0 Part Number : 1SC3528VGB01MH08 Specification: Documents No.: TC0120A20A07000 BT-35-1011003 Huanhuan.Yi Prepared By: Chece By: Time: 2012/03/16 Customer Confirmation: Features § 3.5mm×2.8mm SMT LED , 1.9mm Thickness. § Low Power Consumption. § Viewing Angle 120°. 0000000000000000000000000000000000000000000000000000000 § Various Colors And Types Available. § Package : 2000 PCS/Reel. § Resin(Mold): Silicone § Dice: Red(AlGaInP) § Pulsed Forward Current 100 mA § Reverse Voltage:5 V § Operating Temperature: -40~ +80℃ § Storage Temperature: -40 ~ +100℃ § Soldering Temperature: 260for10sec℃ Green InGaN Blue InGaN (Duty 1/10, Pulse Width 0.1ms.) 00000000000000 0 0 0 0 0 0 Electrical-Optical Characteristics Parameter Forward Voltage Luminous intensity Wavelength Symbo l Vf Iv d Reverse Current Ta=25 Value JunctionTemperature Electrostatic Discharge Clsaification Test condition Min. Typ. Max. R 1.8 1.9 2.6 V If=20mA G 2.8 3.2 3.8 V If=20mA B 2.8 3.2 3.8 V If=20mA R 160 235 mcd If=20mA G 648 1000 mcd If=20mA B 160 235 mcd If=20mA R 615 630 (nm) If=20mA G 519 534 (nm) If=20mA B 461 476 (nm) If=20mA 10 A Ir 0000000000000000000000000000000000000000000000000000000 Viewing angle Unit 2 Vr=5V 120 Tj If=20mA 110 If=20mA ESD 1000V 10%, Forward Voltage (VF) 0.1V, Wavelength( 1.Luminous intensity (IV) 2.IS standard testing 3. JunctionTemperature R=G=B=110 d) 0.5nm 4. Electrostatic Discharge Clsaification R=G=B=1000V Product Identification Code 00000000000000 0 0 3528 1 S C 0 Type VGB0 1 M H Special white code 0:OEM product 1:Normal Product code Y:All black H:black to brush Cap color Category F:Flash,S:SMD LED type A:PCB top view,B:PCB side view C:PLCC top view D:PLCC side view Size PLCC carrier size in mm, PCB carrier size in inches 08 Lead polarity 0:Normal 1:commonAnode 2:common cathode Dice color 0 0 0 Intensity Bin Limit (IF = 20 mA) Red Green Blue Bin Code Min.(mcd) Max.(mcd) Bin Code Min.(mcd) Max.(mcd) Bin Code Min.(mcd) Max.(mcd) 7 160 200 9 640 800 7 160 200 9 200 250 10 800 1000 8 200 250 9 250 310 11 1000 1250 9 250 310 Tolerance of measurement of luminous intensity is 10%. 0000000000000000000000000000000000000000000000000000000 Color Bin Limit (IF = 20 mA) Red Green Blue Bin Code Min.(nm) Max.(nm) Bin Code Min.(nm) Max.(nm) Bin Code Min.(nm) Max.(nm) 2 615 620 2 519 524 7 461 466 524 529 8 466 471 529 534 9 471 476 3 3 620 625 00000000000000 0 4 4 625 630 0 0 Tolerance of measurement of dominant wavelength is 1 nm. Please check sorting method, We will amend the Bin code to maintain Bin Code centralize . 0 0 0 Optical Characteristics Relative Radiant Power(%) Relative Spectral Power Distribution(Ta=25 ) 100% 80% 60% 40% 20% 0% 350 450 550 650 750 850 0000000000000000000000000000000000000000000000000000000 Wavelength(nm) Relati ve luminous Intensity(%) Typical Spatial Distribution 00000000000000 0 0 0 1.00 0.75 0.50 0.25 0.00 -90 -60 -30 0 -30 -60 -90 Angle(°) R=G=B 0 0 0 Relative Flux vs.Current (Ta=25 ) Relative Luminous Flux 10000 1000 100 10 0 5 0 10 15 20 30 25 0000000000000000000000000000000000000000000000000000000 Forward Current (mA) 00000000000000 0 0 0 Relative Luminous Flux(%) Relative Flux vs.Ambient Temperature 110% 100% 90% 80% 70% 0 20 40 60 80 100 Ambient Temperature(°) 0 0 0 Forward Voltage .Ambient Temperature Forward Voltage 3 .4 3 .2 3 .0 2 .0 1 .8 1 .6 25 85 45 65 A m b ie n t T e m p e ra tu re (°) 0000000000000000000000000000000000000000000000000000000 105 Electrical Characteristics(Ta=25) Forward Current IF(mA) 30 00000000000000 0 0 0 25 20 15 10 5 0 1.5 2 2.5 Forward Voltage VF(V) 0 3 3.5 0 0 Choromaticity Coordinates(wd) Chromaticity Coordinates .Forward Current 620 600 520 500 470 450 420 0 10 20 30 0000000000000000000000000000000000000000000000000000000 40 50 Forward Current (mA) Forward Current IF(mA) Thermal Design 50 40 00000000000000 30 0 0 0 20 10 0 0 20 40 60 80 Ambient Temperature Ta(°C) 100 0 0 0 Outline Dimensions 2 3 2.8 B 4 0.15 G 0.800 R 2.283 3.2 1 2.750 1 B 3.50 1.97 3.15 0.95 G R 0000000000000000000000000000000000000000000000000000000 2 3 4 1.80 Recommend Padlayout 1.6 § All dimensions are in millimeters. Tolerance is ±0.1 unless other specified § Specifications are subject to change without notice. § 0 1.8 2.2 1.8 0.7 00000000000000 0 0 0 0 0 Reflow Profile Reflow Temp/Time IR reflow soldering Profile Lead Free solder IR reflow soldering Profile 0000000000000000000000000000000000000000000000000000000 Lead solder 00000000000000 0 0 0 NOTES: 1. We recommend the reflow temperature 240 (±5 ).the maximum soldering temperature should be limited to 260 . 2. Don’t cause stress to the silicone resin while it is exposed to high temperature. 