BAV99L Taiwan Semiconductor Small Signal Product 225mW SMD Switching Diode FEATURES - Fast switching speed - Surface mount device type - Moisture sensitivity level 1 - Matte Tin (Sn) lead finish with Nickel (Ni) underplate - Pb free and RoHS compliant - Packing code with suffix "G" means green compound (halogen-free) SOT-23 MECHANICAL DATA - Case: SOT-23 small outline plastic package - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed: 260oC/10s - Weight: 8 mg (approximately) - Marking code: A7. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL VALUE UNIT PD 225 mW Peak repetitive reverse voltage VRRM 70 V Repetitive peak forward current IFRM 450 mA IO 200 mA IFSM 0.5 A RθJA 556 TJ , TSTG - 55 to + 150 Power dissipation Mean forward current Non-repetitive peak forward surge current Pulse Width=1 s Thermal resistance form junction to ambient Junction and storage temperature range PARAMETER IR = 100 μA Reverse breakdown voltage IF = 50 mA Forward voltage IF = 150 mA Reverse leakage current Junction capacitance Reverse revovery time C/W o C SYMBOL MIN MAX UNIT V(BR) 70 - V - 1.00 - 1.25 VF V VR = 70 V IR - 2.50 μA VR = 0 V, f = 1 MHz CJ - 1.5 pF trr - 6 ns IF = IR = 10 mA, RL = 100 Ω, IRR = 1 mA Document Number: DS_S1502002 o Version: A15 BAV99L Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) Fig. 2 Leakage Current vs. Junction Temperature Fig. 1 Typical Forward Characteristics 10000 100 REVERSE CURRENT (nA) Instantaneous Forward Current (mA) 1000 10 1 0.1 VR=20V Typical 1000 100 10 1 0.01 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 0 20 40 60 80 100 120 140 160 180 200 Junction Temperature (oC) Instantaneous Forward Voltage (V) Fig. 3 Power Dissipation Derating Curve Power Dissipation (mW) 250 200 150 100 50 0 0 25 50 75 100 125 150 Ambient Temperature (oC) Document Number: DS_S1502002 Version: A15 BAV99L Taiwan Semiconductor Small Signal Product ORDER INFORMATION (EXAMPLE) BAV99L RFG Green compound code Packing code Part no. PACKAGE OUTLINE DIMENSIONS SOT-23 Unit (mm) Unit (inch) DIM. Min Max Min Max A 2.70 3.10 0.106 0.122 B 1.10 1.50 0.043 0.059 C 0.30 0.51 0.012 0.020 D 1.78 2.04 0.070 0.080 E 2.10 2.64 0.083 0.104 F 0.89 1.30 0.035 0.051 G 0.55 REF 0.022 REF H 0.10 REF 0.004 REF Unit (mm) Unit (inch) Z TYP 2.90 TYP 0.114 X 0.80 0.031 Y 0.90 0.035 C 2.00 0.079 E 1.35 0.053 SUGGEST PAD LAYOUT DIM. Document Number: DS_S1502002 Version: A15 BAV99L Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1502002 Version: A15