SLA5222

For partial switching PFC
Integrated IGBT and Diode Bridge Rectifier
SLA5222
Features
Package
 SLA5222 incorporates IGBT and diodes for bridge
rectifier of partial switching PFC, and achieves board
space reduction.
 Low Saturation Voltage IGBT
 Low VF Diode Bridge Rectifier
 Clip Lead is adopted for inner lead
-Low Inductance
-Low Resistance
-High Power Dissipation
-Smoke generation and explosion are less likely to
occur in case of destruction
SLA
(1)
 VCE ------------------------------------------------------ 600 V
 IC-------------------------------------------30 A (TC = 100 °C)
 VCE(sat)----------------------------------------------- 1.3 V typ.
 tf --------------------------------------------------- 170 ns typ.
(7)
Not to scale
Equivalent circuit
(3)
(4)
Applications
For partial switching PFC
 Air conditioner
 Other SMPS
(5)
(1)
(2)
(6)
(7)
Absolute Maximum Ratings
 Unless otherwise specified, TA = 25 °C
Parameter
Symbol
Test conditions
Rating
Unit
Collector to Emitter Voltage
VCES
600
V
Gate to Emitter Voltage
VGE
± 30
V
Continuous Collector Current
IC(DC)
30
A
100
A
5
V/ns
600
V
Pulsed Collector Current
Maximum Collector to Emitter
dv/dt
Diode Peak Reverse Voltage
Diode Forward Current
Diode Peak Surge Forward Current
IC (PULSE)
TC = 25 °C
*1
dv/dt *2
PW ≤ 1ms
Duty cycle ≤ 1 %
TC ≤ 125 °C
Refer to Figure 1
VRM
IF
IFSM
*3
Diode I2t Limiting Value
I2t *4
Maximum Allowable Power
Dissipation
PT *5
Isolation Voltage
VISO
25
A
PW ≤ 10ms,
Half sinewave, 1 shot
200
A
1 ms ≤ PW ≤ 10 ms
200
A2s
No. Fin.
All Element Operation
5
W
All Element Operation
92
W
1500
Vrms
Between fin and all pins
Operating Junction Temperature
TJ
150
°C
Storage Temperature Range
Tstg
− 40 to 150
°C
SLA5222-DS Rev.1.0
Mar. 25, 2014
SANKEN ELECTRIC CO.,LTD.
1
SLA5222
Thermal Characteristics
 Unless otherwise specified, TA = 25 °C
Parameter
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Thermal Resistance
(Junction to Case)
Thermal Resistance
(Junction to Case)
Symbol
Conditions
Min.
Typ.
Max.
Unit
θj-A
All Element Operation
−
−
25
°C/W
θj-C
All Element Operation
−
−
1.36
°C/W
IGBT
1 Element Operation
Diode
1 Element Operation
−
−
3.91
°C/W
−
−
8.33
°C/W
Min.
Typ.
Max.
Unit
θj-C IGBT
θj-C Di
Electrical Characteristics
 Unless otherwise specified, TA = 25 °C
Parameter
IGBT
Collector to Emitter Breakdown
Voltage
Collector to Emitter Leakage
Current
Gate to Emitter Leakage Current
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Collector to Emitter Saturation
Voltage
Symbol
V(BR)CES
IC = 100 μA, VGE = 0 V
600
−
−
V
ICES
VCE = 600 V, VGE = 0 V
−
−
100
µA
IGES
VGE = ± 30 V
−
−
± 500
nA
VGE(TH)
VCE = 10 V, IC = 1 mA
3
−
6
V
ΔVGE(TH)
VCE = 10V, ID = 1 mA
−
8.5
−
mV/°C
VGE = 15 V, IC = 30 A
−
1.3
1.7
V
VGE = 15 V, IC = 50 A
−
1.6
−
V
−
2500
−
−
150
−
−
80
−
−
65
−
−
20
−
−
20
−
−
70
−
−
70
−
−
280
−
tf
−
170
−
td(on)
−
70
−
−
75
−
−
320
−
−
300
−
VCE(sat)
Input Capacitance
Cies
Output Capacitance
Coes
Reverse Transfer Capacitance
Cres
Total Gate Charge
Qg
Gate to Emitter Charge
Qge
Gate to Collector Charge
Qgc
Turn-On Delay Time
td(on)
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Test Conditions
tr
td(off)
tr
td(off)
VCE = 20 V
VGE = 0 V
f = 1.0 MHz
VCE = 300 V
IC = 30 A
VGE = 15 V
TC = 25 °C
Refer to Figure 1
TC = 125 °C
Refer to Figure 1
tf
pF
nC
ns
ns
Diode
Forward Voltage Drop
VF
IF = 12.5 A
−
−
1.1
V
Reverse Leakage Current
IR
VR = 600 V
−
−
50
μA
SLA5222-DS Rev.1.0
Mar. 25, 2014
SANKEN ELECTRIC CO.,LTD.
