EKH06100 / FKH0660 / SKH06100

60V High Current Low RDS(ON)
N ch Trench Power MOSFET
EKH06100 / FKH0660 / SKH06100
Features
Package
TO220
EKH06100
 VDS -------------------------------------------------------- 60 V
 ID ------------------------ 100 A (EKH06100, SKH06100)
 RDS(ON) -------------- 3.8 mΩ typ.(VGS = 10 V, ID = 50 A)
 Built-in Gate protect diode
 100% UIL tested
 RoHS Compliant
TO220F
FKH0660
TO263
SKH06100
(Back side)
D
Applications
(1) (2) (3)
G D S
 Low Voltage DC Motor driver
 Solenoid driver
(1) (2) (3)
G D S
Product Lineup
ID
Products
PD
Equivalent circuit
θj-C
RDS(ON)
(typ.)
(W) (°C/W) (mΩ)
100
1.25
3.8
(1) (2) (3)
G D S
D(2)
Package
EKH06100
(A)
100
FKH0660
60
40
3.13
3.8
TO220F
SKH06100
100
100
1.25
3.6
TO263
TO220
Not to scale
G(1)
S(3)
Absolute Maximum Ratings
 Unless otherwise specified, TA = 25 °C
Rating
Characteristic
Symbol
Drain to Source Voltage
VDSS
Gate to Source Voltage
VGSS
Continuous Drain Current
ID(DC)
Pulsed Drain Current
ID(PULSE)
Continuous Diode Forward Current
Diode Pulse Current
ISD(DC)
ISD(PULSE)
Single Pulse Avalanche Energy
EAS
Maximum avalanche current
IAS
Maximum Power Dissipation
PD
Thermal Resistance
Test conditions
TC = 25 ℃, Package Limited
EKH06100
SKH06100
100
V
± 20
V
60
200
60
PW ≤ 100 µs
Duty cycle ≤ 1 %
200
VDD = 20 V, ILP = ID(DC)
unclamped, Rg = 50 Ω
See Figure 1
300
θj-C
A
A
100 (1)
TC = 25 °C
Unit
60
(1)
PW ≤ 100 µs
Duty cycle ≤1 %
TC = 25 °C, Package Limited
FKH0660
A
A
(2)
mJ
100
60
A
100
40
W
1 .2 5
3 .1 3
°C/W
θj-A
6 2 .5
°C/W
Operating Junction Temperature
Tj
150
°C
Storage Temperature
Tstg
− 55 to 150
°C
(1)
PW ≤ 100 µs
(2)
EKH06100 / SKH06100 : L = 40 μH,
FKH0660 : L = 100 μH
EKH06100 / FKH0660 / SKH06100 Rev.1.0
Aug. 28 2013
SANKEN ELECTRIC CO.,LTD.
1
EKH06100 / FKH0660 / SKH06100
Electrical Characteristics
 Unless otherwise specified, TA = 25 °C
Characteristic
Drain to Source Breakdown
Voltage
Drain to Source Breakdown
Voltage Temp. Coefficient
Drain to Source Leakage Current
Symbol
Test Conditions
ID = 100 μA, VGS = 0 V
V(BR)DSS
Min.
Typ.
Max.
Unit
60
−
−
V
ΔV(BR)DSS
ID = 1 mA, VGS = 0 V
−
50
−
mV/°C
IDSS
VDS = 60 V, VGS = 0 V
−
−
100
µA
Gate to Source Leakage Current
IGSS
VGS = ± 15 V
−
−
±20
µA
Gate Threshold Voltage
Gate Threshold Voltage Temp.
