1SC3528VGB01MH08 Time: 2012/03/16 Features Part

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Part Number : 1SC3528VGB01MH08
Specification:
Documents No.:
TC0120A20A07000
BT-35-1011003
Huanhuan.Yi
Prepared By:
Chece By:
Time:
2012/03/16
Customer Confirmation:
Features
§
3.5mm×2.8mm SMT LED , 1.9mm Thickness.
§
Low Power Consumption.
§
Viewing Angle 120°.
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§ Various Colors And Types Available.
§
Package : 2000 PCS/Reel.
§
Resin(Mold): Silicone
§
Dice: Red(AlGaInP)
§
Pulsed Forward Current 100 mA
§
Reverse Voltage:5 V
§
Operating Temperature: -40~ +80℃
§
Storage Temperature: -40 ~ +100℃
§
Soldering Temperature: 260for10sec℃
Green
InGaN
Blue
InGaN
(Duty 1/10, Pulse Width 0.1ms.)
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Electrical-Optical Characteristics
Parameter
Forward Voltage
Luminous intensity
Wavelength
Symbo
l
Vf
Iv
d
Reverse Current
Ta=25
Value
JunctionTemperature
Electrostatic Discharge
Clsaification
Test
condition
Min.
Typ.
Max.
R
1.8
1.9
2.6
V
If=20mA
G
2.8
3.2
3.8
V
If=20mA
B
2.8
3.2
3.8
V
If=20mA
R
160
235
mcd
If=20mA
G
648
1000
mcd
If=20mA
B
160
235
mcd
If=20mA
R
615
630
(nm)
If=20mA
G
519
534
(nm)
If=20mA
B
461
476
(nm)
If=20mA
10
A
Ir
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Viewing angle
Unit
2
Vr=5V
120
Tj
If=20mA
110
If=20mA
ESD
1000V
10%, Forward Voltage (VF)
0.1V, Wavelength(
1.Luminous intensity (IV)
2.IS standard testing
3. JunctionTemperature R=G=B=110
d)
0.5nm
4. Electrostatic Discharge Clsaification R=G=B=1000V
Product Identification Code
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3528
1
S C
0 Type
VGB0
1
M
H
Special white code
0:OEM product
1:Normal Product
code
Y:All black
H:black to brush
Cap color
Category
F:Flash,S:SMD
LED type
A:PCB top view,B:PCB side view
C:PLCC top view D:PLCC side view
Size
PLCC carrier size in mm,
PCB carrier size in inches
08
Lead polarity
0:Normal 1:commonAnode
2:common cathode
Dice color
0
0
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Intensity Bin Limit (IF = 20 mA)
Red
Green
Blue
Bin Code
Min.(mcd)
Max.(mcd)
Bin Code
Min.(mcd)
Max.(mcd)
Bin Code
Min.(mcd)
Max.(mcd)
7
160
200
9
640
800
7
160
200
9
200
250
10
800
1000
8
200
250
9
250
310
11
1000
1250
9
250
310
Tolerance of measurement of luminous intensity is
10%.
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Color Bin Limit (IF = 20 mA)
Red
Green
Blue
Bin Code
Min.(nm)
Max.(nm)
Bin Code
Min.(nm)
Max.(nm)
Bin Code
Min.(nm)
Max.(nm)
2
615
620
2
519
524
7
461
466
524
529
8
466
471
529
534
9
471
476
3
3
620
625
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4
4
625
630
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Tolerance of measurement of dominant wavelength is
‹
1 nm.
Please check sorting method, We will amend the Bin code to maintain Bin Code centralize .
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Optical Characteristics
Relative Radiant Power(%)
Relative Spectral Power Distribution(Ta=25
)
100%
80%
60%
40%
20%
0%
350
450
550
650
750
850
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Wavelength(nm)
Relati ve luminous Intensity(%)
Typical Spatial Distribution
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0
0
1.00
0.75
0.50
0.25
0.00
-90
-60
-30
0
-30
-60
-90
Angle(°) R=G=B
0
0
0
Relative Flux vs.Current (Ta=25
)
Relative Luminous Flux
10000
1000
100
10
0
5
0
10
15
20
30
25
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Forward Current (mA)
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0
0
Relative Luminous Flux(%)
Relative Flux vs.Ambient Temperature
110%
100%
90%
80%
70%
0
20
40
60
80
100
Ambient Temperature(°)
0
0
0
Forward Voltage .Ambient Temperature
Forward Voltage
3 .4
3 .2
3 .0
2 .0
1 .8
1 .6
25
85
45
65
A m b ie n t T e m p e ra tu re (°)
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105
Electrical Characteristics(Ta=25)
Forward Current IF(mA)
30
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0
0
25
20
15
10
5
0
1.5
2
2.5
Forward Voltage VF(V)
0
3
3.5
0
0
Choromaticity Coordinates(wd)
Chromaticity Coordinates .Forward Current
620
600
520
500
470
450
420
0
10
20
30
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40
50
Forward Current (mA)
Forward Current IF(mA)
Thermal Design
50
40
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30
0
0
0
20
10
0
0
20
40
60
80
Ambient Temperature Ta(°C)
100
0
0
0
Outline Dimensions
2
3
2.8
B
4
0.15
G
0.800
R
2.283
3.2
1
2.750
1
B
3.50
1.97
3.15
0.95
G
R
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2
3
4
1.80
Recommend Padlayout
1.6
§
All dimensions are in millimeters.
