0 Features § forward current ≦30mA § Wide viewing angle:120° § Operating Temperature -30~80℃ § Storage temperature-40~100℃ § ROHS and REACH-compliant § Junction Temperature110℃ § PACKAGE:2000 PCS/REEL. § Qualified according to JEDEC moisturevity Level 3 § Chip material: InGaN § Reverse Voltage:5V § Duty 1/10，Pulse Width 0.1ms Product Identification Code 0000000000000000000000000000000000000000000000000000000 1 Process Type Category 00000000000000 0 LED Type 0 0 Size S C 3020 G72E 0 C C 01 Flow code PCB module code Cap color Lap polarity Dice wavelength 0 0 0 Electrical-Optical Characteristics（Ta=25℃） Parameter Value Symbol Unit Min. Typ. Max. 3.6 Forward Voltage Vf 2.8 3.2 Luminous intensity Iv 1000 1300 Wavelength λd 520 Reverse Current Ir ﹍ Viewing angle 2θ1/2 ﹍ Test condition V If=20mA mcd If=20mA 535 nm If=20mA ﹍ 10 μA Vr=5V 120 ﹍ Deg If=20mA 0000000000000000000000000000000000000000000000000000000 ▲Luminous intensity (IV) ±10%, Forward Voltage (VF) ±0.1V, Wavelength(λd) ±0.5nm ▲IS standard testing Range of bins Bin BinB BinC BinD BinE BinF BinG BinH VF(V) 2.8-2.9 2.9-3.0 3.0-3.1 3.1-3.2 3.2-3.3 3.3-3.4 3.4-3.5 Bin BinI Bin16 Bin17 1300-1700 1700-2200 00000000000000 0 Iv(mcd) 3.5-3.6 0 Bin15 0 Bin Iv(mcd) 1000-1300 Bin G H I WL(nm) 520-525 525-530 530-535 0 0 0 Optical Characteristics -1 Relative Luminous Intensity & Angle Relative Luminous Intensity Relative luminous Intensity(%) Relative Luminous Intensity&Wavelength Ta=25° Relative Luminous Flux & Forward Current(Ta=25℃) 150 Genealogies angle Ta=25° Relative Luminous Flux & Junction Temperature Relative Luminous Flux(%) Wavelength (nm) 110% Relative Lumious Flux(%) 0000000000000000000000000000000000000000000000000000000 125 100 75 50 25 0 5 0 10 15 20 25 30 Forward Current (mA) Forward Voltage VF(V) Ta=25° 0 70% 50% 30% 20 40 60 100 115 80 Junction Temperature(°) Maximum Current & Ambient Temperature Maximum Current(mA) IF & VF Forward Current IF(mA) 00000000000000 0 0 0 90% Ambient Temperature(°C) 0 0 Optical Characteristics-2 Relative Forward Voltage(%) Relative Forward Voltage & Ambient Temperature Ambient Temperature(°) 00000000000000 0 0 0 The relative wavelength (%) The relative Wavelength & Forword current 0000000000000000000000000000000000000000000000000000000 Forward Current IF(mA) 0 0 0 Outline Dimensions 1 2 1 2 0000000000000000000000000000000000000000000000000000000 REC0MMEND PADLAYOUT 00000000000000 0 0 0 All dimensions are in millimeters.(inch) § Tolerance is ±0.1(0.004)㎜ unless other specified § § Specifications are subject to change without notice. 0 0 0 Reflow Profile 1.IR reflow soldering Profile Lead Free solder 300 ℃ 250 temperature 10sec. max 1-5℃/sec 2-5℃/sec 230℃ max Pre heating 150-180℃ 200 260℃ max 2-5℃/sec 150 120sec.Max 50sec.max 100 50 25℃ 0 0 50 100 Time 150 200 250 300 sec 2.IR reflow soldering Profile 0000000000000000000000000000000000000000000000000000000 Lead solder 300 ℃ 1-5℃/sec temperature 250 Pre heating 150-180℃ 200 240℃ max 10sec. max 210℃ max 2-5℃/sec 2-5℃/sec 150 120sec.Max 50sec.max 100 50 25℃ 00000000000000 0 0 0 NOTES: 0 0 50 100 Time 150 200 250 300 sec 1. We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature should be limited to 260℃. 2. Don’t cause stress to the silicone resin while it is exposed to high temperature. 3. Number of reflow process shall be 1 time. 0 0 0 Test circuit and handling precautions Test circuit V LED Handling precautions 1. Over-current-proof 0000000000000000000000000000000000000000000000000000000 Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2.Storage 2.1 It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5℃~30℃(41℉~86℉) 2.2 Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is Opened, the products should be used within a week or they should be keeping to stored at 00000000000000 0 ≦20%R.H. with zip-lock sealed. 