3. Number of reflow process shall be 1 time. 0 0 0 Test items and results of reliability Test Item Temperature Cycle Test Conditions –40 30min 25 (5 min) 100 30min –40 Thermal Shock 110 30min 5sec 30min Duration/ Cycle Number of Damage Reference 100 cycle 0/22 JEITA ED-4701 300 303 100 cycle 0/22 JEITA ED-4701 200 303 High Temperature Ta=100 1000 hrs Storage Ta=85 Humidity Heat 1000 hrs Storage RH=85% Low Temperature Ta=-40 1000 hrs 0000000000000000000000000000000000000000000000000000000 Storage Life Test High Humidity Heat Life Test Low Temperature Life Test 60 0/22 0/22 0/22 Ta=25 IF=20mA 1000 hrs 0/22 RH=90% IF=20mA 1000 hrs 0/22 Ta=-40 IF=20mA 1000 hrs 0/22 00000000000000 1KV at ESD(HBM) 3 Time 0 1.5kΩ;100pf 0 0 *Criteria for Judging the Damage Item Symbol Condition Forward Voltage Reverse Current Luminous Intensity VF IR Iv IF=20mA VR=5V IF=20mA 0/22 EIAJED-4701 200 201 EIAJED-4701 100 103 EIAJED-4701 200 202 Tested with Brightek standard Tested with Brightek standard Tested with Brightek standard MIL-STD-883D Criteria for Judgement MIN MAX _ _ *2 LSL ×0.7 USL*1×1.1 10μA _ [Note]*1USL:Upper Specification Level *2 LSL: Lower Specification Level 0 0 0 Packing 3528 Single-Color High Performance SMD Top LEDs Packaging Specifications z Dimensions of Reel (Unit: mm) 60±0.50 13±0.2 173±0.10 Unit:mm 9±0.5 Labelposition 12±0.15 2.0±0.05 1.55±0.05 1.75±0.10 z Dimensions of Tape (Unit: mm) 4.0±0.10 4.0±0.10 0.20 8.00±0.10 5.25±0.10 0000000000000000000000000000000000000000000000000000000 2.08 z Arrangement of Tape Empty parts Loaded Parts Empty Parts (min.10) (LED:2000Pcs) (min.40) 00000000000000 0 0 0 Feeding Direction Cover Tape Emboss T ape Conclusion Parts Introduction Parts (Min.40mm) (Min.160mm) NOTES 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing smds is two; 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications; 4. 2,000pcs/Reel 0 0 0 3528 Single-Color High Performance SMD Top LEDs Packaging Specifications z Packaging specifications Reel(2,000pcs) Moisture-poof bag Loble insection request form Inside box Maximums seven reels 0000000000000000000000000000000000000000000000000000000 Loble Outside box Maximums for inside boses NOTES: Reeled products (The most numbers of products are 2,000pcs) packed in a seal off moisture-proof bag along with a desiccant one by one, Seven moisture-proof bag of maximums (total maximum number of products are 14,000pcs) packed in an inside box (size: about 238mm x about 00000000000000 194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about 0 0 410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot 0 No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on theinsection request form on the cardboard box.) . 0 0 0 Test circuit and handling precautions Test circuit V LED Handling precautions 1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause 0000000000000000000000000000000000000000000000000000000 big current change (Burn out will happen). 2.Storage 2.1 It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5 ~30 (41 ~86 ) 2.2 Shelf life in sealed bag: 12 month at 5 ~30 and 60% R.H. after the package is Opened, the products should be used within a week or they should be keeping to stored at 00000000000000 20%R.H. with zip-lock sealed. 0 3.Baking 0 0 It is recommended to baking before soldering when the pack is unsealed after 24hrs. The Conditions are as followings: 3.1 70 3 x 24hrs and 5%RH, taped reel type 3.2 100 3 x 2hrs , bulk type 3.3 130 3 x(15~30min), bulk type 0 0 0 LED Usage and Handling Instructions No.1 soldering A It is not better to be manual soldering B Reflow soldering 1 Soldering according to the following temperature chart is highly recommended 0000000000000000000000000000000000000000000000000000000 2 Soldering paste Use soldering paste with the melting point at 230 No.2 is recommended Collet 00000000000000 (1) Abnormal situation caused by improper setting of collet 0 0 To choose the right collet is the key issue in improving the product’s quality. LED is different 0 from other electronic components, which is not only about electrical output but also for optical output. This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems (2) How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out:. 0 0 0 Outer diameter of collet should be larger than the lighting area Outer diameter of collet Picture 1 √ Picture 2 × 3 How to set the height of collet The reason why for top view SMD, the height of collet before it presses downward will directly affect the quality of products during SMT is that if the collect go down too much, it will press lens and cause the distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed. 0000000000000000000000000000000000000000000000000000000 Picture 3 √ No.3 A Picture 4 × Other points for attention No pressure should be exerted to the epoxy shell of the SMD under high temperature. B Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross 00000000000000 0 out easy to break. 0 0 C LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. No.4 This usage and handling instruction is only for your reference. 0 0