Tolerance is ±0.1
unless other specified
§
Specifications are subject to change without notice.
§
0
1.8
2.2
1.8
0.7
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Reflow Profile
„ Reflow Temp/Time
IR reflow soldering Profile
Lead Free solder
IR reflow soldering Profile
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Lead
solder
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NOTES:
1. We recommend the reflow temperature 240 (±5 ).the maximum soldering temperature
should be limited to 260 .
2. Don’t cause stress to the silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be 1 time.
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Test items and results of reliability
Test Item
Temperature Cycle
Test Conditions
–40 30min
25 (5 min)
100 30min
–40
Thermal Shock
110
30min
5sec
30min
Duration/
Cycle
Number of
Damage
Reference
100 cycle
0/22
JEITA ED-4701
300 303
100 cycle
0/22
JEITA ED-4701
200 303
High Temperature
Ta=100
1000 hrs
Storage
Ta=85
Humidity Heat
1000 hrs
Storage
RH=85%
Low Temperature
Ta=-40
1000 hrs
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Storage
Life Test
High Humidity Heat
Life Test
Low Temperature
Life Test
60
0/22
0/22
0/22
Ta=25
IF=20mA
1000 hrs
0/22
RH=90%
IF=20mA
1000 hrs
0/22
Ta=-40
IF=20mA
1000 hrs
0/22
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1KV at
ESD(HBM)
3 Time
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1.5kΩ;100pf
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*Criteria for Judging the Damage
Item
Symbol
Condition
Forward Voltage
Reverse Current
Luminous Intensity
VF
IR
Iv
IF=20mA
VR=5V
IF=20mA
0/22
EIAJED-4701
200 201
EIAJED-4701
100 103
EIAJED-4701
200 202
Tested with
Brightek
standard
Tested with
Brightek
standard
Tested with
Brightek
standard
MIL-STD-883D
Criteria for Judgement
MIN
MAX
_
_
*2
LSL ×0.7
USL*1×1.1
10μA
_
[Note]*1USL:Upper Specification Level
*2 LSL: Lower Specification Level
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Packing
3528 Single-Color High Performance SMD Top LEDs Packaging Specifications
z Dimensions of Reel (Unit: mm)
60±0.50
13±0.2
173±0.10
Unit:mm
9±0.5
Labelposition
12±0.15
2.0±0.05
1.55±0.05
1.75±0.10
z Dimensions of Tape (Unit: mm)
4.0±0.10
4.0±0.10
0.20
8.00±0.10
5.25±0.10
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2.08
z Arrangement of Tape
Empty parts
Loaded Parts
Empty Parts
(min.10)
(LED:2000Pcs)
(min.40)
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Feeding Direction
Cover Tape
Emboss T ape
Conclusion Parts
Introduction Parts
(Min.40mm)
(Min.160mm)
NOTES
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of missing smds is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications;
4. 2,000pcs/Reel
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3528 Single-Color High Performance SMD Top LEDs Packaging Specifications
z
Packaging specifications
Reel(2,000pcs)
Moisture-poof bag
Loble
insection request form
Inside box Maximums seven reels
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Loble
Outside box
Maximums for inside
boses
NOTES:
Reeled products (The most numbers of products are 2,000pcs) packed in a seal off
moisture-proof bag along with a desiccant one by one, Seven moisture-proof bag of maximums (total
maximum number of products are 14,000pcs) packed in an inside box (size: about 238mm x about
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194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about
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0 410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot
0 No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should
appear on theinsection request form on the cardboard box.) .
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Test circuit and handling precautions
„ Test circuit
V
LED
„ Handling precautions
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause
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big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5
~30
(41 ~86 )
2.2 Shelf life in sealed bag: 12 month at
5 ~30
and
60% R.H. after the package is
Opened, the products should be used within a week or they should be keeping to stored at
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3.Baking
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It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 70 3
x 24hrs and
5%RH, taped reel type
3.2 100 3
x 2hrs , bulk type
3.3 130 3
x(15~30min), bulk type
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LED Usage and Handling Instructions
No.1 soldering
A It is not better to be manual soldering
B Reflow soldering
1 Soldering according to the following temperature chart is highly recommended
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2 Soldering paste
Use soldering paste with the melting point at 230
No.2
is recommended
Collet
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(1) Abnormal situation caused by improper setting of collet
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To choose the right collet is the key issue in improving the product’s quality. LED is different
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from other electronic components, which is not only about electrical output but also for optical output.
This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height
is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which
will cause the LED fail to light up, light up now and then or other quality problems
(2)
How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of
lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets
fit for different products, please refer to the following pictures cross out:.
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Outer diameter of collet should be
larger than the lighting area
Outer diameter of collet
Picture 1 √
Picture 2 ×
3 How to set the height of collet
The reason why for top view SMD, the height of collet before it presses downward will directly
affect the quality of products during SMT is that if the collect go down too much, it will press lens
and cause the distortion or breaking of gold wire. The setting of collet position should follow the
pictures belowed.
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Picture 3 √
No.3
A
Picture 4 ×
Other points for attention
No pressure should be exerted to the epoxy shell of the SMD under high temperature.
B Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross
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out easy to break.
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C LED should be used as soon as possible when being taken out of the original package, and should
be stored in anti-moisture and anti-ESD package.
No.4
This usage and handling instruction is only for your reference.
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