VZBP35BV27CH01Z4

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Customer Part No:
Part No : 3535BP

VZBP35BV27CH01Z4
Specification:
Documents No:
Prepared By: Alex Hsieh
/ Time:
2013/05/16
Checked By: Kiwi Liao
/ Time:
2013/05/16
Customer Confirmation:
Features
§ Eutectic chip bonding process
§ Wide viewing angle:60°
§ Operating Temperature -40~85℃
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§ Storage temperature -40~100℃
§ ROHS-compliant
§ outline(LxWxH) of 3.50*3.50*2.0 mm
§ Reverse Voltage:5V
Catalog
Electrical-Optical Characteristics……………………………………….….
Optical Characteristics …………………………………………………….…
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0 High Power Product Identification Code…………………………………..
0 Outline Dimensions …………………………………………………………
0 Reflow Profile ………………………………………………………………...
Test items and results of reliability…………………………………………
Packing ………………………………………………………………………….
Test circuit and handling precautions ……………………………………..
2-3
4-5
6
7
8
9
10-11
12-13
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 Electrical-Optical Characteristics（Ta=25℃）
 Part Number Matrix

Color
Emitter
Red
VZBP35BV27CH01Z4
Absolute Maximum Ratings（Ta=25℃）
Iem
Symbol
Value
Unit
DC Forward Current
IF
350
mA
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Dice temperature
Tj
120
℃
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Tsol
210 for / 5sec
Soldering Temperature

℃
Please refer to IF-Ta curve for the temperature during application
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 Flux Characteristics（Ta=25℃）
Color
Symbol
Red
Value
Unit
Test
condition
Min.
Typ.
Max.
Φv
45
---
60
Lm
If=350mA
λd
620
625
630
nm
If=350mA
Vf
1.8
2.2
2.6
V
If=350mA
1. Luminous intensity (Iv) ±10%
2. IS standard testing

Color Bins
Color
Red
Group
Min. Wavelength (nm)
Max.Wavelength (nm)
N
620
625
O
625
630
1. IS standard testing
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2. Wavelength (nm) ± 2nm

VF Bins
Group
Min. Forward
Voltage(v)
Max.
Forward
Voltage(v)
Group
Min. Forward
Voltage(v)
Max.
Forward
Voltage(v)
A
1.8
2
C
2.2
2.4
B
2
2.2
D
2.4
2.6
 Luminous Flux Group
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Group
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22
Min.
Luminous Flux (lm)
Max.
Luminous Flux (lm)
35
40
23
40
45
24
45
50
25
50
55
26
55
60
27
60
65
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 Optical Characteristics
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 High Power Product Identification Code
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 Outline Dimensions and Pad Configuration
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
Circuit Type

Recommended Soldering Pattern
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PS.Suggest stencil t =0.12 mm
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 IR reflow soldering Profile

IR reflow soldering Profile
Lead Free solder
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NOTES:
1. We recommend the reflow temperature 180℃(±5℃).the maximum soldering temperature
should be limited to 190℃.
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2. Don’t stress the silicone resin while it is exposed to high temperature.
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3. Number of reflow process shall be 1 time.
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4. Recommend Solder:
1.TAMURA-TLF-401-11
2. PF602-P
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 Test items and results of reliability
Test Item
Test Conditions
Duration/
Cycle
Number of
Damage
Reference
Temperature Cycle
–40℃ 30min
↑↓25℃(5 min)
100℃ 30min
100 cycles
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JEITA ED-4701
300 303
↑↓5sec
110℃ 30min
100 cycles
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JEITA ED-4701
200 303
Ta=85℃
1000 hrs
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EIAJED-4701
200 201
1000 hrs
0/22
EIAJED-4701
100 103
1000 hrs
0/22
EIAJED-4701
200 202
1000 hrs
0/22
Tested with
Brightek standard
1000 hrs
0/22
Tested with
Brightek standard
1000 hrs
0/22
Tested with
Brightek standard
3 Times
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MIL-STD-883D
–40℃ 30min
Thermal Shock
High Temperature
Storage
Humidity Heat
Storage
Low Temperature
Storage
Ta=85℃
RH=85%
Ta=-40℃
Ta=25℃
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Life Test
High Humidity Heat
Life Test
If=500mA
60℃ RH=90%
If=500mA
Ta=-40℃
Low Temperature
Life Test
If=500mA
ESD(HBM)
1KV at 1.5kΩ;100pf
*Criteria for Judging the Damage
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Item
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0 Forward Voltage
0 Reverse Current
Luminous Intensity
Symbol
Condition
VF
If=350mA
IR
Iv
Criteria for Judgement
MIN
MAX
_
USL*1×1.1
VR=5V
_
100μA
If=350mA
*2
_
LSL ×0.7
1
[Note]* USL: Upper Specification Level
2
* LSL: Lower Specification Level
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 Packing

Tape and Reel
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Trailer 160(min) of empty
Loaded Pockets
Leader 400mm (min) of
pockets sealed with tape
(500 Lamps)
empty pockets sealed with
tape
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NOTES:
Reeled products (numbers of products are 500pcs) packed in a seal off moisture-proof bag along
with a desiccant one by one, five moisture-proof bag of maximums (total maximum number of products
are 2,500pcs) packed in an inside box (size: about 240mm x about 195mm x about 100mm) and four
inside boxes of maximums are put in the outside box (size: about 410mm x about 255mm x about
240mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on
the label on the moisture-proof bag, part No. And quantity should appear on the insertion request form
on the cardboard box.) .
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 Test circuit and handling precautions

Test circuit
V

LED
Handling precautions
1、The following items are recommended when handling LEDs
5.1 The lens of LEDs should not be exposed to dust and debris. Excessive dust and debris may
cause a drastic decrease in light output.
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5.2 Avoid mechanical stress on LED lens
5.3 Do not touch the LED lens surface. It would affect the optical performance of the LED due to
the LED lens’ damage
5.4 Pick & place tool was recommended to use for the remove of LEDs from the factory tape &
reel packaging
2、Pick & Place Nozzle
The pickup tool was recommended and shown as below
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Unit : mm
Tolerance : ±0.1
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3、Lens handling
Please follow the guideline to grab LEDs
3.1 Use tweezers to grab LEDs
3.2 Do not touch lens with the tweezers
3.3 Do not touch lens with fingers
3.4 Do not apply more than 4N of lens (400g) directly onto the lens
Wrong (X)
Correct ( )
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4、Lens cleaning
In the case where a minimal level of dirt and dust particles can’t be guaranteed, a suitable cleaning
solution can be applied to the lens surface
4.1 Try a gentle swabbing using a lint-free swab
4.2 If needed, the use of lint-free swab and isopropyl alcohol used gently removes dirt from the
lens surface.
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4.3 Do not use other solvents as they may directly react with the LED assembly
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4.4 Do not use ultrasonic cleaning that the LED will be damaged
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0 5、Carrier Tape Handling
The following items are recommended when handling the Carrier tape of LEDs
5.1 Do not twist the carrier tape
5.2 The inward bending diameter should not smaller than 6cm for carrier tape.
5.3 Do not bend the tape outward.
<6cm
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