Part No:1TC5003W52E2WFC9

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COMMODITY: SURFACE MOUNT LED SMD SPECIFICATION
Part No:1TC5003W52E2WFC9
Characters
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5.0mm×5.0mm SMT LED , 1.5mm THICKNESS.
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LOW POWER CONSUMPTION.
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VIEWING ANGLE 120°.
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VARIOUS COLORS AND LENS TYPES AVAILABLE.
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PACKAGE: 1000 PCS/REEL.
ITEM
MATERIALS
Resin(Mold)
Silicon
Lens Color
Yellow
Dice
InGaN
Emitted color
White
Absolute Maximum Ratings(Ta=25℃)
Item
Symbol
Value
Unit
Power Dissipation/DICE
PD
120*3
mW
DC Forward Current/DICE
IF
30*3
mA
Single Chip Pulsed Forward Current
IFP
100※
mA
Reverse Voltage
VR
5
V
Topr
-30 ~ +80
℃
Tstg
-40 ~ +100
℃
Tsol
240for5sec△
℃
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Operating Temperature
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Storage Temperature
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Soldering Temperature
※Duty 1/10,Pulse Width 0.1ms .
△Soldering time max 10sec
please refer to IF-Ta diagram of curves for the temperature during application
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Electrical-Optical Characteristics(Ta=25℃)
Value
Symbol
Parameter
Unit
Test condition
If=20mA*3
Min.
Typ.
Max.
2.8
3.2
3.6
V
3600
6000
7800
mcd
11
17.5
23
Lm
X
0.3791
﹍
﹍
If=20mA*3
Y
0.3798
﹍
﹍
If=20mA*3
﹍
10
μA
Vr=5V
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Deg
If=20mA*3
Forward Voltage
Vf
Iv
Luminous intensity
Φv
Wavelength
Reverse Current
﹍
Ir
Viewing angle
2θ
Color Rendering Index
CRI
1/2
﹍
120
If=20mA*3
80
If=20mA*3
▲ 1.Luminous intensity (IV) ±10%, Forward Voltage(VF) ±0.1V, Wavelength(X、Y) ±0.01
CRI±5%.
2.IS standard testing
Range of bins
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Bin
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VF(v)
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Bin
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BinB
BinC
BinD
BinE
BinF
BinG
BinH
2.8-2.9
2.9-3.0
3.0-3.1
3.1-3.2
3.2-3.3
3.3-3.4
3.4-3.5
Bin21
Bin22
4600-6000
6000-7800
NL
NJ
BinI
VF(v)
3.5-3.6
Bin
Bin20
Iv(mcd) 3600-4600
Bin
WL
NK
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Color coordinate Comparison
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Bin Code
X
Y
X
Y
X
Y
X
Y
NL
0.3599
0.3742
0.3545
0.3443
0.3678
0.3567
0.3741
0.3872
0.3741
0.3873
0.3678
0.3563
0.3808
0.3696
0.3914
0.4034
0.3914
0.4034
0.3808
0.3696
0.398
0.3877
0.4092
0.419
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NK
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NJ
0
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IS Main BIN.
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Outline Dimensions
0.6
3
5
4
5.0
6
0.6
5
3
1
6
1.1
4
2
1.1
5.0
5.4±0.1
1
0.2
2
C1.0
3.34
0.8
5
20mA
3
20mA
20mA
1
45°
1.6
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3.4
unit:mm
2
4
6
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All dimensions are in millimeters.
Tolerance is ±0.1 ㎜ unless other specified
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Specifications are subject to change without notice.