0 3.Baking 0 It is recommended to baking before soldering when the pack is unsealed after 24hrs. The Conditions are as followings: 3.1 70±3℃ x 24hrs and ＜5%RH, taped reel type 3.2 100±3℃ x 2hrs , bulk type 3.3 130±3℃ x(15~30min), bulk type It shall be normal to see slight color fading of carrier(light yellow) after baking in process 0 0 0 Packing -1 3020 Single-Color High Performance SMD Top LEDs Packaging Specifications Feeding Direction Dimensions of Reel (Unit: mm) Feeding Direction Dimensions of Tape (Unit: mm) 0000000000000000000000000000000000000000000000000000000 Arrangement of Tape 00000000000000 0 0 0 NOTES 0 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing lamps is two; 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications; 0 4. 2,000pcs/Reel 0 Packing-2 3020 Single-Color High Performance SMD Top LEDs Packaging Specifications Packaging specifications 0000000000000000000000000000000000000000000000000000000 NOTES: 00000000000000 Reeled products (The most numbers of products are 2,000pcs) packed in a seal off moisture-proof 0 0 bag along with a desiccant one by one, Seven moisture-proof bag of maximums (total maximum number of 0 products are 14,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on the in section request form on the cardboard box.) . 0 0 0 Precautions 1、Abnormal situation caused by improper setting of collet To choose the right collet is the key issue in improving the product’s quality. LED is different from other electronic components, which is not only about electrical output but also for optical output. This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2、How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out:. Outer diameter of collet should be larger than the lighting area Outer diameter of collet 0000000000000000000000000000000000000000000000000000000 Picture 1（） Picture 2（×） 3、How to set the height of collet The reason why for top view SMD, the height of collet before it presses downward will directly affect the quality of products during SMT is that if the collect go down too much, it will press lens and cause the distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed. 00000000000000 0 0 0 Picture 3（） Picture 4（×） No.3、Other points for attention A、No pressure should be exerted to the epoxy shell of the SMD under high temperature. B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C、LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. No.4、This usage and handling instruction is only for your reference. 0 0 0 Test items and results of reliability Type Test Item Test Standard JEITA ED-4701 Temperature Cycle 300 303 Test Conditions Note Number of Damaged ` -40℃ 30min ↑↓5 min 100 cycle 0/50 20 cycle 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 500 hrs 0/22 1000 hrs 0/22 100℃ 30min -10℃ 15min Environmental Sequence JEITA ED-4701 ↑↓5sec Thermal Shock 200 303 100℃ 15min High Temperature Storage JEITA ED-4701 200 201 Ta=100℃ 0000000000000000000000000000000000000000000000000000000 Ta=60℃ JEITA ED-4701 Humidity Heat Storage 100 103 JEITA ED-4701 Low Temperature Storage 200 202 Tested with Life Test Brightek Operation Sequence standard Tested with High Humidity 00000000000000 Heat Life Test 0 0 Low Temperature Life Test 0 Brightek standard Tested with Brightek standard RH=90% Ta=-40℃ Ta=25℃ IF=20mA 60℃ RH=90% IF=15mA Ta=-20℃ IF=20mA Judgment criteria of failure for the reliability 0 Measuring items Symbol Measuring conditions Forward voltage Vf(V) IF=20mA Reverse current IR(uA) Vr=5V Judgement criteria for failure Over U×1.2 Over 0 U×2