RT8532 - Richtek

®
RT8532
6-String 43V White LED Driver with Boost Regulator
General Description
Features
The RT8532 is a high efficiency white LED driver. It is
designed for LCD panel that employs a LED array as the
lighting source. An integrated switch current mode Boost
controller drives six strings in parallel and supports up to
10 pieces of LEDs per string. The internal current sinks
support maximum ±2% current matching for excellent
brightness uniformity in each LED string. To provide enough
headroom for the operating of current sink, the Boost
controller monitors the minimum voltage of feedback pins
and regulates an optimized output voltage for power
efficiency.

Wide Input Voltage : VIN 2.5V to 24V

High Output Voltage : VOUT up to 43V
Programmable Full Channel Current from 5mA to
50mA and Matched to 2%
Channel Current Regulation with ±3% Accuracy
Dimming Controls
 Direct PWM Dimming up to 20kHz and Minimum
On-Time to 500ns
 PWM to Mixed Analog and PWM Dimming up to
20kHz with Maximum 9 bit Resolution
Built-In Soft Start to Prevent Inrush Current without
External Capacitor
Disconnects LED in Shutdown
Protection
 Strings Open Detection
 Current Limit Protection
 Programmable Over Voltage Protection
 Over Temperature Protection
20-Lead WQFN Package
RoHS Compliant and Halogen Free


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
The RT8532 has wide input voltage range from 2.5V to
24V and provides adjustable 5mA to 50mA LED current.
The internal 200mΩ, 43V power switch with current-mode
control provides cycle-by-cycle over current protection.
The RT8532 also integrates PWM and analog dimming
functions for accurate LED current control. The input PWM
dimming frequency can be operated operate from 100Hz
to 20kHz without any inrush current in LED.




The RT8532 is available in WQFN-20L 3x3 package.
Applications

UMPC and Notebook Computer Backlight
Simplified Application Circuit
D1
L1
VIN
VOUT
COUT
CIN
Chip Enable
VIN
EN
LX
RT8532
ROVP2
OVP
ROVP1
PWM
MIX
MIX
PWM Signal
COMP
CC
RCOMP
CCOMP
RISET
RFSW
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
LED1
LED2
LED3
LED4
LED5
LED6
ISET
FREQ
AGND PGND
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COVP
:
:
:
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RT8532
Ordering Information
Pin Configurations
RT8532
(TOP VIEW)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :

RoHS compliant and compatible with the current require-
COMP
VIN
VDC
PWM
LX
Package Type
QW : WQFN-20L 3x3 (W-Type)
20 19 18 17 16
EN
FREQ
ISET
MIX
AGND
15
2
14
GND
3
4
13
21
5
12
11
6
7
8
LX
PGND
PGND
OVP
LED1
9 10
LED6
LED5
LED4
LED3
LED2
ments of IPC/JEDEC J-STD-020.

1
Suitable for use in SnPb or Pb-free soldering processes.
WQFN-20L 3x3
Marking Information
89= : Product Code
89=YM
DNN
YMDNN : Date Code
Functional Pin Description
Pin No.
Pin Name
1
EN
2
FREQ
Pin Function
Chip Enable (Active High). There is an internal pull low resistor 400k for the EN pin.
Switching Frequency of Boost Converter Setting. Connect a resistor between this pin
and AGND to set the switching frequency.


