0 Features § forward current ≦30mA § Wide viewing angle:120° § Operating Temperature -40~80℃ § Storage temperature-40~100℃ § Junction Temperature110℃ § ROHS and REACH-compliant § PACKAGE:2000 PCS/REEL. § Qualified according to JEDEC moisturevity Level 3 § Chip material: InGaN § Reverse Voltage:5V Product Identification Code 0000000000000000000000000000000000000000000000000000000 1 S C 3528 W32E 0 W E 04 Process Type Category 00000000000000 0 0 LED Type 0 Size Special White code PCB module code Cap color Lap polarity Dice wavelength 0 0 0 Electrical-Optical Characteristics（Ta=25℃） Value Parameter Symbol Unit Min. Typ. Max. Test condition Forward Voltage Vf 2.8 3.3 V If=20mA Luminous IV 2050 2250 Mcd If=20mA Lumen Φ 6 6.5 ﹍ lm If=20mA X ﹍ 0.3176 ﹍ ﹍ Y ﹍ 0.3270 ﹍ ﹍ Ir ﹍ ﹍ 10 μA Vr=5V 2θ1/2 ﹍ 120 ﹍ Deg If=20mA Color Rendering Index CRI ﹍ 70 ﹍ % If=20mA Color Temperature CCT ﹍ 6300 ﹍ K If=20mA Wavelength Reverse Current Viewing angle If=20mA 1.Luminous intensity (IV) ±10%, Forward Voltage (VF) ±0.1V, Wavelength(X,Y) ±0.01, CRI±5. 2.IS standard testing 0000000000000000000000000000000000000000000000000000000 Range of bins BinB Bin 2.8-2.9 VF(V) BinI Bin 3.5-3.6 VF(V) Bin6 Bin 00000000000000 0 Iv(mcd) 2050-2250 0 Bin SP 0 WL(nm) BinC BinD BinE BinF BinG BinH 2.9-3.0 3.0-3.1 3.1-3.2 3.2-3.3 3.3-3.4 3.4-3.5 Bin7 Bin8 Bin9 Bin10 2250-2450 2450-2650 2650-2850 2850-3050 SQ SR 0 0 0 Color Coordinate Comparison 0.9 0.37 0.8 0.7 5450K 0.35 0.6 0.5 6000K SP 6650K 0.33 SQ 0.4 7400K 0.3 SR 0.31 0.2 0.1 0 0.29 0.29 0 0.3 0.31 0.32 0.33 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Bin Code X Y X Y X Y X Y SR 0.3011 0.3127 0.305 0.2972 0.3136 0.3095 0.311 0.3276 SQ 0.311 0.3276 0.3136 0.3095 0.3229 0.324 0.3214 0.344 SP 0.3214 0.344 0.3229 0.324 0.3336 0.34 0.334 0.364 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0.34 0 Relative Spectral Power Distribution Relative Radiant Intensity 1.0 0.75 0.5 0.25 0 350 400 450 500 550 600 650 700 750 Relative luminous Intensity(%) Optical Characteristics-1 Typical Spatial Distribution Genealogies angle Wavelength(nm) Relative Luminous Flux .Ambient Temperature Relative Luminous intensity(%) Relative Lumious Flux(%) Relative Luminous Flux .Current 150 125 100 0000000000000000000000000000000000000000000000000000000 75 50 25 0 0 10 5 15 20 25 30 Forward Current (mA) Ambient Temperature(°) Electrical Characteristics Thermal Design Maximum Current(mA) 30 Forward Current IF(mA) 00000000000000 25 0 20 0 15 0 10 5 0 1.5 2 2.5 Forward Voltage VF(V) 3 3.5 Ambient Temperature(°) 0 0 0 Optical Characteristics-2 Light effect VS Current Light effect(%) Relative Forward Voltage(%) Forward Voltage Temperature Ambient Temperature(°) Forward Current (mA) 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 Outline Dimensions 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 § All dimensions are in millimeters. § Tolerance is ±0.1 ㎜ unless other specified § Specifications are subject to change without notice. 0 0 0 Reflow Profile 1.IR reflow soldering Profile Lead Free solder 300 ℃ 250 temperature 10sec. max 1-5℃/sec 2-5℃/sec 230℃ max Pre heating 150-180℃ 200 260℃ max 2-5℃/sec 150 120sec.Max 50sec.max 100 50 25℃ 0 0 50 100 Time 150 200 250 300 sec 2.IR reflow soldering Profile 0000000000000000000000000000000000000000000000000000000 Lead solder 300 ℃ 1-5℃/sec temperature 250 10sec. max 210℃ max Pre heating 150-180℃ 200 240℃ max 2-5℃/sec 2-5℃/sec 150 120sec.Max 50sec.max 100 50 00000000000000 0 0 0 25℃ 0 0 50 100 Time 150 200 250 300 sec NOTES: 1.We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature should be limited to 260℃. 2.Don’t cause stress to the silicone resin while it is exposed to high temperature. 3.Number of reflow process shall be 1 time. 0 0 0 Test circuit and handling precautions Test circuit V LED Handling precautions 1. Over-current-proof 0000000000000000000000000000000000000000000000000000000 Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2.Storage 2.1 It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5℃~30℃(41℉~86℉) 2.2 Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is 00000000000000 Opened, the products should be used within a week or they should be keeping to stored at 0 0 ≦20%R.H. with zip-lock sealed. 