100V, 20A Low RDS(ON) N ch Trench Power MOSFET EKG1020 / FKG1020 Features Package TO220 EKG1020 VDS ------------------------------------------------------ 100 V ID ---------------------------------------------------------- 20 A RDS(ON) --------------- 33 mΩ typ.(VGS = 10 V, ID = 10 A) Built-in Gate protect diode 100 % UIL tested RoHS Compliant TO220F FKG1020 (1) (2) (3) G D S (1) (2) (3) G D S Applications Low Voltage DC Motor driver Solenoid driver Not to scale Equivalent circuit D(2) G(1) S(3) Absolute Maximum Ratings Unless otherwise specified, TA = 25 °C Characteristic Symbol Test conditions Rating EKG1020 FKG1020 Unit Drain to Source Voltage VDSS 100 V Gate to Source Voltage VGSS ± 20 V Continuous Drain Current ID(DC) 20 A 60 A 20 A 60 A 50 mJ 20 A Pulsed Drain Current Continuous Diode Forward Current Diode Pulse Current ID(PULSE) ISD(DC) ISD(PULSE) Single Pulse Avalanche Energy EAS Maximum avalanche current IAS Maximum Power Dissipation PD Thermal Resistance PW ≤ 100 µs Duty cycle ≤1 % PW ≤ 100 µs Duty cycle ≤ 1 % VDD = 20 V, L = 200 µH, ILP = 20 A, unclamped, Rg = 50 Ω, See Figure 1 TC = 25 °C θj-C 55 40 W 2 .2 7 3 .1 3 °C/W θj-A 6 2 .5 °C/W Operating Junction Temperature Tj 150 °C Storage Temperature Tstg − 55 to 150 °C EKG1020/ FKG1020 Rev.1.0 Aug. 28 2013 SANKEN ELECTRIC CO.,LTD. 1 EKG1020 / FKG1020 Electrical Characteristics Unless otherwise specified, TA = 25 °C Characteristic Drain to Source Breakdown Voltage Drain to Source Breakdown Voltage Temp. Coefficient Drain to Source Leakage Current Symbol Test Conditions Min. Typ. Max. Unit V(BR)DSS ID = 1 mA, VGS = 0 V 100 − − V ΔV(BR)DSS ID = 1 mA, VGS = 0 V − 80 − mV/°C IDSS VDS = 100 V, VGS = 0 V − − 100 µA Gate to Source Leakage Current IGSS VGS = ± 20 V − − ±10 µA Gate Threshold Voltage Gate Threshold Voltage Temp. Coefficient VTH VDS = 10 V, ID = 1 mA 1.5 2 .0 2.5 V ΔVTH VDS = 10 V, ID = 1 mA − −6 − mV/°C ID = 10 A, VGS = 10 V − 33 52 ID = 10 A, VGS = 4.5 V − 36 59 VDS = 10 V, ID = 10 A 9 .0 − − − 2200 − − 210 − − 110 − − 45 − − 4 − − 9 − − 15 − − 20 − − 180 − − 90 − − 0.9 1.2 V − 50 − ns − 60 − ns − 90 − nC − 120 − nC Static Drain to Source On-Resistance RDS(ON) Forward Transfer Admittance |yfs| Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Total Gate Charge Qg Gate to Source Charge Qgs Gate to Drain Charge Qgd Turn-On Delay Time td(on) Rise Time Turn-Off Delay Time Fall Time Source-Drain Diode Forward Voltage Source-Drain Diode Reverse Recovery Time Source-Drain Diode Recovery Charge EKG1020/ FKG1020 Rev.1.0 Aug. 28 2013 tr td(off) VDS = 10 V VGS = 0 V F = 1 MHz VDD = 50 V ID = 10 A, VGS = 10 V RL = 5 Ω VDD = 50 V ID = 10 A RL = 5 Ω, Rg = 10 Ω VGS = 10 V , See Figure 3 tf VSD trr Qrr ISD = 20 A, VGS = 0 V ISD = 20 A di/dt = 100 A/µs See Figure 2 ISD = 20 A di/dt = 100 A/µs TC = 150 °C See Figure 2 ISD = 20 A di/dt = 100 A/µs See Figure 2 ISD = 20 A di/dt = 100 A/µs TC = 150 °C See Figure 2 SANKEN ELECTRIC CO.,LTD. mΩ S pF nC ns 2 EKG1020 / FKG1020 Test Circuits and Waveforms E AS V(BR)DSS 1 2 L I LP 2 V(BR)DSS VDD V(BR)DSS IL VDS RG ILp VDD VGS VDS 0V IL VDD (a) Test Circuit (b) Waveform Figure 1 Unclamped Inductive