25
RFSW  1.1
 6  k  
F
(MHz)
 SW

LED Current Setting. LED current is set by the resistor RISET connected from the
ISET pin to ground.
3
ISET
4
MIX
Dimming Mode Selection. There is an internal pull high 400k resistor connected to
VDC. Floating or pulling high for 25% Mixed mode dimming, pulling low for direct
PWM mode dimming. Recommended to mixed mode for high LED efficiency.
5
AGND
Analog Ground of LED Driver.
LED6 to
LED1
Current Sink for LED String. (Leave the pin unconnected or short to GND, if not
used.)
OVP
Over Voltage Protection Sense Input. The detecting threshold is 1.2V (typ.).
13, 14
PGND
Power Ground of Boost Converter.
15, 16
LX
Switching Pin of Boost Converter.
17
PWM
PWM Dimming Control Input.
18
VDC
Internal Regulator Voltage. Connect a capacitor from this pin to ground.
19
VIN
Power Supply Input.
20
COMP
Compensation Note for Boost Converter. Connect a compensation network to this pin
for stability.
6, 7, 8, 9, 10,
11
12
21
GND
(Exposed Pad)
ILED  mA  
240
RISET k  
Ground. The Exposed Pad must be Soldered to a Large PCB and Connected to GND
for Maximum Power Dissipation.
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DS8532-04 January 2014
RT8532
Function Block Diagram
VIN VDC
FREQ
OVP
+
1.2V
-
OSC
EN
LDO
S
Q
R
Q
LX
OCP
OTP
+
+
PWM
Controller
PGND
+
COMP
PWMO
Generator
PWM-to-DC
6
Mini LED
Selection
LED Open
Detection
MUX
PWM
-
GND
0.6V
MIX
DAC
……
LED1
LED2
LED6
+
+
+
-
-
-
……
+
-
ISET
AGND
Operation
Enable Control
When VIN is higher than the UVLO voltage and EN pin
input voltage is higher than rising threshold, the VDC will
be regulated around 3.8V if VIN is higher than 3.8V.
OSC
The switching frequency is adjustable by the external
resistor connected between the FREQ pin and GND.
MOSFET will be turned off until the temperature is lower
than the 120°C (typically).
OVP
When OVP pin voltage is higher than 1.2V, the LX
N-MOSFET is turned off immediately to protect the LX
N-MOSFET.
Minimum LED Selection
PWM Controller
This controller includes some logic circuit to control LX
N-MOSFET on/off. This block controls the minimum on
time and max duty of LX.
This block detects all LEDx voltage and select a minimum
voltage to EA (Error Amplifier). This function can guarantee
the lowest of LED pin voltage is around 600mV and VOUT
can be boost to the highest forward voltage of LED strings.
OCP & OTP
LED Open Detection
When LX N-MOSFET peak current is higher than 2.5A
(typically), the LX N-MOSFET is turned off immediately
and resumed again at next clock pulse. When the junction
temperature is higher than 150°C (typically), the LX N-
If the voltage at LEDx pin is lower than 100mV, this
channel is defined as open channel and the Minimum LED
Selection function will discard it to regulate other used
channels in proper voltage.
Copyright © 2014 Richtek Technology Corporation. All rights reserved.
DS8532-04 January 2014
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RT8532
Absolute Maximum Ratings




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

(Note 1)
Supply Input Voltage, VIN to GND -----------------------------------------------------------------------------------EN, PWM, ISET, COMP, MIX, FREQ to GND ---------------------------------------------------------------------LX, OVP, LED1 to LED6 to GND --------------------------------------------------------------------------------------LX to GND ------------------------------------------------------------------------------------------------------------------< 500ns ---------------------------------------------------------------------------------------------------------------------VDC to GND ---------------------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
−0.3V to 26.5V
−0.3V to 26.5V
−0.3V to 48V
−0.3V to 48V
−1V to 48V
−0.3V to 7V
WQFN−20L 3x3 -----------------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
WQFN−20L 3x3, θJA -----------------------------------------------------------------------------------------------------WQFN−20L 3x3, θJC -----------------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------Junction Temperature ----------------------------------------------------------------------------------------------------Storage Temperature Range -------------------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Model) ---------------------------------------------------------------------------------------------MM (Machine Model) -----------------------------------------------------------------------------------------------------
1.471W
Recommended Operating Conditions



68°C/W
7.5°C/W
260°C
150°C
−65°C to 150°C
2kV
200V
(Note 4)
Supply Input Voltage, VIN ----------------------------------------------------------------------------------------------- 2.5V to 24V
Junction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = 5V, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
IVIN
PWM = COMP = 0V, Not Switching
--
3
--
IVIN_SW
PWM = COMP = 2V, Switching
--
4
--
VIN Shutdown Current
ISHDN
VIN = 4.5V, EN = 0V
--
--
10
VIN Under Voltage Lockout
Threshold
VUVLO
VIN Rising
--
2.3
--
VIN Falling
--
2.1
--
PWM Dimming Frequency
fPWM
0.1
--
20
VIN Quiescent Current
Unit
mA
A
V
kHz
Control Input
EN, PWM Input High
Voltage
Low
VIH
VIN = 2.5V to 24V
1.3
--
24
VIL
VIN = 2.5V to 24V
--
--
0.5
RFSW = 22k
0.8
1
1.2
RFSW = 51k
0.4
0.5
0.6
VIN > 4.5V
0.18
0.2
0.22
V
Boost Converter
Switching Frequency
LX On Resistance
(N-MOSFET)
fSW
RLX
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MHz