Coefficient
VTH
VDS = 10 V, ID = 1 mA
2.0
−
4.0
V
ΔVTH
VDS = 10 V, ID = 1 mA
−
−9
−
mV/°C
−
3.8
5.0
mΩ
3.6
4.8
mΩ
−
140
−
S
−
11500
−
−
1100
−
−
820
−
VDD ≒30 V
ID = 50 A
RL = 0.6 Ω
VGS = 10 V
−
165
−
−
55
−
−
35
−
VDD ≒30 V
ID = 50 A
RL = 0.6 Ω
VGS = 10 V
Rg = 10 Ω
See Figure 2
−
60
−
−
140
−
−
210
−
−
110
−
VSD
ISD = 100 A, VGS = 0 V
−
1.0
1.5
V
trr
ISD = 100 A
di/dt = 100 A/µs
See Figure 3
−
70
−
ns
−
160
−
ns
Static Drain to Source
On-Resistance
RDS(ON)
Forward Transfer Admittance
|yfs|
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate to Source Charge
Qgs
Gate to Drain Charge
Qgd
Turn-On Delay Time
td(on)
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Diode Forward
Voltage
Source-Drain Diode Reverse
Recovery Time
Source-Drain Diode Recovery
Charge
tr
td(off)
tf
Qrr
EKH06100 / FKH0660 / SKH06100 Rev.1.0
Aug. 28 2013
ID = 50 A
VGS = 10 V
EKH06100
FKH0660
SKH06100
VDS = 10 V, ID = 50 A
VDS = 10 V
VGS = 0 V
F = 1 MHz
SANKEN ELECTRIC CO.,LTD.
pF
nC
ns
2
EKH06100 / FKH0660 / SKH06100
Test Circuit and Waveform
E AS 
V(BR)DSS
1
2
 L  I LP 
2
V(BR)DSS  VDD
V(BR)DSS
IL
VDS
ILp
RG
VDD
VGS
VDS
0V
IL
VDD
(a) Test Circuit
(b) Waveforms
Figure 1 Unclamped Inductive
RL
90%
ID
VGS
VDS
10%
RG
VDD
VGS
90%
VDS
0V
10%
td(on) tr
P.W. = 10 μs
Duty cycle ≤ 1 %
td(off) tf
ton
toff
(a) Test Circuit
(b) Waveforms
Figure 2 Switching Time
D.U.T.
ISD
L
ISD
VDD
RG
trr
0V
VGS
IRM × 90 %
di/dt
0V
IRM
(a) Test Circuit
(b) Waveforms
Figure 3 Diode Reverse Recovery Time
EKH06100 / FKH0660 / SKH06100 Rev.1.0
Aug. 28 2013
SANKEN ELECTRIC CO.,LTD.
3
EKH06100 / FKH0660 / SKH06100
Performance Curves
ID-VGS characteristics (typical)
ID-VDS characteristics (typical)
Tc=25℃
200
10V
VDS-VGS characteristics (typical)
Tc=25℃
200
1
VDS=10V
6V
150
150
100
0.5
VGS =5V
75℃
50
50
25℃
Tc = 125℃
0
0
0
2
4
6
8
ID=100A
VDS (V)
ID (A)
ID (A)
5.5V
100
ID=50A
0
0
10
2
4
6
8
10
0
5
10
VGS (V)
VDS (V)
RDS(on)-ID characteristics (typical)
RDS(on) - Tc characteristics (typical)
10
20
ISD-VSD characteristics (typical)
200
10
VGS=10V
ID=50A
VGS=10V
Tc=125℃
8
15
VGS (V)
8
2
6
4
100
ISD (A)
25℃
4
(mΩ )
6
RDS(on)
RDS(on) (mΩ )
150
75℃
25℃
0
0
50
100
150
75℃
2
0
0
Tc=125℃
50
200
0
25
50
75
100
125
0.0
150
0.5
1.0
Tc (℃)
ID (A)
RDS(on)-ID characteristics (maximum)
VSD (V)
Capacitance-VDS characteristics
(typical)
Tc=25℃
Dynamic Input characteristics (typical)
Tc=150℃
15
Tc=25℃
20
VGS=10V
100000
f=1MHz
f =1MHz
VGS=0V
VDS=30V
ID=50A
Ciss
15
10000
Capacitance (pF)
VGS (V)
10
RDS(on) (mΩ )
1.5
10
5
5
0
0
0
50
100
150
Crss
100
0
200
Coss
1000
50
100
150
200
250
Qg (nC)
ID (A)
0
5
10
15
20
25
VDS (V)
SW time - ID characteristics (typical)
1000
SW time - Rg characteristics (typical)
10000
td(off)
tｒ
tｆ
100
1000
SW time (ns)
SW time (ns)
td(on)
10
Tc=25℃
VDD≒30V
VGS=10V
Rg=5Ω
td(off)
tｒ
100
tｆ
Tc=25℃
VDD≒30V
ID=50A
VGS=10V
td(on)
1
10
1
10
100
1000
1
ID (A)
EKH06100 / FKH0660 / SKH06100 Rev.1.0
Aug. 28 2013
10
100
Rg (Ω)
SANKEN ELECTRIC CO.,LTD.
