0 Customer Part No: Part No: 5252-DP White: Neutral White: VZDP52AW57FCCKZ6 Warm White: VZDP52AW37FCCPZ6 VZDP52AW57FCCDZ6 Specification: Documents No: Prepared By: Kiwi Liao / Time: Checked By: Ethan Cheng / Time: 2012/06/26 2012/06/26 Customer Confirmation: FEATURES § Eutectic chip bonding process/ thermal resistance: 3° C/W 0000000000000000000000000000000000000000000000000000000 § Forward maximum current 1,400mA § Wide viewing angle: Typ.125° § Operating temperature -30~80℃ § Storage temperature-40~100℃ § ROHS-compliant § Outline (L x W x H) of 5.2*5.2*3.1mm § Reverse voltage: 8V CATALOG 00000000000000 0 Electrical-Optical Characteristics …………………….…..………………... 0 Color coordinate Comparison ……………………….…………………………. 0 Optical Characteristics ………………………………….………………………. 2-3 4 5-6 Outline Dimensions ....………………………………………………………..….. 8 Recommended PCB solder pad &Circuit………………………………..……. 8 Reflow Profile ……………………………………………………………………… 9 Test items and results of reliability ……………………………………………. 10 Packing ………………………………………………………….………..……. 11-12 …………………….……………... 13-14 Test circuit and handling precautions 0 0 0 PART NUMBER TABLE Substrate ALN (4~12W) Color Emitter Cool White CRI 80 VZDP52AW37FCCPZ6 Neutral White CRI 80 VZDP52AW57FCCKZ6 Warm White CRI 80 VZDP52AW57FCCDZ6 COOL--WHITE VZDP52AW37FCCPZ6 Parameter Symbol Forward Voltage Value Unit Test condition Min. Typ. Max. Vf 6.0 6.5 6.8 V If=700mA Reverse Current Ir --- --- 10 μA Vr=8V Viewing angle 2θ1/2 --- 125 --- Deg If=700mA --- --- If=700mA 0000000000000000000000000000000000000000000000000000000 X --0.3287 Chromaticity coordinate Y --- 0.3417 --- --- If=700mA Color Temperature CCT --- 5700 --- K If=700mA Luminous Flux Φv --- 430 --- Lm If=700mA Luminous Flux Φv --- 600 --- Lm If=1000mA Luminous Flux Φv --- 750 --- Lm If=1400mA 1. Luminous intensity (Iv) ±5%, Forward Voltage (VF ) ±0.1V, Viewing angle(2θ1/2) ±5% 2. IS standard testing 3. Electrical-Optical Characteristics（Ta=25℃） 00000000000000 0 0 0 0 0 0 NEUTRAL --WHITE VZDP52AW57FCCKZ6 Parameter Symbol Forward Voltage Value Unit Test condition Min. Typ. Max. Vf 6.0 6.5 6.8 V If=700mA Reverse Current Ir --- --- 10 μA Vr=8V Viewing angle 2θ1/2 --- 125 --- Deg If=700mA X --- 0.3818 --- --- If=700mA Y --- 0.3797 --- --- If=700mA Color Temperature CCT --- 4000 --- K If=700mA Luminous Flux Φv --- 350 --- Lm If=700mA Luminous Flux Φv --- 490 --- Lm If=1000mA Luminous Flux Φv --- 610 --- Lm If=1400mA Chromaticity coordinate 1. Luminous intensity (Iv) ±5%, Forward Voltage (VF ) ±0.1V, Viewing angle(2θ1/2) ±5% 2. IS standard testing 3. Electrical-Optical Characteristics（Ta=25℃） 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 WARM –WHITE VZDP52AW57FCCDZ6 Value Typ. Unit Test condition 6.8 V If=700mA --- 10 μA Vr=8V --- 125 --- Deg If=700mA X --- 0.4338 --- --- If=700mA Y --- 0.4030 --- --- If=700mA Color Temperature CCT --- 3000 --- K If=700mA Luminous Flux Φv --- 330 --- Lm If=700mA Luminous Flux Φv --- 460 --- Lm If=1000mA Luminous Flux Φv --- 580 --- Lm If=1400mA Parameter Symbol Forward Voltage Vf 6.0 6.5 Reverse Current Ir --- Viewing angle 2θ1/2 Chromaticity coordinate Min. Max. 1. Luminous intensity (Iv) ±5%, Forward Voltage (VF ) ±0.1V, Viewing angle(2θ1/2) ±5% 2. IS standard testing 3. Electrical-Optical Characteristics（Ta=25℃） 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 COLOR COORDINATE (CIE-1931) 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 PERFORMANCE GROUPS – CHROMATICITY 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 PERFORMANCE GROUPS – BRIGHTNESS Bin VF(v) Bin Flux(lm) T 5.6-6.0 47 300-320 U 6.0-6.4 48 320-340 V 6.4-6.8 49 340-360 50 360-380 51 380-410 52 410-440 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 OPTICAL CHARACTERISTICS RELATIVE SPECTRAL POWER DISTRIBUTION TYPICAL SPATIAL DISTRIBUTION 0000000000000000000000000000000000000000000000000000000 00000000000000 