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DS8532-04 January 2014
RT8532
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Minimum On-Time
tON(MIN)
F SW = 1MHz
40
60
80
ns
Maximum Duty
DMAX
F SW = 1MHz
90
93
96
%
LX Current Limit
ILIM
2.2
2.5
2.8
A
Regulated VLEDx
VLEDx
0.5
0.6
0.7
V
3.6
3.8
4
V
19.4
20
20.6
mA
--
--
2
%
Highest LED String, I LED = 20mA
Low Dropout Linear Regulator
LDO Output Voltage Range VDC
LED Current Programming
LED Current Accuracy
ILEDA
2V > VLEDx > 0.5V, RISET = 12k
LED Current Matching
ILEDM
2V > VLEDx > 0.5V, RISET = 12k,
Formulated by (ILEDx  IAVG ) / IAVG x 100%
ISET Pin Voltage
VISET
0.76
1
1.24
V
OVP Threshold
VOVP
1.16
1.2
1.24
V
OVP UVLO Threshold
VOVPF
--
50
--
mV
Thermal Shutdown
Temperature
TSD
--
150
--
C
OTP Hysteresis
TOTP_Hys
--
30
--
C
LED Pin Under Voltage
Threshold
VLSD
--
0.1
--
V
Fault Protection
Un-Connection
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright © 2014 Richtek Technology Corporation. All rights reserved.
DS8532-04 January 2014
is a registered trademark of Richtek Technology Corporation.
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RT8532
Typical Application Circuit
VIN
5V to 24V
L1
10µH
CIN
4.7µF
D1
SS16
R1
10
19 VIN
C1
100nF
Chip Enable
1
17
PWM Signal
15, 16
LX
ROVP2
500k
ROVP1
15k
EN
MIX
PWM
VDC
LED1
LED2
LED3
LED4
LED5
LED6
RCOMP
5.1k
CCOMP
22nF
3 ISET
2 FREQ
RFSW
51k
OVP 12
RT8532
20 COMP
RISET
12k
VOUT
43V MAX
COUT
4.7µF
4
18
COVP
47pF
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
CDC
0.1µF
11
10
9
8
7
6
AGND PGND GND
5
13, 14 21 (Exposed Pad)
Figure 1. For General Application Circuit
L1
10µH
VIN
2.5V to 24V
R1
10
5V
19 VIN
C1
100nF
1
17
15, 16
LX
RT8532
PWM
RCOMP
5.1k
CCOMP
22nF
RISET
12k
3 ISET
2 FREQ
RFSW
51k
OVP 12
MIX
VDC
LED1
LED2
LED3
LED4
LED5
LED6
4
18
on DMAX)
ROVP2
500k
ROVP1
24k
EN
20 COMP
PWM Signal
VOUT
25V MAX
(VOUT depends
COUT
4.7µF
CIN
4.7µF
Chip Enable
D1
SS16
COVP
47pF
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
CDC
0.1µF
11
10
9
8
7
6
AGND PGND GND
5
13, 14 21 (Exposed Pad)
Figure 2. For Low Input Voltage Application Circuit
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DS8532-04 January 2014
RT8532
Typical Operating Characteristics
LED Current vs. Input Voltage
Efficiency vs. Input Voltage
26
100
LED1
LED2
LED3
LED4
LED5
LED6
90
24
Output Current (mA)
80
Efficiency (%)
70
60
50
40
30
20
22
20
18
16
10
9 LEDs per channel, fSW = 500kHz, PWM = 3.3V
54 LEDs, fSW = 500kHz, PWM = 3.3V
14
0
4
8
12
16
20
4
24
8
12
Input Voltage (V)
20
24
VDC vs. Temperature
LED Current vs. Temperature
26
5.0
24
4.5
22
4.0
VDC (V)
LED Current (mA)
16
Input Voltage (V)
20
3.5
18
3.0
16
2.5
9 LEDs per channel, fSW = 500kHz, PWM = 3.3V
9 LEDs per channel, fSW = 500kHz
2.0
14
-50
-25
0
25
50
75
100
-50
125
-25
0
Temperature (°C)
50
75
100
125
LED Current vs. PWM Duty Cycle
fSW vs. RFSW
2000
25
Temperature (°C)
20
9 LEDs per channel
1800
LED Current (mA)
1600
f SW (kHz)
1400
1200
1000
800
600
16
PWM 100Hz
PWM 1kHz
PWM 10kHz
PWM 20kHz
12
8
4
400
9 LEDs per channel, fSW = 500kHz
200
0
0
20
40
60
80
100
120
RFSW (kohm)
(kΩ)