2
SLA5222
Test Circuits and Waveforms
Clamp Diode
L
RG
VCE
IC
15V
Test conditions
VCE = 300 V
IC = 50 A
VGE = 15 V
RG = 39 Ω
L= 100 μH
VGE
(a) Test Circuit
90%
VGE 10%
VCE
dv/dt
IC
90%
90%
10%
10%
td(on)
td(off)
tr
tf
(b) Waveform
Figure 1 Test Circuits and waveforms of dv/dt and Switching Time
SLA5222-DS Rev.1.0
Mar. 25, 2014
SANKEN ELECTRIC CO.,LTD.
3
SLA5222
Performance Curves
IC - VCE (typical)
IC - VCE (typical)
Tc=25℃
15V 10V
100
Tc=125℃
15V 10V
100
VGE=20V
VGE=20V
8V
8V
80
80
7V
7V
IC (A)
IC (A)
60
40
60
40
6V
20
20
6V
0
0
0
1
2
3
4
0
5
1
2
3
4
5
VCE （V)
VCE （V)
VCE(sat) - Tc (typical)
IC - VGE (typical)
VCE=5V
VGE=15V
3
100
IC=100A
2
50A
IC (A)
VCE(sat) (V)
80
70A
30A
1
10A
60
40
Tc=-40℃
25℃
20
0
１25℃
0
-50
0
50
100
150
0
5
Tc （℃)
Capa - VCE (typical)
15
VCE,VGE - Qg (typical)
Tc=25℃
f=1MHz
VGE＝0V
40
VCE (×10V) , VGE (V)
10000
Capacitance(pF)
10
VGE （V)
Cies
1000
Coes
100
Cres
10
Tc=25℃
RL=6Ω
VCE
30
20
VGE
10
0
0
10
20
30
40
50
0
VCE(V)
SLA5222-DS Rev.1.0
Mar. 25, 2014
20
40
60
80
Qg (nC)
SANKEN ELECTRIC CO.,LTD.
4
SLA5222
VCE - VGE (typical)
VCE - VGE (typical)
Tc=25℃
5
5
4
4
3
3
2
VCE (V)
VCE (V)
Tc=-40℃
IC=100A
2
IC=100A
50A
50A
10A
1
10A
1
0
0
1
10
100
1
10
VGE （V)
100
VGE （V)
VCE - VGE (typical)
Tc=125℃
5
VCE (V)
4
3
IC=100A
2
50A
10A
1
0
1
10
100
VGE （V)
SW Time - IC (typical)
SW Time - IC (typical)
Tc = 125℃
Tc = 25℃
1000
1000
td(off)
SW Time (ns)
SW Time (ns)
td(off)
tf
100
td(on)
tf
100
td(on)
tr
tr
10
10
1
10
100
1
100
IC (A)
IC (A)
SLA5222-DS Rev.1.0
Mar. 25, 2014
10
SANKEN ELECTRIC CO.,LTD.
5
SLA5222
SW Time - RG (typical)
SW Time - RG (typical)
Tc =125℃
Tc = 25℃
1000
1000
td(off)
td(off)
tf
SW Time (ns)
SW Time (ns)
tf
100
tr
100
tr
td(on)
td(on)
10
10
1
10
100
1
10
RG (Ω)
100
RG (Ω)
IF - VF (typical)
100
80
IF (A)
60
40
25℃
20
１25℃
0
0
1
2
3
VF （V)
SAFE OPERATING AREA
Reverse Bias ASO
1000
1000
IC(pulse) max
100
10
10μ s
Tc=25℃
IC [A]
IC [A]
100
Tc=125℃
10
IGBT
Tc=25℃
1shot
1
100μ s
1ms
0.1
1
IGBT
VGE=±15V
Rg=39Ω
1shot
10
100
1000
1
1
100
1000
VCE [V]
VCE [V]
SLA5222-DS Rev.1.0
Mar. 25, 2014
10
SANKEN ELECTRIC CO.,LTD.