4
EKH06100 / FKH0660 / SKH06100
Safe Operating Area
EAS - Tc(start) Characteristics
1000
100
ID(pulse)
90
80
EAS (Normalized) (%)
ID (A)
100
10
1
70
60
50
40
30
20
Tc=25℃
1shot
10
0.1
1
10
0
100
25
50
75
100
125
150
VDS (V)
Tch(start) (℃）
EKH06100 / SKH06100
Transient Thermal Resistance - Pulse Width
PD-Ta Characteristics
120
100
1E+0
80
PD (W)
Transient Thermal Impedance (℃/W)
1E+1
1E-1
60
40
VDS=5V
Tc=25℃
1shot
20
Without heatsink
0
1E-2
1E-4
0
1E-3
1E-2
1E-1
1E+0
1E+1
50
1E+2
100
150
Ta (℃)
Pluse Width (s)
FKH0660
Transient Thermal Resistance - Pulse Width
PD-Ta Characteristics
50
40
1E+0
30
PD (W)
Transient Thermal Impedance (℃/W)
1E+1
1E-1
VDS=5V
Tc=25℃
1shot
1E-2
1E-4
20
10
Without heatsink
0
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
Pluse Width (s)
EKH06100 / FKH0660 / SKH06100 Rev.1.0
Aug. 28 2013
SANKEN ELECTRIC CO.,LTD.
0
50
100
150
Ta (℃)
5
EKH06100 / FKH0660 / SKH06100
Package Outline
TO220
1.52
±0.10
0.08
±0.10
NOTES:
1) Dimension is in millimeters.
2) Pin treatment Pb-free. Device composition compliant with the RoHS directive
Marking Diagram
YMW
BAA
EKH06100
Lot Number
Y is the Last digit of the year (0 to 9)
M is the Month (1 to 9, O, N or D)
W is the Week (1st to 5th week of every month)
B expresses Pb free pins
A is the suffix No.
Part Number
EKH06100 / FKH0660 / SKH06100 Rev.1.0
Aug. 28 2013
SANKEN ELECTRIC CO.,LTD.
6
EKH06100 / FKH0660 / SKH06100
Package Outline
TO220F
NOTES:
1) Dimension is in millimeters.
2) Pin treatment Pb-free. Device composition compliant with the RoHS directive
Marking Diagram
FKH0660
Part Number
YMW BAA
Lot Number
Y is the Last digit of the year (0 to 9)
M is the Month (1 to 9, O, N or D)
W is the Week (1st to 5th week of every month)
B expresses Pb free pins
A is the suffix No.
EKH06100 / FKH0660 / SKH06100 Rev.1.0
Aug. 28 2013
SANKEN ELECTRIC CO.,LTD.
7
EKH06100 / FKH0660 / SKH06100
Package Outline
TO263
NOTES:
1) Dimension is in millimeters.
2) Pin treatment Pb-free. Device composition compliant with the RoHS directive
Marking Diagram
YMW
BAA
SKH06100
Lot Number
Y is the Last digit of the year (0 to 9)
M is the Month (1 to 9, O, N or D)
W is the Week (1st to 5th week of every month)
B expresses Pb free pins
A is the suffix No.