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DS8532-04 January 2014
140
0
20
40
60
80
100
PWM Duty Cycle (%)
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RT8532
Quiescent Current vs. Input Voltage
OVP Threshold Voltage vs. Input Voltage
2.5
Quiescent Current (mA)
OVP Threshold Voltage (V)
1.4
1.3
1.2
1.1
2.3
2.0
1.8
9 LEDs per channel, fSW = 500kHz
Not Switching
1.5
1.0
4
8
12
16
20
3
24
5
8
10
13
15
18
20
Input Voltage (V)
Input Voltage (V)
Line Transient Response
Power On in PWM Mode
23
25
VIN
(10V/Div)
VEN
(5V/Div)
VIN
(10V/Div)
VPWM
(5V/Div)
I LED
(20mA/Div)
VIN = 12V to 18V, fSW = 500kHz, PWM = 3.3V
I LED
(20mA/Div)
Time (2.5ms/Div)
Time (10ms/Div)
Power On from EN
Power On in Mixed Mode
VOUT
(20V/Div)
VIN
(20V/Div)
VEN
(5V/Div)
VPWM
(5V/Div)
VLX
(20V/Div)
VEN
(5V/Div)
I LED
(20mA/Div)
I LED
(20mA/Div)
VIN = 12V, fSW = 500kHz, PWM = 3.3V
Time (10ms/Div)
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VIN = 12V, fSW = 500kHz
VIN = 12V, fSW = 500kHz
Time (10ms/Div)
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DS8532-04 January 2014
RT8532
Application Information
The RT8532 is a general purpose 6-CH LED driver capable
of delivering an adjustable 5mA to 50mA LED current. The
IC is a current mode boost converter integrated with a
43V/2.5A power switch and can cover a wide VIN range
from 2.5V to 24V. The part integrates both built-in softstart and with PWM dimming control; moreover, it provides
over voltage, over temperature and current limiting
protection features. It also integrates PWM and mixed
mode dimming function for accurate LED current control.
The PWM dimming frequency can operate from 100Hz to
20kHz without inducing any inrush current in LED or
inductor.
where fSW is the switching frequency and ΔIL is the inductor
ripple current. Move COUT to the left side to estimate the
value of ΔVOUT1 according to the following equation :
VOUT1 
D  IOUT
  COUT  fSW
Finally, taking ESR into account, the overall output ripple
voltage can be determined by the following equation :
D  IOUT
VOUT  IIN  ESR 
  COUT  fSW
ΔIL
Input Capacitor Selection
Input Current
Low ESR ceramic capacitors are recommended for input
capacitor applications. Low ESR will effectively reduce
the input ripple voltage caused by the switching operation.
Two 2.2μF low ESR ceramic capacitors are sufficient for
most applications. Nevertheless, this value can be
decreased for applications with lower output current
requirement. Another consideration is the voltage rating
of the input capacitor, which must be greater than the
maximum input voltage.
Output Capacitor Selection
Output ripple voltage is an important index for estimating
chip performance. This portion consists of two parts. One
is the product of the inductor current ripple with the ESR
of the output capacitor, while the other part is formed by
the charging and discharging process of the output
capacitor. As shown in Figure 3, ΔVOUT1 can be evaluated
based on the ideal energy equalization. According to the
definition of Q, the Q value can be calculated as the
following equation :
1 
1
1
 