0 3.Baking It is recommended to baking before soldering when the pack is unsealed after 24hrs. The Conditions are as followings: 3.1 70±3℃ x 24hrs and ＜5%RH, taped reel type 3.2 100±3℃ x 2hrs , bulk type 3.3 130±3℃ x(15~30min), bulk type It shall be normal to see slight color fading of carrier(light yellow) after baking in process 0 0 0 Packing-1 3527 Single-Color High Performance SMD Top LEDs Packaging Specifications Dimensions of Reel (Unit: mm) 60±0.50 13±0.2 173±0.10 Unit:mm 9±0.5 Labelposition 8.0±0.15 1.75±0.10 Dimensions of Tape (Unit: mm) 0000000000000000000000000000000000000000000000000000000 2.0±0.05 1.55±0.05 0.20 4.0±0.10 1.0 0.10 8.00±0.10 5.25±0.10 4.0±0.10 Arrangement of Tape 00000000000000 0 0 0 Empty parts Loaded Parts Empty Parts (min.10) (LED:2000Pcs) (min.40) Feeding Direction Cover Tape Emboss Tape Conclusion Parts Introduction Parts (Min.40mm) (Min.160mm) NOTES 1. Empty component pockets are sealed with top cover tape; 0 2 .The maximum number of missing smd is two; 0 RS-481 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA specifications; 4. 2,000pcs/Reel 0 Packing-2 3527 Single-Color High Performance SMD Top LEDs Packaging Specifications Packaging specifications Reel(2,000pcs) Moisture-poof bag Loble insection request form 0000000000000000000000000000000000000000000000000000000 Inside box Maximums seven reels Loble Outside box Maximums for inside boses NOTES: Reeled products (The most numbers of products are2,000pcs) packed in a seal off 00000000000000 moisture-proof bag along with a desiccant one by one, Seven moisture-proof bag of maximums 0 0 (total maximum number of products are 14,000pcs) packed in an inside box (size: about 238mm x 0 about 194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on the insertion request form on the cardboard box.) . 0 0 0 Precautions 1、Abnormal situation caused by improper setting of collet To choose the right collet is the key issue in improving the product’s quality. LED is different from other electronic components, which is not only about electrical output but also for optical output. This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2、How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out:. Outer diameter of collet should be larger than the lighting area Outer diameter of collet 0000000000000000000000000000000000000000000000000000000 Picture 1（） Picture 2（×） 3、How to set the height of collet The reason why for top view SMD, the height of collet before it presses downward will directly affect the quality of products during SMT is that if the collect go down too much, it will press lens and cause the distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed. 00000000000000 0 0 0 Picture 3（） Picture 4（×） No.3、Other points for attention A、No pressure should be exerted to the epoxy shell of the SMD under high temperature. B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C、LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. No.4、This usage and handling instruction is only for your reference. 0 0 0 Test items and results of reliability Type Test Item Test Standard Environmental Sequence Temperature Cycle Thermal Shock High Temperature Storage Humidity Heat Storage Test Conditions ↑↓5 min 300 303 ↑↓5sec 200 303 Ta=100℃ 200 201 JEITA ED-4701 Ta=60℃ 100 103 RH=90% Ta=-40℃ 200 202 Ta=25℃ IF=20mA Operation Sequence standard Heat Life Test Brightek 60℃ RH=90% standard Tested with Low Temperature Life Test Brightek 0/50 20 cycle 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 500 hrs 0/22 1000 hrs 0/22 100℃ 15min JEITA ED-4701 Tested with 100 cycle -10℃ 15min JEITA ED-4701 Brightek High Humidity ` 100℃ 30min Tested with Life Test Number of Damaged -40℃ 30min JEITA ED-4701 0000000000000000000000000000000000000000000000000000000 JEITA ED-4701 Low Temperature Storage Note 00000000000000 standard 0 0 0 Judgment criteria of failure for the reliability IF=15mA Ta=-20℃ IF=20mA Measuring items Symbol Measuring conditions Forward voltage Vf(V) IF=20mA Reverse current IR(uA) Vr=5V Judgement criteria for failure Over Over U×1.2 U×2 0 0