Part Number
EKH06100 / FKH0660 / SKH06100 Rev.1.0
Aug. 28 2013
SANKEN ELECTRIC CO.,LTD.
8
EKH06100 / FKH0660 / SKH06100
OPERATING PRECAUTIONS
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely
depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation
range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to
assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric
current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused
due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum
values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power
devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly.
Because reliability can be affected adversely by improper storage environments and handling methods, please
observe the following cautions.
Cautions for Storage
 Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
 Avoid locations where dust or harmful gases are present and avoid direct sunlight.
 Reinspect for rust on leads and solderability of the products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power
surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are
within the ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
 When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce excess stress.
 Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect.
Silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the
products to a heatsink.
Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the
product life, are indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260 Momentive Performance Materials Inc.
SC102
Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
 When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has
an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque.
For mounting the products, the mounting surface flatness should be 0.05mm or less.
 Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to
the products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the
hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That
may stress the products and may cause failures.
 Recommended screw torque:
Package
Recommended Screw Torque
TO-220 , TO-220F
0.490 to 0.686 N・m (5 to 7 kgf・cm)
TO-3P , TO-3PF
0.686 to 0.882 N・m (7 to 9 kgf・cm)
SLA
0.588 to 0.784 N・m (6 to 8 kgf・cm)
 For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal
stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure.
Tightening with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can
be applied and the package may be damaged. Therefore, an electric driver is recommended.
When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten
with the specified torque. When using a power driver, torque control is mandatory.
 Please pay special attention about the slack of the press mold. In case that the hole diameter of the heatsink is less
than 4 mm, it may cause the resin crack at tightening.
EKH06100 / FKH0660 / SKH06100 Rev.1.0
Aug. 28 2013
SANKEN ELECTRIC CO.,LTD.
9
EKH06100 / FKH0660 / SKH06100
Soldering
 When soldering the products, please be sure to minimize the working time, within the following limits:
TO220 and TO220F
• 260 ± 5 °C
10 ± 1 s (Flow, 2 times)
• 380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time)
Soldering should be at a distance of at least 1.5 mm from the body of the products.
TO263
• Reflow
Preheat ; 180 °C / 90 ± 30 s
Solder heating ; 250 °C / 10 ± 1s (260 °C peak, 2 times)
• Soldering iron; 380 ± 10 °C / 3.5 ± 0.5s (1 time)
Electrostatic Discharge
 When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ
of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
 Workbenches where the products are handled should be grounded and be provided with conductive table and floor
mats.
 When using measuring equipment such as a curve tracer, the equipment should be grounded.
 When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent
leak voltages generated by them from being applied to the products.
 The products should always be stored and transported in Sanken shipping containers or conductive containers, or
be wrapped in aluminum foil.
IMPORTANT NOTES
 The contents in this document are subject to changes, for improvement and other purposes, without notice. Make
sure that this is the latest revision of the document before use.
 Application and operation examples described in this document are quoted for the sole purpose of reference for the
use of the products herein and Sanken can assume no responsibility for any infringement of industrial property
rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use.
Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or
implied, as to the products, including product merchantability, and fitness for a particular purpose and special
environment, and the information, including its accuracy, usefulness, and reliability, included in this document.
 Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and
defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at
their own risk, preventative measures including safety design of the equipment or systems against any possible
injury, death, fires or damages to the society due to device failure or malfunction.
 Sanken products listed in this document are designed and intended for the use as components in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring
equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation
equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various
safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment
or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products
herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high
reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly
prohibited.
 When using the products specified herein by either (i) combining other products or materials therewith or (ii)
physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that
may result from all such uses in advance and proceed therewith at your own responsibility.
 Anti radioactive ray design is not considered for the products listed herein.
 Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of
Sanken’s distribution network.
 The contents in this document must not be transcribed or copied without Sanken’s written consent.
EKH06100 / FKH0660 / SKH06100 Rev.1.0
Aug. 28 2013
SANKEN ELECTRIC CO.,LTD.
10