BAS40 / -04 / -05 / -06 Taiwan Semiconductor Small Signal Product Low VF SMD Schottky Barrier Diode FEATURES - Metal-on-silicon schottky barrier - Surface device type mounting - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Packing code with suffix "G" means green compound (halogen-free) MECHANICAL DATA SOT-23 - Case: SOT- 23, molded plastic - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed: 260oC/10s - Weight: 0.008g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL VALUE UNIT PD 200 mW VRRM 40 V Reverse Voltage VR 40 V Repetitive Peak Forward Current IFRM 200 mA IO 200 mA IFSM 0.6 Power Dissipation Repetitive Peak Reverse Voltage Mean Forward Current Non-Repetitive Peak Forward Surge Current Thermal Resistance (Junction to Ambient) (Note 1) (Note 2) Junction and Storage Temperature Range PARAMETER Reverse Breakdown Voltage IR=10μA RθJA 357 TJ , TSTG -65 to +125 IF=10mA Junction Capacitance Reverse Recovery Time VR=30V VR=1V, f=1.0MHz IF=IR=10mA, RL=100Ω, IRR=1mA o C MIN MAX UNIT V(BR) 40 - V - 0.38 - 0.50 - 1.00 IR - 0.2 μA CJ - 5.0 pF trr - 5.0 ns VF IF=40mA Reverse Leakage Current C/W SYMBOL IF=1mA Forward Voltage A o V Notes : 1. Test Condition : 8.3ms single half sine-wave superimposed on rated load Notes : 2. Valid provided that electrodes are kept at ambient temperature Document Number: DS_S1412006 Version: F14 BAS40 / -04 / -05 / -06 Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig.1 Power Derating Curve Fig. 2 Maximum Non-Repetitve Peak Forward Surge Current Per Leg Peak Forward Surge Current (mA) PD - Power Dissipation (mW) 200 100 0 0 25 50 75 100 125 600 8.3 ms single half sine wave 300 0 1 10 100 Numbers of Cycles at 60 Hz TA - Ambient Temperature (oC) Fig. 3 Typical Forward Characteristics Fig. 4 Typical Reverse Characteristics 10000 1 IR - Instantaneous Reverse Current (mA) Instantaneous Forward Current (mA) TA=125 °C 0.1 TA= -40 °C TA= 0 °C TA= 25 °C TA=70 °C TA= 125 °C 0.01 0.001 0.0001 0.0 0.2 0.4 0.6 0.8 1.0 1000 TA=70 °C 100 TA=25 °C 10 TA=0 °C 1 TA= -40 °C 0.1 1.2 0 10 VF, Instantaneous Forward Voltage (mV) 20 30 40 VR - Reverse Voltage (V) Fig. 5 Typical Total Capacitance VS. Reverse Voltage Fig. 6 Typical Transient Thermal 100 Junction Capacitance (pF) Transient Thermal Impedance (oC/W) f=1.0MHz 4 2 0 0 5 10 Reverse Voltage (V) Document Number: DS_S1412006 15 20 10 1 0.1 0.01 0.10 1.00 10.00 100.00 Pulse Duration (sec) Version: F14 BAS40 / -04 / -05 / -06 Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. PART NO. PACKING PACKING CODE SUFFIX (Note 1) CODE SUFFIX PACKAGE PACKING 43 BAS40 BAS40-04 BAS40-05 BAS40-06 MARKING -xx RF G SOT-23 3K / 7" Reel 44 45 46 Note 1: Part No. Suffix „-xx “ would be used for special requirement EXAMPLE PREFERRED P/N PART NO. PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX DESCRIPTION Multiple manufacture source BAS40 RF BAS40 RF BAS40 RFG BAS40 RF G Multiple manufacture source Green compound BAS40-D0 RFG BAS40 RF G Define manufacture source Green compound Document Number: DS_S1412006 -D0 Version: F14 BAS40 / -04 / -05 / -06 Taiwan Semiconductor Small Signal Product PACKAGE OUTLINE DIMENSIONS DIM. Unit(mm) Unit(inch) Min Max Min Max A 2.70 3.10 0.106 0.122 B 1.10 1.50 0.043 0.059 C 0.30 0.51 0.012 0.020 D 1.78 2.04 0.070 0.080 E 2.10 2.64 0.083 0.104 F 0.89 1.30 0.035 0.051 G 0.55 REF 0.022 REF H 0.10 REF 0.004 REF Unit(mm) Unit(inch) Typ. Typ. Z 2.8 0.11 X 0.7 0.03 Y 0.9 0.04 C 1.9 0.07 E 1.0 0.04 SUGGEST PAD LAYOUT DIM. PIN CONFIGURATION Document Number: DS_S1412006 Version: F14 BAS40 / -04 / -05 / -06 Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1412006 Version: F14