Q    IIN  IL  IOUT    IIN  IL  IOUT  
2 
2
2
 


VIN
1

 COUT  VOUT1
VOUT fSW
Copyright © 2014 Richtek Technology Corporation. All rights reserved.
DS8532-04 January 2014
Inductor Current
Output Current
Time
(1-D)TS
Output Ripple
Voltage (ac)
Time
ΔVOUT1
Figure 3. The Output Ripple Voltage without the
Contribution of ESR
Inductor Selection
The inductor value depends on the maximum input current.
As a general rule the inductor ripple current is 20% to
40% of maximum input current. If 40% is selected as an
example, the inductor ripple current can be calculated
according to the following equation :
IIN(MAX) 
VOUT  IOUT(MAX)
  VIN
IRIPPLE  0.4  IIN(MAX)
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RT8532
where η is the efficiency of the boost converter, IIN(MAX) is
the maximum input current and IRIPPLE is the inductor ripple
current. The input peak current can be obtained by adding
the maximum input current with half of the inductor ripple
current as shown in the following equation :
Setting and Regulation of LED Current
IPEAK = 1.2 x IIN(MAX)
where RISET is the resistor between the ISET pin and GND.
This setting is the reference for the LED current at LED1
to LED6 and represents the sensed LED current for each
string. The DC/DC converter regulates the LED current
according to the setting.
Note that the saturated current of inductor must be greater
than IPEAK. The inductance can eventually be determined
according to the following equation :
   VIN   D   VOUT  VIN 
2
L1 
0.4   VOUT   IOUT  fSW
2
where VOUT is the maximum output voltage, VIN is the
minimum input voltage, fSW is the switching frequency,
and IOUT is the sum of current from all LED strings.
LED Soft-Start Function
The soft-start time of the LED boost converter, defined as
the period from EN to set I OUT, is several tens of
milliseconds according to the difference of PWM or Mixed
mode. The LED starts up after VIN, PWM and EN signals
are all ready. The soft-start inrush peak current must be
less than 2.5A.
LED Driver Compensation
The control loop can be compensated by adjusting the
external components connected to the COMP pin. The
COMP pin is the output of the internal error amplifier. The
compensation capacitors, CC and CCOMP, will adjust the
integrator zero and pole respectively to maintain stability.
Moreover, the resistor, RCOMP, will adjust the mid-band
gain for fast transient response.
Diode Selection
The LED current can be calculated by the following
equation :
240
ILED  mA  
RISET  k 
PWM Mode and Mixed Mode Brightness Dimming
The RT8532 allows two ways of controlling the LED
brightness.
PWM Mode Dimming : When the MIX pin is connected to
GND, the dimming mode operates in PWM Mode. During
the PWM dimming, the current source turn-on/off is
synchronized with the PWM signal. The LED current
frequency is equivalent to PWM input frequency.
Mixed Mode Dimming : If the MIX pin is floating or tied to
VDC, the dimming mode operates in Mixed Mode. In this
mode the PWM and ILED dimming cycle will delay by 2
periods. First cycle delay is required for the period, while
the second cycle delay is for the duty rate calculation.
(a) When 25% ≤ PWM duty ≤ 100%, the current source
outputs are DC dimming, and the PWM duty cycle
modulates the amplitude of the currents.
(b) When PWM Duty < 25%, the DC dimming will translate
to DC-PWM dimming to control the LED current. In this
state, the LED current is fixed at 0.25 x ISET, and the
dimming duty is 4 x PWM duties. The minimum D/A
Converter is 512 steps resolution for ILED regulation.
Schottky diodes D1 are recommended for most
applications because of their fast recovery time and low
forward voltage. Power dissipation, reverse voltage rating,
and pulsating peak current are important parameters for
consideration when making a Schottky diode selection.
Make sure that the diode's peak current rating exceeds
IPEAK and reverse voltage rating exceeds the maximum
output voltage.
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RT8532
Brightness Control
Over Temperature Protection
The RT8532 features the digital dimming control scheme.
A very high contrast ratio true digital PWM dimming can
be achieved by driving PWM pin with a PWM signal and
the recommended PWM frequency is 100Hz to 10kHz.
Dimming frequency can be sufficiently adjusted from
100Hz to 20kHz. However, LED current cannot be 100%
proportional to duty cycle especially for high frequency
and low duty ratio because of physical limitation caused
by inductor rising time. Please refer to Table 1 and Table2.
The RT8532 includes an Over Temperature Protection
(OTP) feature to prevent overheating due to excessive
power dissipation from damaging the device. The OTP
function will shut down LED driver when the junction
temperature exceeds 150°C. It will reactivate the device
when powered on again. To maintain continuous operation,
the junction temperature should be kept below 125°C.
Table 1. Mixed Dimming Mode
Dimming Frequency (Hz) Duty (Min) Duty (Max)
100 < fPWM  200
0.18%
100%
200 < fPWM  500
0.18%
100%
500 < fPWM  1k
0.2%
100%
1k < fPWM  2k
0.2%
100%
2k < fPWM  5k
0.3%
100%
5k < fPWM  10k
0.3%
100%
10k < fPWM  20k
0.6%
100%
LED Driver Over Voltage Protection
The LED driver equips an Over Voltage Protection (OVP)
function. When the voltage at the OVP pin reaches a
threshold of approximately 1.2V, the driver will turn off.
The drivers turn on again once the voltage at OVP drops
below the threshold voltage. Thus, the output voltage can
be clamped at a certain voltage level. This voltage level
can be calculated by the following equation :
 R

