety Datasheet, engineering calculations and measurements. Won-Top Electronics(WTE) has checked all information carefully and believes it to be correct and accurate. However, WTE cannot assume any responsibility for inaccuracies. WTE reserves the right to change any or all information herein without further notice. RoHS Declaration The European Parliament and of the Council on the Restriction of the use of Certain Hazardous Substances in Electrical and Electronics Equipment (RoHS) directive restricts the concentration of Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr6+), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBD) to 0.1%(1000 PPM) and restricts the concentration of Cadmium (Cd) to 0.01%(100 PPM) in homogeneous materials of electronics products. The product group listed above and the homogenous materials are compliant with the Directive 2011/65/EU. WTE warrants that all its packing, components and/or products supplied to the Customer and/or its affiliated companies or designated contractors do not contain these hazardous substances in quantity levels higher than or equal to the thresholds to this directive. Exemptions as declared for the directive are: 7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead). 7(c)-I Lead in glass (applicable for glass passivated silicon die). Revision: March, 2014 www.wontop.com