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SLA5222
Thermal
Resistance of-IGBT
(pulse
width)
TRANSIENTTransient
THERMAL
RESISTANCE
PULSE
WIDTH
ＩＧＢＴ
1.E+01
Rth j-c (℃/W)
1.E+00
1.E-01
1.E-02
TC = 25
°C
IGBT
VCE Tc=25℃
=5V
1 shot
VCE＝5V
1.E-03
1素子
1shot
1.E-04
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
(sec)
PulsePW
width
(s)
Transient
Thermal Resistance
of one-diode
(pulseWIDTH
width)
TRANSIENT
THERMAL
RESISTANCE
PULSE
Di
1.E+02
Rth j-c (℃/W)
1.E+01
1.E+00
1.E-01
One diode
Di
TC = 25 °C
Tc=25℃
1 shot
1素子
1.E-02
1shot
1.E-03
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
(sec)
PulsePT
width
(s)
SLA5222-DS Rev.1.0
Mar. 25, 2014
SANKEN ELECTRIC CO.,LTD.
7
SLA5222
Package Outline
SLA (LF No. 821)
NOTES:
1) Dimension is in millimeters
2) Pb-free. Device composition compliant with the RoHS directive
Marking Diagram
SLA5222
Part Number
Lot Number
Y is the Last digit of year (0 to 9)
M is the Month (1 to 9, O ,N or D)
DD is the Date (two digit of 01 to 31)
SLA5222-DS Rev.1.0
Mar. 25, 2014
SANKEN ELECTRIC CO.,LTD.
8
SLA5222
OPERATING PRECAUTIONS
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely
depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation
range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to
assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric
current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused
due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum
values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power
devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly.
Because reliability can be affected adversely by improper storage environments and handling methods, please
observe the following cautions.
Cautions for Storage
 Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
 Avoid locations where dust or harmful gases are present and avoid direct sunlight.
 Reinspect for rust on leads and solderability of the products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power
surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are
within the ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
 When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce excess stress.
 Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect.
Silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the
products to a heatsink.
Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the
product life, are indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260 Momentive Performance Materials Inc.
SC102
Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
 When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has
an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque.
For mounting the products, the mounting surface flatness should be 0.05mm or less.
 Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to
the products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the
hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That
may stress the products and may cause failures.
 Recommended screw torque:
Package
Recommended Screw Torque
TO-220, TO-220F
0.490 to 0.686 N・m (5 to 7 kgf・cm)
TO-3P, TO-3PF, TO-247
0.686 to 0.882 N・m (7 to 9 kgf・cm)
SLA
0.588 to 0.784 N・m (6 to 8 kgf・cm)
 For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal
stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure.
Tightening with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can
be applied and the package may be damaged. Therefore, an electric driver is recommended.
When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten
with the specified torque. When using a power driver, torque control is mandatory.
 Please pay special attention about the slack of the press mold. In case that the hole diameter of the heatsink is less
SLA5222-DS Rev.1.0
Mar. 25, 2014
SANKEN ELECTRIC CO.,LTD.
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SLA5222
than 4 mm, it may cause the resin crack at tightening.
Soldering
 When soldering the products, please be sure to minimize the working time, within the following limits:
• 260 ± 5 °C
10 ± 1 s (Flow, 2 times)
• 380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time)
 Soldering should be at a distance of at least 1.5 mm from the body of the products.
Electrostatic Discharge
 When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ
of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
 Workbenches where the products are handled should be grounded and be provided with conductive table and floor
mats.
 When using measuring equipment such as a curve tracer, the equipment should be grounded.
 When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent
leak voltages generated by them from being applied to the products.
 The products should always be stored and transported in Sanken shipping containers or conductive containers, or
be wrapped in aluminum foil.
IMPORTANT NOTES
 The contents in this document are subject to changes, for improvement and other purposes, without notice. Make
sure that this is the latest revision of the document before use.
 Application and operation examples described in this document are quoted for the sole purpose of reference for the
use of the products herein and Sanken can assume no responsibility for any infringement of industrial property
rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use.
 Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or
implied, as to the products, including product merchantability, and fitness for a particular purpose and special
environment, and the information, including its accuracy, usefulness, and reliability, included in this document.
 Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and
defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at
their own risk, preventative measures including safety design of the equipment or systems against any possible
injury, death, fires or damages to the society due to device failure or malfunction.
 Sanken products listed in this document are designed and intended for the use as components in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring
equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation
equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various
safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment
or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products
herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high
reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly
prohibited.
 When using the products specified herein by either (i) combining other products or materials therewith or (ii)
physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that
may result from all such uses in advance and proceed therewith at your own responsibility.
 Anti radioactive ray design is not considered for the products listed herein.
 Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of
Sanken’s distribution network.
 The contents in this document must not be transcribed or copied without Sanken’s written consent.
SLA5222-DS Rev.1.0
Mar. 25, 2014
SANKEN ELECTRIC CO.,LTD.
10