D.U.T. L ISD ISD VDD RG trr 0V IRM × 90 % VGS di/dt 0V IRM (a) Test Circuit (b) Waveform Figure 2 Diode Reverse Recovery Time RL 90% ID VGS VDS RG VGS 10% VDD 90% VDS 0V 10% td(on) tr P.W. = 10 μs Duty cycle ≤ 1 % td(off) tf ton (a) Test Circuit toff (b) Waveform Figure 3 Switching Time EKG1020/ FKG1020 Rev.1.0 Aug. 28 2013 SANKEN ELECTRIC CO.,LTD. 3 EKG1020 / FKG1020 Performance Curves VDS-VGS characteristics (typical) ID-VGS characteristics (typical) ID-VDS characteristics (typical) Tc=25℃ Tc=25℃ VDS=10V 1.5 60 60 10V 50 4.5V 4V 1.0 40 VDS (V) 40 ID (A) ID (A) 3.5V 30 25℃ 20 ID=20A 0.5 20 ID=10A 75℃ 10 VGS =3V 0 0 1 2 ID=5A Tc = 125℃ 0.0 0 3 0 VDS (V) 1 2 3 4 0 5 5 15 20 ISD-VSD characteristics (typical) RDS(ON)-Tc characteristics (typical) VGS (V) RDS(ON)-ID characteristics (typical) 10 VGS (V) ID=10A Tc=25℃ 80 80 60 60 60 VGS=4.5V VGS=10V 20 VGS=10V 40 ISD (A) 40 RDS(ON) (mΩ ) RDS(ON) (mΩ ) 40 VGS=4.5V 20 125℃ 20 75℃ 0 0 20 30 40 50 50 100 150 Tc=150℃ 250 VGS=10V 200 VDS (V) 150 60 12 50 10 40 8 30 6 100 4 20 50 Tc=25℃ VDD≒50V ID=10A 10 2 0 0 0 10 20 30 40 50 0 60 10 20 30 40 50 Qg (nC) ID (A) 0.5 1.0 1.5 Capacitance-VDS caracteristics (typical) VSD (V) Dynamic Input Output Characteristics (typical) RDS(ON)-ID characteristics (maximum) 0 0.0 Tc (℃) ID (A) RDS(ON) Maximum (mΩ ) 0 0 60 10000 Ciss 1000 Capacitance (pF) 10 VGS (V) 0 Tc=25℃ Coss 100 Crss Tc=25℃ VGS＝0V f=1MHz 10 0 10 20 30 40 50 VDS (V) SW time - ID Characteristics (typical) SW time - RG Characteristics (typical) 1000 1000 td(off) 100 SW time (ns) SW time (ns) td(off) tf tr 10 100 tf td(on) 10 Tc=25℃ VDD≒50V ID=10A VGS=10V R Load td(on) Tc=25℃ VDD≒50V RG=10Ω VGS=10V R Load tr 1 1 1 10 RG (Ω) EKG1020/ FKG1020 Rev.1.0 Aug. 28 2013 100 1 10 100 ID (A) SANKEN ELECTRIC CO.,LTD. 4 EKG1020 / FKG1020 Safe Operating Area EAS - Tc(start) Characteristics 100 100 90 EAS (Normalized) (%) 80 ID (A) 10 1 70 60 50 40 30 20 Tc=25℃ Single Pulse 10 0.1 0.1 1 10 VDS (V) 100 0 25 50 75 100 125 150 Tch(start) (℃） EKG1020 PD-Ta Characteristics 60 50 PD (W) 40 30 20 10 Without heatsink 0 0 50 100 150 Ta (℃) FKG1020 PD-Ta Characteristics 50 40 PD (W) 30 20 10 Without heatsink 0 0 50 100 150 Ta (℃) EKG1020/ FKG1020 Rev.1.0 Aug. 28 2013 SANKEN ELECTRIC CO.,LTD. 5 EKG1020 / FKG1020 Package Outline TO220 1.52 ±0.10 0.08 ±0.10 NOTES: 1) Dimension is in millimeters. 2) Pin treatment Pb-free. Device composition compliant with the RoHS directive Marking Diagram YMW BAA EKG1020 Lot Number Y is the Last digit of the year (0 to 9) M is the Month (1 to 9, O, N or D) W is the Week (1st to 5th week of every month) B expresses Pb free pins A is the suffix No. Part Number EKG1020/ FKG1020 Rev.1.0 Aug. 28 2013 SANKEN ELECTRIC CO.,LTD. 6 EKG1020 / FKG1020 Package Outline TO220F NOTES: 1) Dimension is in millimeters. 