VOUT, OVP  VOVP   1  OVP2 
R
OVP1 

where ROVP1 and ROVP2 are the resistors in the voltage
divider connected to the OVP pin. It is suggested to use
500kΩ for ROVP2 to reduce loading effect.
Table 2. PWM Dimming Mode
Dimming Frequency (Hz) Duty (Min) Duty (Max)
LED Channel Open Circuit Protection
100 < fPWM  200
0.02%
100%
200 < fPWM  500
0.02%
100%
500 < fPWM  1k
0.04%
100%
1k < fPWM  2k
0.06%
100%
If at least one channel is in normal operation, the LED
driver will automatically ignore the open channels and
continue to regulate current for the channels in normal
operation.
2k < fPWM  5k
0.15%
100%
5k < fPWM  10k
0.3%
100%
10k < fPWM  20k
0.6%
100%
Note : The minimum duty in Table 1 and Table 2 is based
on the application circuit and does not consider the
deviation of current linearity when fPWM > 10kHz, ILED
may not achieve setting current in duty (min.) due to
different VOUT / VIN ratio at VIN = 12V.
Copyright © 2014 Richtek Technology Corporation. All rights reserved.
DS8532-04 January 2014
Under Voltage Lockout (UVLO)
The UVLO circuit compares the LED driver input voltage
at VIN with the UVLO threshold to ensure the input voltage
is high enough for reliable operation. The 200mV (typ.)
hysteresis prevents supply transients from causing a
shutdown. Once VIN exceeds the UVLO rising threshold,
the LED soft-start will begin after a several ms delay. When
VIN falls below the UVLO falling threshold, the controller
turns off all LED driver functions.
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11
RT8532
Thermal Considerations
Layout Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PCB layout is very important to design power switching
converter circuits. The following layout guide lines should
be strictly followed for best performance of the RT8532.

The power components L1, D1, CIN and COUT must be
placed as close as possible to reduce the ac current
loop. The PCB trace between power components must
be short and wide as possible due to large current flow
through these trace during operation.

Place L1 and D1 as close to LX pins as possible. The
trace should be short and wide as possible.

Place the input capacitor C1 close to VIN pin.

Pin 20 is the compensation point to adjust system
stability. Place the compensation components to pin
20 as close as possible.
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
WQFN-20L 3x3 packages, the thermal resistance, θJA, is
68°C/W on a standard JEDEC 51-7 four-layer thermal test
board. The maximum power dissipation at TA = 25°C can
be calculated by the following formula :
PD(MAX) = (125°C − 25°C) / (68°C/W) = 1.471W for
WQFN-20L 3x3 package
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 4 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
Maximum Power Dissipation (W)1
1.6
Four-Layer PCB
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 4. Derating Curve of Maximum Power Dissipation
Copyright © 2014 Richtek Technology Corporation. All rights reserved.
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12
is a registered trademark of Richtek Technology Corporation.
DS8532-04 January 2014
RT8532
Place the power components as
close as possible. The traces should
be wide and short especially for the
high-current loop.
VIN
Locate the C1
as close to VIN
as possible.
The compensation circuit should be
kept away from the power loops and
should be shielded with a ground
trace to prevent any noise coupling.
GND
CIN
GND
CCOMP
D1
R1
RCOMP
Locate the RISET as close
1
to ISET as possible.
VOUT
20
19
18
17
16
COMP
VIN
VDC
PWM
LX
C1
EN
LX
15
PGND 14
2 FREQ
GND
COUT
L1
GND
RISET
3
ISET
4
MIX
GND
PGND 13
OVP 12
LED1 11
LED6
LED5
LED4
LED3
LED2
5 AGND
6
7
8
9
10
Figure 5. PCB Layout Guide
Copyright © 2014 Richtek Technology Corporation. All rights reserved.
DS8532-04 January 2014
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
13
RT8532
Outline Dimension
1
1
2
2
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.150
0.250
0.006
0.010
D
2.900
3.100
0.114
0.122
D2
1.650
1.750
0.065
0.069
E
2.900
3.100
0.114
0.122
E2
1.650
1.750
0.065
0.069
e
L
0.400
0.350
0.016
0.450
0.014
0.018
W-Type 20L QFN 3x3 Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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DS8532-04 January 2014