0 LTD COMMODITY: SURFACE MOUNT LED SMD SPECIFICATION Part No: 1TC5003Y24H2CF01 ITEM MATERIALS Resin(Mold) Silicon Lens Color Water Transparent Dice AlGaInP Emitted color Yellow Characters § 5.0mm×5.0mm SMT LED , 1.5mm THICKNESS. § LOW POWER CONSUMPTION. § VIEWING ANGLE 120°. § VARIOUS COLORS AND LENS TYPES AVAILABLE. § PACKAGE: 1000 PCS/REEL. Absolute Maximum Ratings（Ta=25℃） Item Symbol Value Unit 0000000000000000000000000000000000000000000000000000000 Power Dissipation/DICE PD 120*3 mW DC Forward Current/DICE IF 30*3 mA Single chip Pulsed Forward Current IFP 100※ mA Reverse Voltage VR 5 V Operating Temperature Topr -30 ~ +80 ℃ Tstg -40 ~ +100 ℃ Tsol 260for5sec△ ℃ 00000000000000 Storage Temperature 0 0 Soldering Temperature 0 ※Duty 1/10, Pulse Width 0.1ms. △Soldering time max 10sec Diode please refer to IF-Ta diagram of curves for the temperature during application 0 0 0 LTD Electrical-Optical Characteristics（Ta=25℃） Value Symbol Parameter Min. Typ. Max. Unit Test condition Forward Voltage Vf 1.7 2.0 2.4 V If=20mA*3 Luminous intensity Iv 1300 1900 ﹍ mcd If=20mA*3 Wavelength X 585 ﹍ If=20mA*3 Reverse Current Ir ﹍ ﹍ 10 μA Vr=5V ﹍ 120 ﹍ Deg If=20mA*3 Viewing angle 2θ 1/2 597 ▲ 1.Luminous intensity (IV) ±10%, Forward Voltage(VF) 0000000000000000000000000000000000000000000000000000000 ±0.1V, Wavelength(λd) ±0.5nM 2.IS standard testing Range of bins Bin Bin1-a Bin1-b Bin1-c Bin1-d Bin1-e Bin2 Bin3 Iv(mcd) 3-6 6-9 9-13 13-20 20-30 30-40 40-55 Bin5 Bin6 Bin7 Bin8 Bin9 Bin10 70-90 90-120 120-160 160-210 210-270 270-350 Bin12 Bin13 Bin14 Bin15 Bin16 Bin17 460-600 600-780 780-1000 1000-1300 1300-1700 1700-2200 Bin19 Bin20 Bin21 Bin22 Bin23 Bin24 2800-3600 3600-4600 4600-6000 6000-7800 Bin4 Bin 00000000000000 0 Iv(mcd) 55-70 Bin11 0 Bin 0 Iv(mcd) 350-460 Bin Bin18 Iv(mcd) 2200-2800 Bin Bin25 7800-10100 10100-13130 Bin26 Iv(mcd) 13130-17000 17000-22100 Bin C D E F WL(nm) 585-588 588-591 591-594 594-597 0 0 0 LTD Outline Dimensions 0.6 3 5 4 5.0 6 0.6 0.2 5 3 1 6 1.1 4 2 1.1 5.0 5.4±0.1 1 2 C1.0 3.34 0.8 1.6 5 20mA 3 20mA 0000000000000000000000000000000000000000000000000000000 20mA 1 45° 3.4 unit:mm 2 4 6 00000000000000 0 0 0 All dimensions are in millimeters. § Tolerance is ±0.1 ㎜ unless other specified § § Specifications are subject to change without notice. 0 0 0 LTD COMMODITY: SURFACE MOUNT CHIP LED SMD SPECIFICATION DEVICE NUMBER: 1TC5003Y24H2CF01 Fig.1 IF-VF(Ta=25℃) Forward Current IF(mA) Relative Luminous Intensity Fig.2 Relative Luminous Intensity-IF(Ta=25℃) Forward Voltage VF(V) Forward Current IF(mA) Fig.4 Relative Luminous Intensity-Ta Fig.3 Wavelength Characteristics (Ta=25℃) Relative Luminous Intensity Relative Luminous Intensity 0000000000000000000000000000000000000000000000000000000 Fig.5 IF-Ta Ambient Temperature Ta (℃) Directive Characteristics（Ta=25℃） Forward Current IF(mA) 00000000000000 0 0 0 Wavelength λ d(nm) Ambient Temperature Ta (℃) 0 0 0 LTD Reflow Profile Reflow Temp/Time 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 NOTES: 1. We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature should be limited to 260℃. 2. Don’t cause stress to the silicone resin while it is exposed to high temperature. 