2) Pin treatment Pb-free. Device composition compliant with the RoHS directive Marking Diagram FKG1020 Part Number YMW BAA Lot Number Y is the Last digit of the year (0 to 9) M is the Month (1 to 9, O, N or D) W is the Week (1st to 5th week of every month) B expresses Pb free pins A is the suffix No. EKG1020/ FKG1020 Rev.1.0 Aug. 28 2013 SANKEN ELECTRIC CO.,LTD. 7 EKG1020 / FKG1020 OPERATING PRECAUTIONS In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. Avoid locations where dust or harmful gases are present and avoid direct sunlight. Reinspect for rust on leads and solderability of the products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are within the ratings specified by Sanken for the products. Remarks About Using Silicone Grease with a Heatsink When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce excess stress. Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. Silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink. Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Momentive Performance Materials Inc. SC102 Dow Corning Toray Co., Ltd. Cautions for Mounting to a Heatsink When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque. For mounting the products, the mounting surface flatness should be 0.05mm or less. Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to the products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That may stress the products and may cause failures. Recommended screw torque: Package Recommended Screw Torque TO-220 , TO-220F 0.490 to 0.686 N・m (5 to 7 kgf・cm) TO-3P , TO-3PF 0.686 to 0.882 N・m (7 to 9 kgf・cm) SLA 0.588 to 0.784 N・m (6 to 8 kgf・cm) For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure. Tightening with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can be applied and the package may be damaged. Therefore, an electric driver is recommended. When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten with the specified torque. When using a power driver, torque control is mandatory. Please pay special attention about the slack of the press mold. In case that the hole diameter of the heatsink is less than 4 mm, it may cause the resin crack at tightening. EKG1020/ FKG1020 Rev.1.0 Aug. 28 2013 SANKEN ELECTRIC CO.,LTD. 8 EKG1020 / FKG1020 Soldering When soldering the products, please be sure to minimize the working time, within the following limits: • 260 ± 5 °C 10 ± 1 s (Flow, 2 times) • 380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time) Soldering should be at a distance of at least 1.5 mm from the body of the products. Electrostatic Discharge When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. When using measuring equipment such as a curve tracer, the equipment should be grounded. When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. The products should always be stored and transported in Sanken shipping containers or conductive containers, or be wrapped in aluminum foil. IMPORTANT NOTES The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a particular purpose and special environment, and the information, including its accuracy, usefulness, and reliability, included in this document. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. Anti radioactive ray design is not considered for the products listed herein. Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network. The contents in this document must not be transcribed or copied without Sanken’s written consent. EKG1020/ FKG1020 Rev.1.0 Aug. 28 2013 SANKEN ELECTRIC CO.,LTD. 9