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COMMODITY: SURFACE MOUNT CHIP LED SMD SPECIFICATION
DEVICE NUMBER:
1TC5003W52E2WFC9
Fig.2 Relative Luminous Intensity-IF
(Ta=25℃)
Relative Luminous Intensity
Forward Current IF(mA)
Fig.1 IF-VF(Ta=25℃)
Forward Current IF(mA)
Forward Voltage VF(V)
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Fig.3 Wavelength Characteristics
(Ta=25℃)
Relative Luminous Intensity
Fig.5 IF-Ta
Ambient Temperature Ta (℃)
Directive Characteristics(Ta=25℃)
Forward Current IF(mA)
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Fig.4 Relative Luminous Intensity-Ta
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Ambient Temperature Ta (℃)
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Reflow Profile
 Reflow Temp/Time
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NOTES:
1. We recommend the reflow temperature 240℃(±5℃).the maximum soldering
temperature should be limited to 260℃.
2. Don’t cause stress to the silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be 1 time.
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Test circuit and handling precautions
 Test circuit
 Handling precautions
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1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause
big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <60% R.H. after the package is
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Opened, the products should be used within a week or they should be keeping to stored at
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≦20%R.H. with zip-lock sealed.
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3.Baking
It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 70±3℃ x(12~24hrs) and <5%RH, taped reel type
3.2 100±3℃ x(45min~1hr), bulk type
3.3 130±3℃ x(15~30min), bulk type
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Test items and results of reliability
Environmental
Sequence
Type
Test Item
Test Conditions
Note
Number of
Damaged
Temperature Cycle
-45℃ 30min
↑↓20 min
105℃ 30min
100 cycle
0/22
Thermal Shock
-10℃ 15min
↑↓5sec
100℃ 15min
100 cycle
0/22
10 cycle
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
500 hrs
0/22
1000 hrs
0/22
High Humidity Heat Cycle
High Temperature Storage
30℃ 65℃
90%RH 24hrs/1cycle
Ta=100℃
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Humidity Heat Storage
Low Temperature Storage
Operation
Sequence
Life Test
High Humidity Heat Life Test
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Low Temperature Life Test
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Ta=85℃
RH=85%
Ta=-40℃
Ta=25℃
IF=60mA
85℃ RH=85%
IF=30mA
Ta=-20℃
IF=60mA
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5050 Single-Color High Performance SMD Top LEDs Packaging Specifications
 Feeding Direction
 Dimensions of Reel (Unit: mm)
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 Dimensions of Tape (Unit: mm)
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NOTES
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of missing smds is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications;
4. 1,000pcs/Reel
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5050 Single-Color High Performance SMD Top LEDs Packaging Specifications

Packaging specifications
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NOTES:
Reeled products (The most numbers of products are 1,000pcs) packed in a seal off
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0 moisture-proof bag along with a desiccant one by one, Seven moisture-proof bag of maximums (total
0 maximum number of products are 5,000pcs) packed in an inside box (size: about 238mm x about
0 194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about
410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot
No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should
appear on the insection request form on the cardboard box.) .
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LED Usage and Handling Instructions
No.1、Soldering
A、It is not better to be manual soldering.
B、Reflow soldering:
1、Soldering according to the following temperature chart is highly recommended
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2、Soldering paste
Use soldering paste with the melting point at 230℃ is recommended
No.2、Collet
1、Abnormal situation caused by improper setting of collet
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To choose the right collet is the key issue in improving the product’s quality. LED is different
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from other electronic components, which is not only about electrical output but also for optical output.
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This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height
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is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which
will cause the LED fail to light up, light up now and then or other quality problems
2、How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of
lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets
fit for different products, please refer to the following pictures cross out:.
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Outer diameter of collet should be
larger than the lighting area
Outer diameter of collet
Picture 1()
Picture 2(×)
3、How to set the height of collet
The reason why for top view SMD, the height of collet before it presses downward
will directly affect the quality of products during SMT is that if the collect go down too
much, it will press lens and cause the distortion or breaking of gold wire. The setting
of collet position should follow the pictures belowed.
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Picture 3()
Picture 4(×)
No.3、Other points for attention
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A、No pressure should be exerted to the epoxy shell of the SMD under high temperature.
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B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and
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cross out easy to break.
C、LED should be used as soon as possible when being taken out of the original package,
and should be stored in anti-moisture and anti-ESD package.
No.4、This usage and handling instruction is only for your reference.
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