3. Number of reflow process shall be 1 time. 0 0 0 LTD Test circuit and handling precautions Test circuit Handling precautions 0000000000000000000000000000000000000000000000000000000 1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2.Storage 2.1 It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5℃~30℃(41℉~86℉) 2.2 Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is 00000000000000 Opened, the products should be used within a week or they should be keeping to stored at 0 ≦20%R.H. with zip-lock sealed. 0 0 3.Baking It is recommended to baking before soldering when the pack is unsealed after 24hrs. The Conditions are as followings: 3.1 70±3℃ x(12~24hrs) and ＜5%RH, taped reel type 3.2 100±3℃ x(45min~1hr), bulk type 3.3 130±3℃ x(15~30min), bulk type 0 0 0 LTD Test items and results of reliability Environmental Sequence Type Test Item Test Conditions Note Number of Damaged Temperature Cycle -45℃ 30min ↑↓20 min 105℃ 30min 100 cycle 0/22 Thermal Shock -10℃ 15min ↑↓5sec 100℃ 15min 100 cycle 0/22 10 cycle 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 500 hrs 0/22 1000 hrs 0/22 High Humidity Heat Cycle High Temperature Storage 30℃ 65℃ 90%RH 24hrs/1cycle Ta=100℃ 0000000000000000000000000000000000000000000000000000000 Humidity Heat Storage Low Temperature Storage Operation Sequence Life Test High Humidity Heat Life Test 00000000000000 0 Low Temperature Life Test 0 0 Ta=85℃ RH=85% Ta=-40℃ Ta=25℃ IF=60mA 85℃ RH=85% IF=30mA Ta=-20℃ IF=60mA 0 0 0 LTD 5050 Single-Color High Performance SMD Top LEDs Packaging Specifications Feeding Direction Dimensions of Reel (Unit: mm) 0000000000000000000000000000000000000000000000000000000 Dimensions of Tape (Unit: mm) 00000000000000 0 0 0 NOTES 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing smds is two; 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications; 4. 1,000pcs/Reel 0 0 0 LTD LED Usage and Handling Instructions No.1、Soldering： A、It is not better to be manual soldering. B、Reflow soldering： 1、Soldering according to the following temperature chart is highly recommended 0000000000000000000000000000000000000000000000000000000 2、Soldering paste Use soldering paste with the melting point at 230℃ is recommended No.2、Collet 1、Abnormal situation caused by improper setting of collet 00000000000000 To choose the right collet is the key issue in improving the product’s quality. LED is different 0 from other electronic components, which is not only about electrical output but also for optical output. 0 This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height 0 is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2、How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out:. 0 0 0 Outer diameter of collet should be larger than the lighting area Outer diameter of collet Picture 1（） Picture 2（×） 3、How to set the height of collet The reason why for top view SMD, the height of collet before it presses downward will directly affect the quality of products during SMT is that if the collect go down too much, it will press lens and cause the distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed. 0000000000000000000000000000000000000000000000000000000 Picture 3（） Picture 4（×） 00000000000000 0 No.3、Other points for attention 0 A、No pressure should be exerted to the epoxy shell of the SMD under high temperature. 0 B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C、LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. No.4、This usage and handling instruction is only for your reference. 0 0