RELATIVE FLUX VS. CURRENT (TJ = 25°C) 0 0 0 0 0 0 RELATIVE FLUX VS. JUNCTION TEMPERATURE (IF = 700 MA) 0000000000000000000000000000000000000000000000000000000 THERMAL DESIGN 00000000000000 0 0 0 0 0 0 OUTLINE DIMENSIONS § All dimensions are in millimeters. § Tolerance is ±0.13 ㎜ unless other specified Recommended PCB Solder Pad 0000000000000000000000000000000000000000000000000000000 00000000000000 0 Circuit 0 Type 0 0 0 0 Reflow Profile IR reflow soldering Profile Lead Free solder 0000000000000000000000000000000000000000000000000000000 NOTES: 1. We recommend the reflow temperature 200℃(±5℃).the maximum soldering temperature should be limited to 210℃. 2. Don’t stress the silicone resin while it is exposed to high temperature. 00000000000000 3. Number of reflow process shall be 1 time. 0 4. Recommend Solder: 0 1.TAMURA-TLF-401-11 0 2. PF602-P 0 0 0 TEST ITEMS AND RESULTS OF RELIABILITY Test Item Test Conditions Duration/ Cycle Number of Damage Reference Temperature Cycle –40℃ 30min ↑↓25℃(5 min) 100℃ 30min 100 cycles 0/22 JEITA ED-4701 300 303 ↑↓5sec 110℃ 30min 100 cycles 0/22 JEITA ED-4701 200 303 Ta=85℃ 1000 hrs 0/22 EIAJED-4701 200 201 1000 hrs 0/22 EIAJED-4701 100 103 0/22 EIAJED-4701 200 202 1000 hrs 0/22 Tested with Brightek standard 1000 hrs 0/22 Tested with Brightek standard 1000 hrs 0/22 Tested with Brightek standard 3 Times 0/22 MIL-STD-883D –40℃ 30min Thermal Shock High Temperature Storage Humidity Heat Storage Ta=85℃ RH=85% Low Temperature Ta=-40℃ 1000 hrs Storage 0000000000000000000000000000000000000000000000000000000 Life Test High Humidity Heat Life Test Ta=25℃ If=700mA 60℃ RH=90% If=700mA Ta=-40℃ Low Temperature Life Test If=700mA ESD(HBM) 1KV at 1.5kΩ;100pf *Criteria for Judging the Damage 00000000000000 0 Item Symbol 0 0 VF Forward Voltage Reverse Current Luminous Intensity IR Iv Condition Criteria for Judgement MIN MAX _ USL*1×1.1 Vr=8V _ 100μA If=700mA *2 _ If=700mA LSL ×0.7 1 [Note]* USL: Upper Specification Level 2 * LSL: Lower Specification Level 0 0 0 PACKING Tape and Reel 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 外徑 178±10mm (7〞) 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 TEST CIRCIUT AND HANDLING PRECAUTIONS Test circuit V LED Handling precautions 1、The following items are recommended when handling LEDs 1.1 The lens of LEDs should not be exposed to dust and debris. Excessive dust and debris may cause a drastic decrease in light output. 1.2 Avoid mechanical stress on LED lens 0000000000000000000000000000000000000000000000000000000 1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED due to the LED lens’ damage 1.4 Pick & place tool was recommended to use for the remove of LEDs from the factory tape & reel packaging 2、Pick & Place Nozzle The pickup tool was recommended and shown as below 00000000000000 0 0 0 Unit : mm Tolerance : ±0.1 5 0 0 0 3、Lens handling Please follow the guideline to grab LEDs 3.1 Use tweezers to grab LEDs 3.2 Do not touch lens with the tweezers 3.3 Do not touch lens with fingers 3.4 Do not apply more than 4N of lens (400g) directly onto the lens 4、Lens cleaning In the case where a minimal level of dirt and dust particles can’t be guaranteed, a suitable cleaning solution can be applied to the lens surface 4.1 Try a gentle swabbing using a lint-free swab 4.2 If needed, the use of lint-free swab and isopropyl alcohol used gently removes dirt from the lens surface. 4.3 Do not use other solvents as they may directly react with the LED assembly 4.4 Do not use ultrasonic cleaning that the LED will be damaged 0000000000000000000000000000000000000000000000000000000 5、Carrier Tape Handling The following items are recommended when handling the Carrier tape of LEDs 5.1 Do not twist the carrier tape 5.2 The inward bending diameter should not smaller than 6cm for carrier tape. 5.3 Do not bend the tape outward. <6cm 00000000000000 0 0 0 0 0